AS4C32M16D3L-12BIN

IC DRAM 512MBIT PARALLEL 96FBGA
Part Description

IC DRAM 512MBIT PARALLEL 96FBGA

Quantity 1,292 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package96-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeAutomotive
Clock Frequency800 MHzVoltage1.283V ~ 1.45VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging96-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D3L-12BIN - 512Mb DDR3 SDRAM in Industrial Temperature Range

The AS4C32M16D3L-12BIN from Alliance Memory is a 512-megabit DDR3 SDRAM organized as 32M x 16 bits. This parallel interface memory device operates at 800 MHz clock frequency with 20ns access time, delivering high-bandwidth performance for demanding embedded applications.

Designed with low-voltage operation (1.283V to 1.45V) and an extended operating temperature range of -40°C to 95°C (TC), this SDRAM is well-suited for industrial and rugged environments where reliability under thermal stress is essential.

Key Features

  • Memory Capacity and Organization - 512Mb total density organized as 32M x 16, providing a wide 16-bit data bus for efficient data transfers in embedded systems.
  • DDR3 SDRAM Technology - Leverages DDR3 architecture for double data rate transfers, enabling high-bandwidth memory access at 800 MHz clock frequency.
  • Low-Voltage Operation - Operates on a 1.283V to 1.45V supply voltage, reducing power consumption compared to standard voltage DDR3 devices.
  • Extended Temperature Range - Rated for -40°C to 95°C (TC) operation, supporting deployment in industrial environments with wide ambient temperature variations.
  • Compact 96-FBGA Package - Housed in a 96-VFBGA (8x13mm) package, enabling space-efficient PCB layouts in compact embedded designs.
  • Fast Access Time - 20ns access time supports responsive memory operations for real-time applications.

Typical Applications

  • Industrial Automation - This DDR3 SDRAM provides reliable high-bandwidth memory for PLCs, HMIs, and industrial controllers where the extended temperature range ensures consistent operation in factory floor environments.
  • Embedded Computing - The 32M x 16 organization and parallel interface make this device suitable for embedded processors and SoCs requiring dedicated memory with predictable latency characteristics.
  • Networking Equipment - Supports packet buffering and routing table storage in industrial-grade switches and routers that must operate reliably across wide temperature ranges.
  • Medical Devices - The industrial temperature rating and low-voltage operation support portable and stationary medical equipment requiring dependable memory performance.
  • Transportation Systems - Enables memory solutions for railway, marine, and logistics systems where extended temperature tolerance is critical for outdoor and vehicle-mounted installations.

Unique Advantages

  • Industrial-Grade Reliability: The -40°C to 95°C operating range eliminates the need for additional thermal management in harsh environments, simplifying system design.
  • Power-Efficient DDR3L Operation: Low-voltage operation at 1.283V to 1.45V reduces overall system power consumption and thermal dissipation requirements.
  • High Memory Bandwidth: 800 MHz clock frequency with DDR3 architecture delivers the throughput needed for data-intensive embedded applications.
  • Space-Saving Package: The 96-FBGA form factor (8x13mm) enables compact board layouts without sacrificing memory capacity or performance.
  • Drop-In Compatibility: Standard DDR3 SDRAM interface ensures compatibility with existing DDR3 memory controllers and reference designs.
  • Active Lifecycle Status: Currently in active production, providing long-term availability for designs requiring extended product lifecycles.

Why Choose AS4C32M16D3L-12BIN?

The AS4C32M16D3L-12BIN is an ideal choice for engineers designing industrial and embedded systems that demand reliable DDR3 memory performance across challenging operating conditions. Its combination of 512Mb density, 32M x 16 organization, and industrial temperature rating addresses the needs of applications where commercial-grade components fall short.

For designs requiring long product availability, low power consumption, and proven DDR3 technology in a compact package, this Alliance Memory SDRAM delivers a dependable solution backed by active production status.

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