F59L1G81LB-25BCG2M

1Gb NAND Flash
Part Description

SLC NAND Flash, 1Gbit, (128Mx8), 3.3V, x8, 25ns, 67-ball BGA

Quantity 1,174 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-67Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size1 GbitAccess Time20 nsGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page350 µsPackaging67-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization128M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59L1G81LB-25BCG2M – SLC NAND Flash, 1Gbit, (128Mx8), 3.3V, x8, 25ns, 67-ball BGA

The F59L1G81LB-25BCG2M is a 1 Gbit single-level cell (SLC) NAND flash memory organized as 128M x 8 with an additional spare area. It operates from a 3.3V supply (2.7V–3.6V) and provides a parallel x8 interface in a compact 67-ball BGA package for surface-mount applications.

Designed for solid-state mass storage and embedded boot/firmware applications, this commercial-grade device offers page-based read/write operations, cache features and boot-from-NAND support to simplify system boot and memory download scenarios while delivering endurance and data-retention characteristics specified for long-term storage.

Key Features

  • Memory Organization & Capacity  1.074 Gbit total capacity organized as 128M × 8 with spare 4M × 8 and a page size of (2K + 64) bytes.
  • Technology  SLC NAND flash cell architecture providing single-bit-per-cell storage with ECC requirement of 1 bit per 528 bytes.
  • Interface & Speed  Parallel x8 interface with a 25 ns serial access cycle time (speed grade –25) for page-mode data streaming.
  • Program / Erase Timings  Typical page program time ~400 µs and typical block erase time in the 3–4 ms range; write cycle time (word/page) listed at 350 µs.
  • Reliability & Endurance  Endurance specified at 100K program/erase cycles and data retention of 10 years.
  • System Features  Cache program and cache read operations, copy-back operation, automatic program/erase, automatic read at power-up, boot-from-NAND support, OTP operation and bad-block protection to facilitate firmware management and reliable storage use.
  • Power & Voltage  Single VCC range: 2.7 V to 3.6 V (nominal 3.3 V).
  • Package & Mounting  67-ball BGA package (BGA-67) optimized for surface-mount assembly; commercial operating temperature range 0 °C to 70 °C.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • Embedded Storage and Boot Media  Boot-from-NAND support and automatic read-at-power-up make the device suitable for system firmware and boot storage in embedded designs.
  • Solid-State Mass Storage  SLC NAND with cache and copy-back features supports reliable page-level storage for compact solid-state devices and mass storage modules.
  • Firmware and Automatic Memory Download  Automatic memory download and OTP operation simplify firmware update and secure code storage workflows.
  • Commercial Embedded Systems  Commercial-grade temperature range and surface-mount BGA packaging fit a range of consumer and commercial embedded products requiring durable non-volatile memory.

Unique Advantages

  • High Endurance: 100K program/erase cycles provide durability for frequent update scenarios and long service life.
  • Long-Term Data Retention: 10-year data retention supports archival of firmware and configuration data.
  • Boot and System Integration Features: Built-in boot-from-NAND support, automatic read at power-up and automatic memory download streamline system start-up and firmware delivery.
  • Throughput Optimization: Cache program/read and copy-back operations reduce program/read latency when streaming consecutive pages or managing defective blocks.
  • Compact, Surface-Mount Package: 67-ball BGA provides a small footprint for space-constrained board designs while supporting a parallel x8 interface.
  • Wide Supply Range: 2.7 V to 3.6 V operation accommodates standard 3.3 V system rails.

Why Choose F59L1G81LB-25BCG2M?

The F59L1G81LB-25BCG2M positions itself as a robust, SLC NAND flash option for commercial embedded systems and solid-state storage applications that require endurance, long-term retention and integrated boot/firmware handling features. Its parallel x8 interface, cache/copy-back capabilities and automatic power-up behaviors simplify design integration for firmware-heavy devices and mass storage modules.

Engineers designing compact, surface-mount products benefit from the 67-ball BGA package, RoHS compliance, and a nominal 3.3 V supply range. The combination of endurance, system-oriented features and page/block architecture makes this part a practical choice for designs prioritizing reliable, updateable non-volatile storage.

Request a quote or submit an inquiry for F59L1G81LB-25BCG2M to discuss availability, pricing and technical support for your design requirements.

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