F59L1G81LB-25BCG2M
| Part Description |
SLC NAND Flash, 1Gbit, (128Mx8), 3.3V, x8, 25ns, 67-ball BGA |
|---|---|
| Quantity | 1,174 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-67 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 20 ns | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 350 µs | Packaging | 67-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 128M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L1G81LB-25BCG2M – SLC NAND Flash, 1Gbit, (128Mx8), 3.3V, x8, 25ns, 67-ball BGA
The F59L1G81LB-25BCG2M is a 1 Gbit single-level cell (SLC) NAND flash memory organized as 128M x 8 with an additional spare area. It operates from a 3.3V supply (2.7V–3.6V) and provides a parallel x8 interface in a compact 67-ball BGA package for surface-mount applications.
Designed for solid-state mass storage and embedded boot/firmware applications, this commercial-grade device offers page-based read/write operations, cache features and boot-from-NAND support to simplify system boot and memory download scenarios while delivering endurance and data-retention characteristics specified for long-term storage.
Key Features
- Memory Organization & Capacity 1.074 Gbit total capacity organized as 128M × 8 with spare 4M × 8 and a page size of (2K + 64) bytes.
- Technology SLC NAND flash cell architecture providing single-bit-per-cell storage with ECC requirement of 1 bit per 528 bytes.
- Interface & Speed Parallel x8 interface with a 25 ns serial access cycle time (speed grade –25) for page-mode data streaming.
- Program / Erase Timings Typical page program time ~400 µs and typical block erase time in the 3–4 ms range; write cycle time (word/page) listed at 350 µs.
- Reliability & Endurance Endurance specified at 100K program/erase cycles and data retention of 10 years.
- System Features Cache program and cache read operations, copy-back operation, automatic program/erase, automatic read at power-up, boot-from-NAND support, OTP operation and bad-block protection to facilitate firmware management and reliable storage use.
- Power & Voltage Single VCC range: 2.7 V to 3.6 V (nominal 3.3 V).
- Package & Mounting 67-ball BGA package (BGA-67) optimized for surface-mount assembly; commercial operating temperature range 0 °C to 70 °C.
- Standards & Compliance RoHS compliant.
Typical Applications
- Embedded Storage and Boot Media Boot-from-NAND support and automatic read-at-power-up make the device suitable for system firmware and boot storage in embedded designs.
- Solid-State Mass Storage SLC NAND with cache and copy-back features supports reliable page-level storage for compact solid-state devices and mass storage modules.
- Firmware and Automatic Memory Download Automatic memory download and OTP operation simplify firmware update and secure code storage workflows.
- Commercial Embedded Systems Commercial-grade temperature range and surface-mount BGA packaging fit a range of consumer and commercial embedded products requiring durable non-volatile memory.
Unique Advantages
- High Endurance: 100K program/erase cycles provide durability for frequent update scenarios and long service life.
- Long-Term Data Retention: 10-year data retention supports archival of firmware and configuration data.
- Boot and System Integration Features: Built-in boot-from-NAND support, automatic read at power-up and automatic memory download streamline system start-up and firmware delivery.
- Throughput Optimization: Cache program/read and copy-back operations reduce program/read latency when streaming consecutive pages or managing defective blocks.
- Compact, Surface-Mount Package: 67-ball BGA provides a small footprint for space-constrained board designs while supporting a parallel x8 interface.
- Wide Supply Range: 2.7 V to 3.6 V operation accommodates standard 3.3 V system rails.
Why Choose F59L1G81LB-25BCG2M?
The F59L1G81LB-25BCG2M positions itself as a robust, SLC NAND flash option for commercial embedded systems and solid-state storage applications that require endurance, long-term retention and integrated boot/firmware handling features. Its parallel x8 interface, cache/copy-back capabilities and automatic power-up behaviors simplify design integration for firmware-heavy devices and mass storage modules.
Engineers designing compact, surface-mount products benefit from the 67-ball BGA package, RoHS compliance, and a nominal 3.3 V supply range. The combination of endurance, system-oriented features and page/block architecture makes this part a practical choice for designs prioritizing reliable, updateable non-volatile storage.
Request a quote or submit an inquiry for F59L1G81LB-25BCG2M to discuss availability, pricing and technical support for your design requirements.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A