AS4C32M16SB-6TIN

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 487 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16SB-6TIN - 512Mbit Parallel SDRAM

The AS4C32M16SB-6TIN from Alliance Memory is a 512Mbit synchronous dynamic RAM organized as 32M x 16, delivering reliable volatile memory for embedded systems and industrial applications. This parallel interface SDRAM operates at 166MHz clock frequency with a 5ns access time, providing responsive performance for data-intensive operations. Designed for extended temperature environments, this memory solution supports applications requiring consistent operation across -40°C to 85°C temperature ranges.

Key Features

  • 512Mbit Memory Capacity - 32M x 16 organization provides ample storage for buffering, caching, and temporary data storage in embedded systems.
  • High-Speed Operation - 166MHz clock frequency with 5ns access time enables rapid read/write operations for performance-critical applications.
  • Parallel Interface - Direct memory access through parallel connections simplifies integration with microcontrollers, FPGAs, and processors requiring dedicated memory.
  • Extended Temperature Range - Operating range of -40°C to 85°C ensures reliable performance in industrial and automotive environments where temperature fluctuations are common.
  • Standard SDRAM Technology - Leverages widely-supported synchronous DRAM architecture for compatibility with existing memory controller designs and reduced development complexity.
  • 54-TSOP II Package - Compact 0.400" (10.16mm) width surface-mount package optimizes board space utilization in space-constrained designs.
  • 3V to 3.6V Operation - Compatible with standard 3.3V logic levels, reducing power supply requirements and simplifying power management circuits.

Typical Applications

  • Industrial Control Systems - This SDRAM serves as main memory or buffer storage in PLCs, motor controllers, and industrial HMI systems where the extended temperature range ensures reliable operation in factory floor environments.
  • Embedded Computing - Provides volatile working memory for single-board computers, embedded processors, and FPGA-based systems requiring fast, temporary data storage for real-time processing tasks.
  • Test and Measurement Equipment - Enables high-speed data acquisition and buffering in oscilloscopes, logic analyzers, and signal generators where rapid memory access supports real-time signal processing.
  • Communications Infrastructure - Supports packet buffering and data handling in routers, switches, and base station equipment where the parallel interface and moderate speed meet networking throughput requirements.
  • Medical Devices - Functions as working memory in diagnostic equipment and patient monitoring systems where reliable operation across temperature variations ensures consistent performance.

Unique Advantages

  • Proven SDRAM Architecture: Mature synchronous DRAM technology reduces design risk and leverages widely available controller IP and reference designs.
  • Extended Temperature Qualification: -40°C to 85°C rating eliminates the need for thermal management in many industrial applications, reducing system complexity and cost.
  • Simplified Integration: Parallel interface with standard SDRAM protocol enables straightforward connection to memory controllers without additional protocol conversion circuitry.
  • Balanced Performance: 166MHz operation and 5ns access time deliver sufficient speed for industrial and embedded applications without the power consumption of higher-frequency alternatives.
  • Compact Surface-Mount Package: 54-TSOP II format provides high pin count in a space-efficient footprint, optimizing PCB real estate for multi-chip designs.
  • Active Lifecycle Status: Current production availability ensures long-term supply continuity for designs requiring extended product lifecycles.

Why Choose AS4C32M16SB-6TIN?

The AS4C32M16SB-6TIN is positioned for industrial and embedded applications where reliable volatile memory is needed across extended temperature ranges. With its 512Mbit capacity, parallel interface, and -40°C to 85°C operation, this SDRAM suits designs requiring standard memory architecture without the complexity of newer DDR technologies. The 166MHz clock frequency and 5ns access time provide adequate performance for control systems, data acquisition, and communications equipment where predictable timing and established technology reduce development risk.

For engineers designing industrial controls, embedded systems, or test equipment with multi-year production horizons, this Alliance Memory SDRAM delivers the combination of proven technology, temperature tolerance, and active lifecycle status that supports long-term availability. The standard SDRAM protocol and 3.3V operation integrate easily with existing controller designs, minimizing validation effort and accelerating time to market.

Get Started with AS4C32M16SB-6TIN

Contact our technical sales team to request a quote, discuss volume pricing, or obtain samples for evaluation. Our specialists can provide application guidance, reference designs, and lifecycle information to support your design decisions.

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