JS27HU8G08SDDA-25
| Part Description |
2K page 4-bit ECC 128 byte spare |
|---|---|
| Quantity | 1,223 Available (as of June 17, 2026) |
| Product Category | Flash Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 63-BGA (9.0x11.0mm) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 8 Gbit | Access Time | 25 ns | Grade | Industrial | ||
| Clock Frequency | 40 MHz | Voltage | 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C - 85°C | Write Cycle Time Word Page | 300 µs | Mounting Method | Surface Mount | ||
| Memory Interface | Parallel | Memory Organization | x8 | Moisture Sensitivity Level | 3 | ||
| RoHS Compliance | Compliant | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of JS27HU8G08SDDA-25 – 2K page 4-bit ECC 128 byte spare
The JS27HU8G08SDDA-25 is an 8 Gbit SLC NAND Flash memory device with a 2K-byte main page and 128-byte spare area, incorporating 4-bit ECC. Designed for non-volatile mass storage in industrial embedded systems, it delivers a parallel x8 interface and pinout compatibility across densities for straightforward system integration.
Built for industrial operation, the device supports a 3.3 V supply (VCC 2.7 V–3.6 V), a 63-ball FBGA (9.0 × 11.0 mm) package, and an operating temperature range of −40 °C to 85 °C, providing a balanced combination of capacity, reliability, and compact packaging for storage-focused applications.
Key Features
- Core Memory Architecture Single-Level Cell (SLC) NAND flash delivering 8 Gbit density, optimized for cost-effective solid-state mass storage.
- Page and Block Organization 2K-byte page size with 128-byte spare area (per part name), supporting page program and cache read operations for improved throughput.
- Error Correction 4-bit ECC (per datasheet series) to support data integrity across programmed pages and spare area.
- Interface and I/O Parallel x8 I/O with 40 MHz clock frequency and pinout compatibility across densities to simplify BOM and design migration.
- Performance Byte access timing of 25 ns and typical page program time of 300 µs (3.3 V), enabling predictable read/write responsiveness in embedded storage tasks.
- Reliability & Endurance Endurance up to 100,000 program/erase cycles at the industrial temperature range and typical 10-year data retention as specified in the datasheet series.
- Power 3.3 V supply operation (VCC = 2.7 V–3.6 V) for compatibility with common industrial power rails.
- Package & Temperature 63-ball FBGA (9.0 × 11.0 mm) surface-mount package and industrial-grade operating temperature from −40 °C to 85 °C.
- Standards & Command Set ONFI 1.0 compliant command set as indicated in the product series documentation for standard NAND command compatibility.
Typical Applications
- Embedded Mass Storage Reliable non-volatile storage for embedded systems that require high-density NAND with ECC-protected pages.
- Industrial Data Logging Durable SLC NAND suited for data logging and archival tasks within industrial temperature ranges and long retention requirements.
- Firmware & System Storage On-board program and boot storage for controllers and devices where parallel x8 interface and simple host control are advantageous.
Unique Advantages
- High Density, Compact Package 8 Gbit capacity in a 63-ball FBGA (9.0 × 11.0 mm) minimizes board area while maximizing storage.
- ECC-Protected Pages 4-bit ECC across the spare area improves data integrity for stored content and supports robust field reliability.
- Industrial Temperature Rating Specified operation from −40 °C to 85 °C addresses a wide range of industrial environments without derating device endurance.
- Predictable Program and Read Latency Typical page program time of 300 µs and byte access timing of 25 ns enable deterministic performance planning for system designers.
- ONFI-Compatible Command Set Standardized command set support facilitates interoperability with existing NAND controller implementations.
- Pinout Compatibility Across Densities Consistent pinouts for x8/x16 variants simplify design migration between capacities and reduce rework when scaling designs.
Why Choose JS27HU8G08SDDA-25?
The JS27HU8G08SDDA-25 positions itself as a reliable, high-density SLC NAND Flash option for industrial embedded storage. Its combination of an 8 Gbit capacity, 2K-page architecture with 128-byte spare area, 4-bit ECC, and industrial temperature rating delivers a solution balanced for endurance, data integrity, and compact PCB footprints.
This device is suited to engineers and procurement teams building industrial storage, firmware, or embedded mass-storage solutions that require predictable program/read timing, long data retention, and simplified migration across NAND densities while maintaining a small board footprint.
Request a quote or contact sales to discuss availability, pricing, and volume options for JS27HU8G08SDDA-25.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH