F59D8G81XA-45TIG2Y

8Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 8 Gbit, 1.8V, x8, Industrial

Quantity 1,141 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size8 GbitAccess Time25 nsGradeIndustrial
Clock FrequencyN/AVoltage1.7V ~ 1.95VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page200 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59D8G81XA-45TIG2Y – SLC NAND Flash, 8 Gbit, 1.8V, x8, Industrial

The F59D8G81XA-45TIG2Y is an industrial-grade SLC NAND Flash memory device from ESMT offering 8 Gbit density in a 1G x 8 organization. It implements an asynchronous parallel NAND interface and ONFI 1.0–compliant features to deliver robust non-volatile storage for industrial embedded systems.

Designed for applications that require durable flash storage across a wide temperature range, the device combines SLC endurance and reliability characteristics with a compact 48-pin TSOPI surface-mount package and a 1.7–1.95 V supply range.

Key Features

  • Memory Architecture — 8 Gbit capacity organized as 1G x 8, with page size 4,320 bytes (4,096 + 224) and block size of 64 pages; device contains 4,096 blocks arranged as 2 planes × 2,048 blocks per plane.
  • Single-Level Cell (SLC) Technology — SLC NAND Flash for endurance and data retention characteristics suitable for industrial applications; endurance rated at 60,000 program/erase cycles (datasheet).
  • Performance — Specified access time of 25 ns and asynchronous I/O performance including RC/4WC timing of 30 ns; read page latency and program/erase timings are documented (read page 25 µs; program page typically 200 µs; erase block typically 3 ms).
  • Interface and Command Set — Parallel NAND interface with standard control signals (CE#, CLE, ALE, WE#, RE#), ONFI 1.0-compliant command set, and advanced commands including program/read page cache modes, two-plane commands, multi-die (LUN) operations, and read unique ID.
  • Device Control and Status — Hardware signals for Ready/Busy# (R/B#) and WP# for whole-device write protection; operation status byte and RESET (FFh) initialization method are supported.
  • Power — Low-voltage operation with VCC supply range of 1.7 V to 1.95 V.
  • Package and Mounting — 48-pin TSOPI (TSOPI-48) surface-mount package (12 mm × 20 mm body, 0.5 mm pin pitch) optimized for compact board layouts.
  • Industrial Temperature Range — Qualified for operation from -40 °C to +85 °C.
  • Quality and Reliability — JEDEC qualification with data retention compliant to JESD47G (see qualification report); first block shipped from factory is provided valid with ECC.
  • Security and Utility Modes — One-time programmable (OTP) mode and block lock functionality for data protection and configuration.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Industrial Control — Non-volatile program and parameter storage for PLCs, motor controllers and factory automation systems operating across -40 °C to +85 °C.
  • Embedded Storage — Primary or supplemental firmware and file storage in embedded platforms that require SLC endurance and predictable program/erase behavior.
  • Data Logging — Reliable event and log storage in industrial monitoring equipment where high endurance and retention are required.
  • Communications and Networking Equipment — Firmware and configuration storage for industrial-grade networking devices and infrastructure modules.

Unique Advantages

  • High Endurance: 60,000 program/erase cycles support extended field life for write-intensive industrial applications.
  • Industrial Temperature Support: Rated for -40 °C to +85 °C operation, enabling deployment in harsh environments without derating.
  • ONFI 1.0 Compatibility: Standardized NAND command set and interface simplifies integration and future device upgrades.
  • Flexible Command and Cache Modes: Program/read page cache modes, two-plane and multi-die operations improve throughput and design flexibility.
  • Compact, Board-Friendly Package: 48-pin TSOPI surface-mount package with 0.5 mm pitch enables space-efficient PCB layouts for embedded systems.
  • Proven Quality Controls: JEDEC qualification and JESD47G-compliant data retention provide documented reliability metrics for product assurance.

Why Choose F59D8G81XA-45TIG2Y?

The F59D8G81XA-45TIG2Y positions itself as a robust SLC NAND Flash option for designers needing industrial-grade non-volatile storage with predictable endurance and documented reliability. Its combination of SLC architecture, ONFI compatibility, and industrial temperature rating make it suitable for embedded and control applications where long-term data integrity and operation under temperature extremes matter.

Backed by ESMT’s NAND Flash family features—advanced command support, cache modes, and hardware status signaling—this device provides a durable, compact storage building block that integrates into industrial systems with minimal redesign effort.

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