AS4C32M16SB-6TINTR
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,828 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16SB-6TINTR - 512Mbit SDRAM with Industrial Temperature Range
The AS4C32M16SB-6TINTR from Alliance Memory is a 512Mbit synchronous DRAM designed for embedded systems requiring reliable memory performance across industrial temperature ranges. Organized as 32M x 16, this parallel interface SDRAM operates at 166MHz and delivers 5ns access time, making it suitable for processor-based systems, industrial controllers, and communication equipment where extended temperature tolerance is essential.
Key Features
- Memory Configuration - 512Mbit capacity organized as 32M x 16, providing flexible data width for 16-bit processor architectures and memory subsystem designs.
- Performance - 166MHz clock frequency with 5ns access time and 12ns write cycle time delivers responsive memory access for real-time control applications.
- Power Supply - 3V to 3.6V supply voltage range simplifies integration with standard 3.3V logic families and reduces power distribution complexity.
- Interface - Parallel SDRAM interface ensures compatibility with legacy processor designs and simplifies migration from older memory technologies.
- Package - 54-pin TSOP II package with 10.16mm width provides a compact footprint for space-constrained board layouts.
- Temperature Range - -40°C to 85°C operating range supports deployment in industrial environments with extreme ambient conditions.
Typical Applications
- Industrial Automation - This SDRAM provides reliable memory for PLCs, motion controllers, and HMI systems where extended temperature tolerance ensures consistent operation in factory floor environments.
- Embedded Computing - Serves as main memory for single-board computers and embedded processors in industrial equipment, reducing memory subsystem complexity while maintaining adequate performance.
- Networking Equipment - Supports packet buffering and data handling in routers, switches, and communication devices that operate in telecom closets and outdoor enclosures.
- Test and Measurement - Functions as data acquisition memory in oscilloscopes, analyzers, and instrumentation where the parallel interface simplifies integration with existing FPGA-based architectures.
- Legacy System Upgrades - Enables capacity expansion or component replacement in established designs requiring pin-compatible SDRAM with industrial temperature specifications.
Unique Advantages
- Industrial Temperature Qualification: The -40°C to 85°C range eliminates the need for additional thermal management in harsh environments, reducing BOM cost and design complexity.
- Proven SDRAM Technology: Mature synchronous DRAM architecture provides predictable timing characteristics and simplifies memory controller design compared to newer memory technologies.
- Standard Supply Voltage: 3.3V nominal operation allows direct interfacing with standard logic without level shifters or dual-rail power supplies.
- Compact Form Factor: TSOP II packaging delivers higher density than DIP alternatives while maintaining compatibility with standard SMT assembly processes.
- Active Lifecycle Status: Ongoing production availability supports long-term design commitments and reduces obsolescence risk for industrial equipment with extended service lives.
- Parallel Interface Compatibility: Direct connection to processors and FPGAs without protocol translation hardware reduces component count and board complexity.
Why Choose AS4C32M16SB-6TINTR?
This 512Mbit SDRAM addresses the requirements of industrial and embedded systems that prioritize proven technology, temperature resilience, and straightforward integration over cutting-edge density or speed. The combination of industrial temperature range, standard 3.3V operation, and parallel SDRAM interface makes it particularly suitable for legacy system upgrades, industrial control applications, and designs with long product lifecycles where component availability and thermal robustness outweigh the benefits of newer memory architectures.
For design teams working with 16-bit processors or upgrading existing equipment, the AS4C32M16SB-6TINTR offers a balance of adequate performance, proven reliability, and extended temperature capability without the complexity of migrating to DDR or other advanced memory standards.
Get a Quote
Contact our sales team to discuss pricing, lead times, and volume availability for the AS4C32M16SB-6TINTR. Our technical support staff can assist with integration questions and provide additional documentation to support your design process.
