AS4C32M16MD1B-5BIN
| Part Description |
IC DRAM 512MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 315 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x9) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | LVCMOS | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of AS4C32M16MD1B-5BIN - 512Mbit LPDDR1 SDRAM
The AS4C32M16MD1B-5BIN from Alliance Memory is a 512Mbit Low Power DDR SDRAM organized as 32M x 16, providing reliable volatile memory for embedded systems and mobile applications. Built on proven SDRAM-DDR technology, this memory device delivers a 200MHz clock frequency with 5ns access time, making it suitable for applications requiring fast data throughput with power-efficient operation. Its compact 60-FBGA package and wide operating temperature range make it an ideal choice for space-constrained designs in industrial and portable electronics.
Key Features
- Memory Organization: 512Mbit capacity configured as 32M x 16, providing flexible data width for 16-bit system architectures.
- High Performance: 200MHz clock frequency with 5ns access time and 15ns write cycle time enables fast read/write operations for data-intensive applications.
- Low Power Operation: LPDDR1 technology with 1.7V to 1.95V supply voltage reduces power consumption compared to standard DDR, extending battery life in portable devices.
- LVCMOS Interface: Standard LVCMOS signaling simplifies integration with common microcontrollers and processors.
- Compact Package: 60-pin VFBGA (8x9mm) package minimizes board space while providing reliable ball grid array connections.
- Industrial Temperature Range: -40°C to 85°C operating range ensures reliable performance in harsh industrial environments and automotive applications.
Typical Applications
- Industrial Control Systems: This LPDDR1 SDRAM provides fast, reliable working memory for PLCs, HMIs, and industrial PCs where the extended temperature range ensures consistent operation in factory floor environments subject to temperature extremes.
- Portable and Handheld Devices: The low power consumption of LPDDR1 technology makes this memory ideal for battery-powered instruments, portable medical devices, and handheld terminals where minimizing current draw extends operational runtime between charges.
- Embedded Computing Platforms: With its 32M x 16 organization and 200MHz speed, this SDRAM serves as main system memory in embedded Linux systems, IoT gateways, and edge computing devices that require moderate capacity with fast access times.
- Automotive Infotainment: The -40°C to 85°C temperature tolerance and reliable SDRAM architecture support automotive dashboard displays, navigation systems, and multimedia interfaces operating in vehicle cabin environments.
- Networking Equipment: This memory provides buffer storage and packet processing memory in routers, switches, and industrial Ethernet devices where the compact FBGA package fits high-density board layouts.
Unique Advantages
- Power-Efficient Architecture: LPDDR1 technology reduces overall system power consumption compared to standard DDR, lowering thermal design requirements and enabling smaller, more compact product enclosures.
- Proven Reliability: Volatile DRAM technology provides unlimited read/write cycles without wear-out concerns, ensuring long-term data integrity for systems with frequent memory updates.
- Simplified Design Integration: Standard LVCMOS interface levels eliminate the need for specialized voltage translators, reducing BOM cost and simplifying PCB layout.
- Space-Saving Form Factor: The 60-pin FBGA package delivers high memory density in just 72mm² of board space, maximizing available PCB area for other system components.
- Industrial-Grade Operation: Extended -40°C to 85°C temperature range eliminates the need for thermal protection in many harsh-environment applications, reducing system complexity.
- Active Lifecycle Status: Current production availability ensures reliable supply for new designs and ongoing manufacturing programs.
Why Choose AS4C32M16MD1B-5BIN?
The AS4C32M16MD1B-5BIN combines the power efficiency of LPDDR1 technology with the performance and reliability needed for industrial and embedded applications. Its 512Mbit capacity and 16-bit data width provide an optimal balance for systems requiring moderate memory density without the complexity or cost of higher-density solutions. The wide temperature range and compact FBGA package make it particularly well-suited for space-constrained industrial designs operating in challenging thermal environments.
For design engineers developing battery-powered instruments, industrial controllers, or embedded computing platforms, this SDRAM offers a proven, cost-effective memory solution with the low power consumption and temperature tolerance that extend product operating life and reduce system-level complexity.
Get a Quote
Contact our sales team to discuss pricing, availability, and volume discounts for the AS4C32M16MD1B-5BIN. Our technical support staff can also assist with design-in questions and provide application guidance to help you successfully integrate this memory into your next project.