AS4C32M16D3-10BCN

IC DRAM 512MBIT PARALLEL 96FBGA
Part Description

IC DRAM 512MBIT PARALLEL 96FBGA

Quantity 589 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package96-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeExtended / Automotive-like
Clock Frequency933 MHzVoltage1.425V ~ 1.575VMemory TypeVolatile
Operating Temperature0°C ~ 95°C (TC)Write Cycle Time Word Page15 nsPackaging96-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D3-10BCN - 512Mbit DDR3 SDRAM

The AS4C32M16D3-10BCN from Alliance Memory is a 512Mbit DDR3 SDRAM device organized as 32M x 16. This high-performance memory solution operates at clock frequencies up to 933MHz, delivering reliable data storage and rapid access times of 20ns for demanding embedded applications. With an extended commercial temperature range of 0°C to 95°C (case temperature), this DDR3 SDRAM provides robust operation across diverse industrial and commercial environments.

Key Features

  • DDR3 SDRAM Technology - Utilizes industry-standard DDR3 architecture, offering high-speed data transfer rates and improved power efficiency compared to previous SDRAM generations.
  • Memory Configuration - 512Mbit total capacity arranged as 32M x 16 organization, providing flexible integration options for system memory designs requiring moderate density and 16-bit data width.
  • Clock Frequency - Operates at 933MHz clock frequency, supporting high-bandwidth data transfers for applications requiring fast memory access and throughput.
  • Access Time - Features 20ns access time with 15ns write cycle time, enabling rapid read and write operations for time-critical applications.
  • Power Supply - Operates on 1.425V to 1.575V supply voltage, conforming to DDR3 low-voltage standards for reduced power consumption.
  • Package - Available in compact 96-FBGA (8x13mm) package, offering space-efficient board layout options for size-constrained designs.
  • Extended Temperature Range - Operates reliably from 0°C to 95°C case temperature, suitable for applications in controlled environments and many commercial installations.

Typical Applications

  • Embedded Computing Systems - This DDR3 SDRAM serves as main memory in embedded processors and SoCs where 512Mbit capacity and 933MHz operation provide sufficient bandwidth for real-time control applications and data processing tasks.
  • Networking Equipment - The memory supports packet buffering and routing table storage in switches and routers where fast access times ensure low latency in data forwarding operations.
  • Digital Signage and Display Controllers - Provides frame buffer memory for graphics controllers driving high-definition displays, where the 16-bit organization and high clock frequency enable smooth video playback and content rendering.
  • Industrial Control Systems - Supports data acquisition systems and programmable logic controllers where the extended temperature range ensures stable operation in factory automation environments.
  • Communication Infrastructure - Functions as working memory in telecommunications equipment and base stations where reliable operation and moderate capacity meet system requirements.

Unique Advantages

  • Industry-Standard DDR3 Interface: Ensures compatibility with a wide range of microprocessors, FPGAs, and memory controllers, simplifying design integration and reducing development time.
  • Extended Commercial Temperature Operation: The 0°C to 95°C case temperature range provides reliable performance in controlled commercial environments and many industrial settings without requiring expensive industrial-grade components.
  • Compact Footprint: The 96-FBGA package measuring 8x13mm minimizes board space requirements, enabling higher component density and smaller overall product form factors.
  • Proven Technology Platform: DDR3 SDRAM represents a mature, widely-adopted memory standard with extensive ecosystem support, broad availability, and predictable long-term supply.
  • Balanced Performance and Power: Operating voltage of 1.425V to 1.575V delivers significant power savings compared to DDR2 while maintaining high performance, reducing overall system power consumption and thermal management requirements.
  • Active Lifecycle Status: As an actively manufactured component, this device offers confidence for new designs and ongoing production with reliable supply chain support.

Why Choose AS4C32M16D3-10BCN?

The AS4C32M16D3-10BCN delivers a proven DDR3 SDRAM solution for embedded and commercial applications requiring moderate memory density with high-speed operation. Its combination of 933MHz clock frequency, compact 96-FBGA package, and extended commercial temperature range makes it well-suited for space-constrained designs in networking, display control, and embedded computing systems. Alliance Memory's focus on long-term availability and standard DDR3 compatibility ensures this device can serve as a reliable memory building block for products with extended lifecycles.

For designs where 512Mbit capacity, 16-bit organization, and sub-gigahertz DDR3 performance align with system requirements, this SDRAM offers straightforward integration with mainstream controllers while maintaining cost-effectiveness and supply chain stability.

Get Started

Contact our sales team to request pricing and availability for the AS4C32M16D3-10BCN. Our technical support staff can assist with design integration, timing analysis, and board layout recommendations to ensure optimal performance in your application.

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