AS4C32M16SA-7TINTR

The AS4C32M16SA-7TINTR is a 512-megabit synchronous dynamic random-access memory (SDRAM) device from Alliance Memory, Inc., organized as 32M x 16 bits. This parallel interface DRAM operates at 3V to 3.6V and delivers reliable volatile memory storage for embedded systems requiring fast synchronous data access. With a 143MHz clock frequency and 5.4ns access time, it provides efficient memory performance across industrial temperature ranges from -40°C to 85°C.

Key Features

• Memory Architecture - 512-megabit capacity organized as 32M x 16, providing flexible word-wide data access for 16-bit data bus architectures.
• Synchronous Operation - SDRAM technology with 143MHz clock frequency enables synchronous data transfers aligned with system timing for predictable latency and improved system throughput.
• Access Performance - 5.4ns access time and 2ns write cycle time deliver fast read and write operations suitable for real-time processing applications.
• Operating Voltage - 3V to 3.6V supply voltage aligns with standard 3.3V logic levels, simplifying integration into common embedded platforms.
• Industrial Temperature Range - -40°C to 85°C operating range supports deployment in industrial environments subject to temperature extremes.
• Package Configuration - 54-pin TSOP II package (10.16mm width, 0.400") offers a compact footprint with industry-standard pinout for surface-mount designs.

Typical Applications

• Industrial Control Systems - This SDRAM serves as working memory in programmable logic controllers (PLCs) and distributed control systems where the industrial temperature rating ensures reliable operation in factory automation environments.
• Embedded Computing - The 512Mbit capacity and parallel interface make this device suitable for microprocessor-based systems requiring local DRAM for program execution and data buffering.
• Telecommunications Equipment - Synchronous operation at 143MHz supports data buffering and packet processing in networking devices where predictable timing is essential for protocol handling.
• Test and Measurement Instruments - The wide operating temperature range and reliable synchronous timing enable integration into benchtop and portable instruments that capture and process measurement data.
• Legacy System Replacement - As a TSOP II packaged SDRAM, this component supports maintenance and repair of existing industrial equipment designed around this memory standard.

Unique Advantages

• Standard Parallel Interface: Familiar SDRAM protocol simplifies firmware development and reduces engineering effort compared to proprietary memory interfaces.
• Industrial-Grade Reliability: Extended temperature specification ensures consistent performance across harsh operating conditions, reducing field failures in industrial deployments.
• Synchronous Architecture: Clock-aligned data transfers eliminate the timing uncertainties of asynchronous DRAM, improving system stability and reducing design complexity.
• Established Technology: SDRAM represents mature, well-understood technology with extensive documentation and design resources, shortening development cycles.
• Compact Surface-Mount Package: TSOP II form factor conserves board space while maintaining compatibility with standard SMT assembly processes.
• Alliance Memory Support: Backed by Alliance Memory's focus on memory solutions for industrial and embedded applications, providing supply chain stability for long-lifecycle designs.

Why Choose AS4C32M16SA-7TINTR?

The AS4C32M16SA-7TINTR addresses the needs of industrial and embedded system designers requiring proven SDRAM technology with industrial temperature support. Its combination of 512Mbit capacity, synchronous operation, and -40°C to 85°C rating makes it well-suited for applications where environmental durability and timing predictability are essential. The standard TSOP II package and parallel SDRAM interface facilitate integration into both new designs and legacy system maintenance.

This component is particularly appropriate for industrial control, telecommunications infrastructure, and embedded computing platforms where mature memory technology, supply availability, and extended operating temperature specifications align with long product lifecycles and reliability requirements.

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