AS4C32M16SA-7BINTR
| Part Description |
IC DRAM 512MBIT PAR 54FBGA |
|---|---|
| Quantity | 257 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-FBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16SA-7BINTR - 512Mbit Parallel SDRAM
The AS4C32M16SA-7BINTR from Alliance Memory is a 512Mbit synchronous dynamic random access memory (SDRAM) IC organized as 32M x 16. This parallel interface DRAM provides reliable, high-speed memory storage for embedded systems requiring substantial data buffering and processing capabilities. Operating at a clock frequency of 143MHz with 5.4ns access time, this component delivers responsive performance for industrial and commercial applications.
Key Features
- Memory Architecture - 512Mbit capacity organized as 32M x 16, providing flexible data path width for efficient bus utilization in systems requiring word-oriented memory access.
- Performance Specifications - 143MHz clock frequency with 5.4ns access time and 2ns write cycle time ensures fast read and write operations for time-sensitive applications.
- Operating Voltage - 3V to 3.6V supply voltage range supports standard 3.3V digital systems and provides compatibility with common embedded platforms.
- Extended Temperature Range - Qualified for -40°C to 85°C ambient temperature operation, suitable for industrial environments with varying thermal conditions.
- Compact Package - 54-TFBGA (8x8mm) footprint delivers high density memory in a space-efficient form factor for compact board designs.
- Parallel Interface - Direct parallel data bus connection enables straightforward integration with microcontrollers, DSPs, and FPGAs without requiring complex serial protocols.
Typical Applications
- Industrial Automation - This SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interface (HMI) systems where the extended temperature range ensures reliable operation in factory floor environments subject to thermal variation.
- Embedded Computing Systems - Serves as main system memory or frame buffer in single-board computers and embedded processors, with the parallel interface enabling direct memory bus attachment for low-latency data access.
- Communications Equipment - Functions as packet buffer memory in routers, switches, and telecommunications infrastructure where the 143MHz operation speed supports data throughput requirements for network processing tasks.
- Data Acquisition Systems - Acts as sample buffer memory in instrumentation and test equipment, storing captured data streams before transfer to permanent storage or further processing.
- Legacy System Maintenance - Provides replacement memory for existing designs originally built around parallel SDRAM architectures, supporting product lifecycle extension without requiring board redesign.
Unique Advantages
- Simplified Integration: Parallel interface eliminates the need for memory controller logic required by serial memory types, reducing design complexity and component count.
- Proven Technology: SDRAM architecture offers well-established design methodologies and broad software support across embedded development platforms.
- Industrial Temperature Rating: -40°C to 85°C operation extends system reliability in harsh environments without requiring additional thermal management components.
- Board Space Efficiency: 54-FBGA package in 8x8mm footprint provides high memory density per square millimeter compared to larger TSOP alternatives.
- Flexible Organization: 32M x 16 configuration matches the data bus width of many 16-bit and 32-bit microcontrollers and processors, optimizing memory access efficiency.
- Drop-in Replacement Capability: Standard SDRAM pinout and timing specifications enable substitution in existing designs requiring obsolete component replacement.
Why Choose AS4C32M16SA-7BINTR?
The AS4C32M16SA-7BINTR addresses the requirements of industrial and embedded systems that depend on parallel memory architectures. With its extended temperature qualification and compact BGA packaging, this component suits designs operating in demanding thermal environments while maintaining minimal PCB footprint. The 143MHz clock rate and 5.4ns access time provide adequate performance for control systems, data buffering, and moderate-speed processing applications.
This memory IC is particularly valuable for sustaining existing product lines built around parallel SDRAM interfaces. As a current-production component from Alliance Memory, it offers supply continuity for designs requiring long-term component availability. The combination of industrial temperature range, proven SDRAM technology, and space-efficient packaging makes this device appropriate for equipment expected to operate reliably across varied environmental conditions.
Contact Sales
For pricing, availability, and technical support on the AS4C32M16SA-7BINTR, please request a quote through our sales team. We can provide guidance on integration, recommend alternative memory solutions if needed, and assist with volume pricing for production requirements.