JS27HU8G08SJDA-25

The JS27HU8G08SJDA-25 is an 8 Gbit SLC NAND flash memory device in a compact 63-ball FBGA package. Designed for industrial applications, it provides 2K page organization with a 128‑byte spare area and integrated 1‑bit ECC for reliable data storage in embedded systems and mass-storage applications.

This parallel x8 NAND FLASH operates from a 3.3 V supply and delivers low-latency read access and predictable program timings, making it suitable for boot, firmware, and general-purpose non-volatile storage in constrained form-factor designs.

Key Features

• Memory Capacity & Technology — 8 Gbit density implemented as SLC NAND flash in an x8 organization for straightforward parallel interfacing.
• Page & Spare Area — 2K byte page architecture with a 128‑byte spare area to support ECC and metadata storage.
• Error Correction — 1‑bit ECC as specified in the part name to assist data integrity within the spare area.
• Performance — Read access time of 25 ns and typical page program time of 300 µs for predictable write performance.
• Interface & Clock — Parallel x8 interface with a 40 MHz clock frequency for standard NAND controller integration.
• Power — Single 3.3 V supply for system compatibility with common industrial power rails.
• Package & Mounting — 63‑ball FBGA, 9.0 × 11.0 mm, surface-mount package suitable for compact PCB layouts.
• Industrial Grade Temperature — Specified operating range from −40 °C to 85 °C for reliable operation across industrial environments.
• Environmental Compliance — RoHS compliant (lead-free & halogen-free packaging).

Typical Applications

• Mass Storage / Embedded Storage — Use as non-volatile storage for firmware, file systems, and bulk data in embedded devices where SLC endurance and predictable performance are required.
• Industrial Controllers — Storage for configuration, logs, and firmware images in industrial control systems operating across −40 °C to 85 °C.
• Data Logging — Suitable for cyclic data capture and retention with page-level program times and spare area for metadata and ECC.
• Boot & Firmware Flash — Compact FBGA package and parallel x8 interface make it suitable as primary or secondary boot storage in space-constrained systems.

Unique Advantages

• High-density SLC NAND — 8 Gbit capacity in SLC technology provides a balance of density and single-level cell characteristics.
• Predictable Program and Read Timing — Typical page program time of 300 µs and 25 ns read access support deterministic behavior for embedded storage tasks.
• Compact Industrial Package — 63‑ball FBGA (9.0 × 11.0 mm) enables space-efficient board designs without sacrificing capacity.
• Standard 3.3 V Operation — Compatibility with common industrial power rails simplifies system power design and integration.
• Built for Harsh Environments — Industrial temperature rating (−40 °C to 85 °C) and RoHS‑compliant packaging support long-term deployment in industrial applications.

Why Choose JS27HU8G08SJDA-25?

The JS27HU8G08SJDA-25 is positioned for embedded and industrial designs that need a compact, high-density SLC NAND device with predictable program/read timing and an industry-standard parallel interface. Its 2K page plus 128‑byte spare layout and integrated ECC support storage integrity for firmware and data logging use cases.

Choose this device when your design requires an industrial-temperature, surface-mount NAND solution that balances capacity, integration, and straightforward interfacing for mass-storage style applications.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability for JS27HU8G08SJDA-25. Our team can provide technical details and support to help integrate this NAND flash into your design.