AS4C32M16D3L-12BIN
| Part Description |
IC DRAM 512MBIT PARALLEL 96FBGA |
|---|---|
| Quantity | 1,292 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 96-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Automotive | ||
| Clock Frequency | 800 MHz | Voltage | 1.283V ~ 1.45V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 96-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16D3L-12BIN - 512Mb DDR3 SDRAM in Industrial Temperature Range
The AS4C32M16D3L-12BIN from Alliance Memory is a 512-megabit DDR3 SDRAM organized as 32M x 16 bits. This parallel interface memory device operates at 800 MHz clock frequency with 20ns access time, delivering high-bandwidth performance for demanding embedded applications.
Designed with low-voltage operation (1.283V to 1.45V) and an extended operating temperature range of -40°C to 95°C (TC), this SDRAM is well-suited for industrial and rugged environments where reliability under thermal stress is essential.
Key Features
- Memory Capacity and Organization - 512Mb total density organized as 32M x 16, providing a wide 16-bit data bus for efficient data transfers in embedded systems.
- DDR3 SDRAM Technology - Leverages DDR3 architecture for double data rate transfers, enabling high-bandwidth memory access at 800 MHz clock frequency.
- Low-Voltage Operation - Operates on a 1.283V to 1.45V supply voltage, reducing power consumption compared to standard voltage DDR3 devices.
- Extended Temperature Range - Rated for -40°C to 95°C (TC) operation, supporting deployment in industrial environments with wide ambient temperature variations.
- Compact 96-FBGA Package - Housed in a 96-VFBGA (8x13mm) package, enabling space-efficient PCB layouts in compact embedded designs.
- Fast Access Time - 20ns access time supports responsive memory operations for real-time applications.
Typical Applications
- Industrial Automation - This DDR3 SDRAM provides reliable high-bandwidth memory for PLCs, HMIs, and industrial controllers where the extended temperature range ensures consistent operation in factory floor environments.
- Embedded Computing - The 32M x 16 organization and parallel interface make this device suitable for embedded processors and SoCs requiring dedicated memory with predictable latency characteristics.
- Networking Equipment - Supports packet buffering and routing table storage in industrial-grade switches and routers that must operate reliably across wide temperature ranges.
- Medical Devices - The industrial temperature rating and low-voltage operation support portable and stationary medical equipment requiring dependable memory performance.
- Transportation Systems - Enables memory solutions for railway, marine, and logistics systems where extended temperature tolerance is critical for outdoor and vehicle-mounted installations.
Unique Advantages
- Industrial-Grade Reliability: The -40°C to 95°C operating range eliminates the need for additional thermal management in harsh environments, simplifying system design.
- Power-Efficient DDR3L Operation: Low-voltage operation at 1.283V to 1.45V reduces overall system power consumption and thermal dissipation requirements.
- High Memory Bandwidth: 800 MHz clock frequency with DDR3 architecture delivers the throughput needed for data-intensive embedded applications.
- Space-Saving Package: The 96-FBGA form factor (8x13mm) enables compact board layouts without sacrificing memory capacity or performance.
- Drop-In Compatibility: Standard DDR3 SDRAM interface ensures compatibility with existing DDR3 memory controllers and reference designs.
- Active Lifecycle Status: Currently in active production, providing long-term availability for designs requiring extended product lifecycles.
Why Choose AS4C32M16D3L-12BIN?
The AS4C32M16D3L-12BIN is an ideal choice for engineers designing industrial and embedded systems that demand reliable DDR3 memory performance across challenging operating conditions. Its combination of 512Mb density, 32M x 16 organization, and industrial temperature rating addresses the needs of applications where commercial-grade components fall short.
For designs requiring long product availability, low power consumption, and proven DDR3 technology in a compact package, this Alliance Memory SDRAM delivers a dependable solution backed by active production status.
Call to Action
Contact our sales team to request a quote for the AS4C32M16D3L-12BIN or to discuss volume pricing and availability for your project requirements.