AS4C32M16D3-10BCNTR

The AS4C32M16D3-10BCNTR from Alliance Memory is a 512-megabit DDR3 SDRAM organized as 32 million words by 16 bits. Operating at 1.5V with a clock frequency of 933 MHz and an access time of 20ns, this memory device delivers high-speed performance for embedded systems and computing applications. The 96-VFBGA package in an 8mm x 13mm footprint offers excellent space efficiency for designs with limited board area.

With an extended commercial temperature range of 0°C to 95°C (case temperature), this DDR3 SDRAM provides reliable operation in industrial and commercial environments where elevated temperatures may occur. The device is currently in Active lifecycle status, ensuring availability for new designs and production.

Key Features

• 512Mb DDR3 SDRAM Core - Organized as 32M x 16, providing a balanced memory configuration suitable for mid-range embedded applications requiring moderate memory capacity with wide data paths.
• 933 MHz Clock Frequency - Enables data transfer rates up to 1866 MT/s, delivering the throughput needed for real-time processing, data buffering, and general-purpose computing tasks.
• 20ns Access Time - Fast memory access supports responsive system performance and reduces latency in read-intensive applications.
• 1.5V Operation - Standard DDR3 voltage range (1.425V to 1.575V) reduces power consumption compared to earlier DDR2 technologies while maintaining compatibility with common power supply designs.
• 96-VFBGA Package - The 8mm x 13mm very fine ball grid array package minimizes PCB footprint, enabling compact designs and high-density memory implementations.
• Extended Commercial Temperature Range - Specified for 0°C to 95°C case temperature operation, making it suitable for applications in industrial environments, enclosed systems, and commercial equipment where ambient temperatures may be elevated.

Typical Applications

• Embedded Computing Systems - This DDR3 SDRAM serves as main memory in single-board computers, industrial PCs, and embedded controllers where 512Mb capacity and extended temperature tolerance provide reliable operation in equipment enclosures and field-deployed systems.
• Networking and Communications Equipment - The device provides buffering and packet processing memory for routers, switches, and telecommunications infrastructure where high-speed memory access supports data throughput and the extended temperature range ensures consistent performance in equipment closets and outdoor cabinets.
• Industrial Control and Automation - In PLCs, HMIs, and process control systems, this SDRAM offers the memory capacity and speed needed for real-time control algorithms, data logging, and user interface functions while operating reliably across commercial and industrial temperature environments.
• Medical and Test Equipment - The device supports data acquisition, signal processing, and display functions in diagnostic instruments and test equipment where moderate memory capacity and stable operation over extended temperature ranges are essential for measurement accuracy and system reliability.

Unique Advantages

• Optimized 32M x 16 Organization: The wide 16-bit data path reduces the number of memory devices required in systems with 16-bit or 32-bit buses, simplifying PCB routing and reducing BOM costs compared to narrower x8 configurations.
• Extended Temperature Tolerance: The 0°C to 95°C case temperature specification eliminates the need for costly temperature management in many industrial applications, reducing system complexity and improving reliability in variable thermal environments.
• Compact 96-VFBGA Footprint: The 8mm x 13mm package delivers 512Mb in minimal board space, enabling designers to maximize memory capacity while preserving PCB area for other critical components or achieving smaller overall product dimensions.
• Active Lifecycle Status: Current production availability ensures that designers can commit to long-term designs with confidence in component supply and eliminates the risk of obsolescence-driven redesigns during the product lifecycle.
• Standard DDR3 1.5V Operation: Compatibility with widely-available DDR3 controllers and power management ICs streamlines design integration and leverages proven reference designs, reducing development time and design risk.
• Alliance Memory Reliability: As a memory specialist, Alliance Memory provides consistent quality, technical support, and product longevity that OEMs rely on for industrial and embedded applications where field failures carry high replacement costs.

Why Choose AS4C32M16D3-10BCNTR?

The AS4C32M16D3-10BCNTR is engineered for embedded and industrial applications where 512Mb of high-speed DDR3 memory must operate reliably in thermally challenging environments. Its 32M x 16 organization provides an efficient match for 16-bit and 32-bit system architectures, while the compact 96-VFBGA package supports space-constrained designs. The extended commercial temperature range of 0°C to 95°C case temperature makes this device particularly well-suited for industrial equipment, networking infrastructure, and enclosed commercial systems where ambient temperatures exceed typical consumer operating conditions.

For design teams developing products with multi-year lifecycles, the Active status and Alliance Memory's focus on embedded and industrial markets provide supply chain confidence. The standard DDR3 interface ensures compatibility with a broad ecosystem of controllers and development tools, enabling faster time-to-market and reduced design risk. Whether you're upgrading an existing design from DDR2 or developing a new platform requiring proven memory technology, the AS4C32M16D3-10BCNTR delivers the performance, reliability, and availability that embedded systems demand.

Get Started with AS4C32M16D3-10BCNTR

Contact our sales team for pricing, lead times, and technical documentation including reference designs and application notes. Our experts can help you evaluate whether the AS4C32M16D3-10BCNTR is the right fit for your specific application requirements and provide guidance on memory controller selection, PCB layout, and signal integrity optimization.