AS4C32M16D3L-12BCNTR
| Part Description |
IC DRAM 512MBIT PARALLEL 96FBGA |
|---|---|
| Quantity | 610 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 96-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Extended / Automotive-like | ||
| Clock Frequency | 800 MHz | Voltage | 1.283V ~ 1.45V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 96-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16D3L-12BCNTR - 512Mbit DDR3L SDRAM
The AS4C32M16D3L-12BCNTR from Alliance Memory is a 512Mbit DDR3L SDRAM organized as 32M x 16, delivering reliable, high-speed memory performance with reduced power consumption. Built on proven DDR3 SDRAM technology, this device operates at 800MHz and supports an extended temperature range of 0°C to 95°C (case temperature), making it suitable for industrial and commercial applications requiring stable memory performance across varying environmental conditions.
Key Features
- 512Mbit Density with 32M x 16 Organization - Provides balanced capacity and data width for efficient memory subsystem design in embedded applications.
- DDR3L Low Voltage Operation - Operates at 1.283V to 1.45V supply voltage, reducing power consumption compared to standard DDR3 while maintaining full DDR3 performance characteristics.
- 800MHz Clock Frequency - Delivers 20ns access time for responsive system performance in data-intensive operations.
- Extended Temperature Range - Rated for 0°C to 95°C case temperature operation, ensuring reliability in industrial environments where ambient temperatures may fluctuate.
- Compact 96-FBGA Package - The 8mm x 13mm fine-pitch ball grid array package minimizes board space while providing robust electrical connectivity.
Typical Applications
- Industrial Automation Systems - This DDR3L SDRAM provides reliable memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial computers where extended temperature tolerance ensures consistent operation across factory floor conditions.
- Network Infrastructure Equipment - The 800MHz operation and parallel interface support high-throughput data buffering in routers, switches, and communication modules where reliable memory performance is critical for network stability.
- Embedded Computing Platforms - Suitable for single-board computers and embedded modules requiring moderate density volatile memory with low power consumption, particularly in space-constrained designs.
- Test and Measurement Instruments - The extended temperature rating and stable performance characteristics make this SDRAM appropriate for benchtop and portable test equipment that may operate in varied thermal environments.
Unique Advantages
- Reduced System Power Budget: DDR3L voltage specification lowers overall power consumption, minimizing heat generation and extending battery life in portable applications.
- Industrial Temperature Capability: Case temperature rating up to 95°C provides margin for reliable operation in thermally challenging enclosures without requiring aggressive cooling solutions.
- Standard DDR3 Interface Compatibility: Familiar parallel interface and timing characteristics simplify integration with existing DDR3-compatible memory controllers and reduce design risk.
- Compact Footprint: The 96-FBGA package delivers high pin density in a small form factor, conserving valuable board space for additional functionality.
- Active Lifecycle Status: Current production availability supports long-term design commitments and reduces obsolescence concerns for multi-year product lifecycles.
Why Choose AS4C32M16D3L-12BCNTR?
The AS4C32M16D3L-12BCNTR addresses the requirements of industrial and embedded systems that demand reliable DDR3L memory with extended temperature capability. Its combination of 512Mbit density, low voltage operation, and 0°C to 95°C case temperature rating makes it particularly well-suited for applications where standard commercial-grade components may not provide sufficient environmental robustness. The compact FBGA package and industry-standard DDR3 interface enable straightforward integration into both new designs and legacy platform upgrades.
For design teams developing industrial controls, network infrastructure, or embedded computing products with multi-year production horizons, this Alliance Memory DDR3L SDRAM offers a balance of proven technology, active availability, and thermal performance that supports reliable long-term operation.
Get Started
Ready to integrate the AS4C32M16D3L-12BCNTR into your next design? Our team can provide technical support, pricing information, and delivery options tailored to your project requirements. Contact us today to request a quote or discuss your specific memory needs.