AS4C32M16MD1B-5BIN

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 315 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x9)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time5 nsGradeIndustrial
Clock Frequency200 MHzVoltage1.7V ~ 1.95VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-VFBGA
Mounting MethodVolatileMemory InterfaceLVCMOSMemory Organization32M x 16
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of AS4C32M16MD1B-5BIN - 512Mbit LPDDR1 SDRAM

The AS4C32M16MD1B-5BIN from Alliance Memory is a 512Mbit Low Power DDR SDRAM organized as 32M x 16, providing reliable volatile memory for embedded systems and mobile applications. Built on proven SDRAM-DDR technology, this memory device delivers a 200MHz clock frequency with 5ns access time, making it suitable for applications requiring fast data throughput with power-efficient operation. Its compact 60-FBGA package and wide operating temperature range make it an ideal choice for space-constrained designs in industrial and portable electronics.

Key Features

  • Memory Organization: 512Mbit capacity configured as 32M x 16, providing flexible data width for 16-bit system architectures.
  • High Performance: 200MHz clock frequency with 5ns access time and 15ns write cycle time enables fast read/write operations for data-intensive applications.
  • Low Power Operation: LPDDR1 technology with 1.7V to 1.95V supply voltage reduces power consumption compared to standard DDR, extending battery life in portable devices.
  • LVCMOS Interface: Standard LVCMOS signaling simplifies integration with common microcontrollers and processors.
  • Compact Package: 60-pin VFBGA (8x9mm) package minimizes board space while providing reliable ball grid array connections.
  • Industrial Temperature Range: -40°C to 85°C operating range ensures reliable performance in harsh industrial environments and automotive applications.

Typical Applications

  • Industrial Control Systems: This LPDDR1 SDRAM provides fast, reliable working memory for PLCs, HMIs, and industrial PCs where the extended temperature range ensures consistent operation in factory floor environments subject to temperature extremes.
  • Portable and Handheld Devices: The low power consumption of LPDDR1 technology makes this memory ideal for battery-powered instruments, portable medical devices, and handheld terminals where minimizing current draw extends operational runtime between charges.
  • Embedded Computing Platforms: With its 32M x 16 organization and 200MHz speed, this SDRAM serves as main system memory in embedded Linux systems, IoT gateways, and edge computing devices that require moderate capacity with fast access times.
  • Automotive Infotainment: The -40°C to 85°C temperature tolerance and reliable SDRAM architecture support automotive dashboard displays, navigation systems, and multimedia interfaces operating in vehicle cabin environments.
  • Networking Equipment: This memory provides buffer storage and packet processing memory in routers, switches, and industrial Ethernet devices where the compact FBGA package fits high-density board layouts.

Unique Advantages

  • Power-Efficient Architecture: LPDDR1 technology reduces overall system power consumption compared to standard DDR, lowering thermal design requirements and enabling smaller, more compact product enclosures.
  • Proven Reliability: Volatile DRAM technology provides unlimited read/write cycles without wear-out concerns, ensuring long-term data integrity for systems with frequent memory updates.
  • Simplified Design Integration: Standard LVCMOS interface levels eliminate the need for specialized voltage translators, reducing BOM cost and simplifying PCB layout.
  • Space-Saving Form Factor: The 60-pin FBGA package delivers high memory density in just 72mm² of board space, maximizing available PCB area for other system components.
  • Industrial-Grade Operation: Extended -40°C to 85°C temperature range eliminates the need for thermal protection in many harsh-environment applications, reducing system complexity.
  • Active Lifecycle Status: Current production availability ensures reliable supply for new designs and ongoing manufacturing programs.

Why Choose AS4C32M16MD1B-5BIN?

The AS4C32M16MD1B-5BIN combines the power efficiency of LPDDR1 technology with the performance and reliability needed for industrial and embedded applications. Its 512Mbit capacity and 16-bit data width provide an optimal balance for systems requiring moderate memory density without the complexity or cost of higher-density solutions. The wide temperature range and compact FBGA package make it particularly well-suited for space-constrained industrial designs operating in challenging thermal environments.

For design engineers developing battery-powered instruments, industrial controllers, or embedded computing platforms, this SDRAM offers a proven, cost-effective memory solution with the low power consumption and temperature tolerance that extend product operating life and reduce system-level complexity.

Get a Quote

Contact our sales team to discuss pricing, availability, and volume discounts for the AS4C32M16MD1B-5BIN. Our technical support staff can also assist with design-in questions and provide application guidance to help you successfully integrate this memory into your next project.

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