AS4C32M16D2C-25BIN

IC DRAM 512MBIT SSTL 18 84FBGA
Part Description

IC DRAM 512MBIT SSTL 18 84FBGA

Quantity 414 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package84-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeAutomotive
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceSSTL_18Memory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D2C-25BIN - 512Mbit DDR2 SDRAM

The AS4C32M16D2C-25BIN is a 512Mbit DDR2 SDRAM from Alliance Memory, organized as 32M x 16 bits. This volatile memory device operates with an SSTL_18 interface and delivers a 400MHz clock frequency with 4ns access time. With an extended commercial temperature range of -40°C to 95°C (case temperature), this DDR2 SDRAM serves applications requiring reliable memory performance in challenging thermal environments.

Key Features

  • Memory Configuration - 512Mbit capacity organized as 32M x 16 architecture, providing flexible word-wide data access for diverse system designs.
  • DDR2 SDRAM Technology - Utilizes proven DDR2 synchronous dynamic RAM technology for efficient data throughput at 400MHz clock frequency with 15ns write cycle time.
  • Power Supply - Operates on 1.7V to 1.9V supply voltage, aligning with standard DDR2 power requirements for energy-efficient system integration.
  • Interface - SSTL_18 (Stub Series Terminated Logic) interface ensures signal integrity and reliable high-speed data transfer.
  • Extended Temperature Range - Rated for -40°C to 95°C case temperature operation, supporting designs exposed to wide thermal excursions.
  • Compact Package - 84-TFBGA (8mm x 12.5mm) package provides space-efficient board-level integration.

Typical Applications

  • Industrial Automation - This DDR2 SDRAM provides reliable memory buffering for programmable logic controllers (PLCs) and human-machine interfaces where the extended temperature range ensures stable operation in factory floor environments subject to thermal stress.
  • Networking Equipment - The 512Mbit capacity and 400MHz clock frequency support packet buffering and data routing in switches, routers, and telecommunications infrastructure operating in temperature-variable equipment closets.
  • Embedded Computing Systems - Serves as main or auxiliary memory in embedded platforms requiring moderate density and speed, particularly in applications deployed outdoors or in non-climate-controlled enclosures.
  • Test and Measurement Instruments - Provides data acquisition buffering and waveform storage in portable or benchtop instruments where compact packaging and temperature tolerance are essential.
  • Medical Devices - Supports diagnostic equipment and patient monitoring systems where reliable memory operation across temperature variations contributes to device dependability.

Unique Advantages

  • Proven DDR2 Ecosystem Compatibility: Leverages mature DDR2 controller IP and design practices, reducing development risk and accelerating time-to-market for new platforms.
  • Extended Temperature Resilience: The -40°C to 95°C case temperature rating reduces the need for costly thermal management in systems deployed in harsh or variable environments.
  • Balanced Density and Speed: 512Mbit capacity and 400MHz operation provide a practical balance for embedded applications without the complexity or power demands of higher-speed or larger-density alternatives.
  • Compact Footprint: The 84-FBGA package minimizes PCB area consumption, supporting higher integration density in space-constrained designs.
  • Flexible Word Organization: The 32M x 16 configuration aligns naturally with 16-bit or 32-bit processor architectures, simplifying memory subsystem design.
  • Reliable Alliance Memory Source: Alliance Memory provides long-term product availability and stable supply, supporting extended product lifecycles common in industrial and embedded markets.

Why Choose AS4C32M16D2C-25BIN?

The AS4C32M16D2C-25BIN is positioned for embedded and industrial applications where DDR2 SDRAM technology delivers an optimal combination of performance, power efficiency, and ecosystem maturity. Its extended temperature range makes it particularly well-suited for designs deployed in non-office environments—from factory automation to outdoor networking infrastructure—where conventional commercial-grade memory would require additional thermal management. The 512Mbit density addresses moderate data buffering and processing needs without the cost or complexity of gigabit-class devices.

For system architects seeking stable, proven memory technology backed by a supplier committed to long product lifecycles, the AS4C32M16D2C-25BIN offers a reliable foundation. Its compatibility with widely available DDR2 controller IP and its thermal resilience combine to reduce both design risk and total system cost in demanding applications.

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Contact our sales team to discuss your memory requirements and receive pricing information for the AS4C32M16D2C-25BIN. Our technical support staff can assist with integration guidance and volume availability to support your project timelines.

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