AS4C32M16D3L-12BCNTR

IC DRAM 512MBIT PARALLEL 96FBGA
Part Description

IC DRAM 512MBIT PARALLEL 96FBGA

Quantity 610 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package96-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeExtended / Automotive-like
Clock Frequency800 MHzVoltage1.283V ~ 1.45VMemory TypeVolatile
Operating Temperature0°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging96-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D3L-12BCNTR - 512Mbit DDR3L SDRAM

The AS4C32M16D3L-12BCNTR from Alliance Memory is a 512Mbit DDR3L SDRAM organized as 32M x 16, delivering reliable, high-speed memory performance with reduced power consumption. Built on proven DDR3 SDRAM technology, this device operates at 800MHz and supports an extended temperature range of 0°C to 95°C (case temperature), making it suitable for industrial and commercial applications requiring stable memory performance across varying environmental conditions.

Key Features

  • 512Mbit Density with 32M x 16 Organization - Provides balanced capacity and data width for efficient memory subsystem design in embedded applications.
  • DDR3L Low Voltage Operation - Operates at 1.283V to 1.45V supply voltage, reducing power consumption compared to standard DDR3 while maintaining full DDR3 performance characteristics.
  • 800MHz Clock Frequency - Delivers 20ns access time for responsive system performance in data-intensive operations.
  • Extended Temperature Range - Rated for 0°C to 95°C case temperature operation, ensuring reliability in industrial environments where ambient temperatures may fluctuate.
  • Compact 96-FBGA Package - The 8mm x 13mm fine-pitch ball grid array package minimizes board space while providing robust electrical connectivity.

Typical Applications

  • Industrial Automation Systems - This DDR3L SDRAM provides reliable memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial computers where extended temperature tolerance ensures consistent operation across factory floor conditions.
  • Network Infrastructure Equipment - The 800MHz operation and parallel interface support high-throughput data buffering in routers, switches, and communication modules where reliable memory performance is critical for network stability.
  • Embedded Computing Platforms - Suitable for single-board computers and embedded modules requiring moderate density volatile memory with low power consumption, particularly in space-constrained designs.
  • Test and Measurement Instruments - The extended temperature rating and stable performance characteristics make this SDRAM appropriate for benchtop and portable test equipment that may operate in varied thermal environments.

Unique Advantages

  • Reduced System Power Budget: DDR3L voltage specification lowers overall power consumption, minimizing heat generation and extending battery life in portable applications.
  • Industrial Temperature Capability: Case temperature rating up to 95°C provides margin for reliable operation in thermally challenging enclosures without requiring aggressive cooling solutions.
  • Standard DDR3 Interface Compatibility: Familiar parallel interface and timing characteristics simplify integration with existing DDR3-compatible memory controllers and reduce design risk.
  • Compact Footprint: The 96-FBGA package delivers high pin density in a small form factor, conserving valuable board space for additional functionality.
  • Active Lifecycle Status: Current production availability supports long-term design commitments and reduces obsolescence concerns for multi-year product lifecycles.

Why Choose AS4C32M16D3L-12BCNTR?

The AS4C32M16D3L-12BCNTR addresses the requirements of industrial and embedded systems that demand reliable DDR3L memory with extended temperature capability. Its combination of 512Mbit density, low voltage operation, and 0°C to 95°C case temperature rating makes it particularly well-suited for applications where standard commercial-grade components may not provide sufficient environmental robustness. The compact FBGA package and industry-standard DDR3 interface enable straightforward integration into both new designs and legacy platform upgrades.

For design teams developing industrial controls, network infrastructure, or embedded computing products with multi-year production horizons, this Alliance Memory DDR3L SDRAM offers a balance of proven technology, active availability, and thermal performance that supports reliable long-term operation.

Get Started

Ready to integrate the AS4C32M16D3L-12BCNTR into your next design? Our team can provide technical support, pricing information, and delivery options tailored to your project requirements. Contact us today to request a quote or discuss your specific memory needs.

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