AS4C32M16SA-7TIN
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 159 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B2A | HTS Code | 8542.32.0024 |
Overview of AS4C32M16SA-7TIN - 512Mbit Synchronous DRAM
The AS4C32M16SA-7TIN is a 512Mbit synchronous DRAM manufactured by Alliance Memory, Inc. Organized as 32M x 16, this parallel-interface memory device operates at clock frequencies up to 143MHz with a 5.4ns access time. Designed for industrial applications requiring extended temperature tolerance, this SDRAM provides reliable, cost-effective memory expansion for embedded systems, networking equipment, and industrial control applications.
Key Features
- Memory Architecture - 512Mbit capacity organized as 32M x 16, providing flexible word-wide data access with a parallel interface for straightforward integration into legacy and current designs.
- Performance Specifications - 143MHz clock frequency with 5.4ns access time and 2ns write cycle time, delivering responsive memory performance for time-sensitive embedded applications.
- Power Supply - Operates from 3V to 3.6V supply voltage, compatible with standard 3.3V logic systems commonly used in industrial and embedded designs.
- Temperature Range - -40°C to 85°C operating temperature range ensures reliable operation in industrial environments with fluctuating ambient conditions.
- Package - 54-pin TSOP II package with 10.16mm body width provides a space-efficient footprint for PCB layouts with moderate density requirements.
Typical Applications
- Industrial Automation - This SDRAM provides reliable memory for PLCs, HMI systems, and industrial controllers where extended temperature tolerance ensures consistent operation in factory environments and the parallel interface simplifies integration with legacy industrial bus architectures.
- Networking Equipment - Serves as buffer memory in routers, switches, and network appliances where the 512Mbit capacity handles packet buffering and the 143MHz clock frequency supports moderate data throughput requirements.
- Embedded Computing - Functions as main system memory or frame buffer in embedded single-board computers and industrial PCs where the parallel interface integrates seamlessly with traditional memory controller designs.
- Legacy System Maintenance - Provides drop-in replacement memory for equipment refresh and long-term serviceability of existing designs originally specified with similar SDRAM components, extending product lifecycles without requiring board redesigns.
Unique Advantages
- Extended Temperature Operation: The -40°C to 85°C range enables deployment in harsh industrial environments without requiring additional thermal management, reducing system complexity and cost.
- Standard Parallel Interface: Simplifies integration with existing memory controllers and eliminates the need for complex protocol translation, accelerating time-to-market for derivative designs.
- Proven SDRAM Technology: Leverages mature synchronous DRAM architecture with well-understood timing characteristics, minimizing design risk and simplifying validation efforts.
- Compact TSOP II Packaging: Balances board space efficiency with manufacturability, supporting both automated assembly processes and manual rework when necessary.
- Moderate Density: The 512Mbit capacity provides sufficient memory for many embedded applications while maintaining cost-effectiveness compared to higher-density alternatives.
Why Choose AS4C32M16SA-7TIN?
The AS4C32M16SA-7TIN is well-suited for industrial and embedded designs requiring reliable parallel SDRAM with extended temperature capability. Its combination of proven synchronous DRAM technology, industrial temperature range, and standard parallel interface makes it a practical choice for equipment manufacturers maintaining existing product lines or developing new systems based on established memory architectures. The 54-pin TSOP II package provides a balance between density and ease of assembly.
Note that this component has an Obsolete lifecycle status. Designers should contact Alliance Memory or authorized distributors to confirm current availability, assess last-time-buy opportunities, and evaluate suitable alternatives for new designs requiring long-term production support.
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Contact our sales team to discuss pricing, availability, and volume requirements for the AS4C32M16SA-7TIN. Our technical support staff can assist with datasheet review, footprint verification, and integration guidance for your specific application.
