AS4C32M16SA-7TCNTR
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,344 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16SA-7TCNTR - 512Mbit Parallel SDRAM
The AS4C32M16SA-7TCNTR is a 512Mbit synchronous dynamic random access memory (SDRAM) configured as 32M x 16, providing high-density volatile memory for embedded systems. Built on proven SDRAM technology with a parallel interface, this memory device delivers reliable data storage for applications requiring moderate density and standard operating temperatures. It operates at 143MHz clock frequency with a 5.4ns access time, making it suitable for general-purpose computing and data buffering applications.
Key Features
- Memory Core: 512Mbit SDRAM organized as 32M x 16, providing flexible word-width access for various system architectures.
- Performance: 143MHz maximum clock frequency with 5.4ns access time and 2ns write cycle time, supporting moderate-speed data transfer requirements.
- Power Supply: 3V to 3.6V operation, compatible with standard 3.3V logic systems commonly used in embedded designs.
- Interface: Parallel memory interface with synchronous operation, simplifying integration with microcontrollers and processors supporting traditional memory buses.
- Package: 54-pin TSOP II package (0.400"/10.16mm width), offering a compact footprint for space-constrained PCB layouts.
- Temperature Range: 0°C to 70°C commercial temperature operation, suitable for indoor equipment and controlled environments.
Typical Applications
- Embedded Computing: This SDRAM provides working memory for microprocessor-based systems where parallel memory interfaces offer straightforward integration with existing system architectures.
- Data Buffering: The 512Mbit capacity serves as intermediate storage in data acquisition and processing equipment, allowing temporary data retention before transfer to permanent storage.
- Communication Equipment: Commercial-grade temperature tolerance makes this memory suitable for indoor networking and telecom infrastructure where environmental conditions remain controlled.
- Consumer Electronics: The standard voltage operation and moderate clock speeds support set-top boxes, media players, and similar consumer devices operating within standard temperature ranges.
Unique Advantages
- Standard SDRAM Architecture: Leverages widely-supported synchronous DRAM technology, enabling compatibility with established design practices and reducing development complexity.
- 32M x 16 Organization: Provides 16-bit data width that matches common processor architectures, minimizing interface glue logic and simplifying board design.
- Compact TSOP II Package: Delivers high pin count in a space-efficient surface mount package, optimizing board real estate utilization.
- Commercial Temperature Grade: Offers cost-effective memory solution for applications not requiring extended or industrial temperature qualification.
Why Choose AS4C32M16SA-7TCNTR?
The AS4C32M16SA-7TCNTR offers a straightforward parallel SDRAM solution for designs requiring moderate memory capacity in commercial operating environments. Its standard voltage operation and synchronous interface align with conventional embedded system architectures, while the 54-pin TSOP II package provides a proven form factor for reliable manufacturing. This memory component is positioned for cost-sensitive applications where commercial temperature ratings are sufficient and parallel memory interfaces match existing system requirements.
Note: This product carries an Obsolete lifecycle status. For new designs, consult with Alliance Memory or your distributor regarding current availability and recommended alternatives.
Get a Quote
Contact our sales team to request pricing and availability information for the AS4C32M16SA-7TCNTR. Our technical support staff can assist with integration questions and recommend suitable alternatives if this component's lifecycle status affects your project timeline.