JS27HU2G08SDDA-25

The JS27HU2G08SDDA-25 is a 2 Gbit SLC NAND Flash memory device organized as x8 with a 2K-byte main page and 128-byte spare area. It implements 4-bit ECC and a parallel NAND interface, delivering a cost-effective non-volatile storage solution for solid-state mass storage and embedded systems.

Designed for industrial applications, the device supports a 3.3 V supply range, operates from –40 °C to 85 °C, and is provided in a compact 63-ball FBGA package for space-constrained board designs.

Key Features

• Core / Memory  2 Gbit NAND Flash (SLC) organized x8 with 2K-byte page and 128-byte spare for robust storage and metadata.
• Error Correction (ECC)  4-bit ECC capability (per 528 bytes for x8) to improve data integrity during program/read cycles.
• Performance  Byte cycle time as low as 25 ns (3.3 V), 40 MHz clock frequency, and typical page program time of 300 µs.
• Interface  Parallel NAND interface with x8 I/O and ONFI 1.0 compliant command set for standard NAND integration.
• Reliability  Typical data retention of 10 years and endurance rated up to 100,000 program/erase cycles over the industrial temperature range.
• Power  3.3 V device operating range supported (Vcc = 2.7 V to 3.6 V).
• Package & Mounting  63-ball FBGA (9.0 × 11.0 mm) surface-mount package—lead-free and RoHS compliant.
• Operating Temperature  Industrial grade operation from –40 °C to 85 °C.
• Other NAND Capabilities  Fast block erase, cache read with internal buffer, copy-back program support, and simple chip-enable behavior for microcontroller-based systems.

Typical Applications

• Mass storage devices  Use in solid-state storage implementations where high-density, cost-effective NAND is required for data storage.
• Embedded systems  Local non-volatile storage for firmware, configuration data, and application assets in industrial embedded products.
• Industrial equipment  Reliable storage in equipment operating across extended temperature ranges, taking advantage of the industrial-grade rating and endurance.

Unique Advantages

• High-density SLC NAND  2 Gbit capacity in an SLC NAND architecture provides a balance of density and endurance for long-life storage.
• Enhanced data integrity  4-bit ECC per 528 bytes (x8) reduces uncorrected errors and supports robust retention and endurance targets.
• Industrial temperature capability  Specified operation from –40 °C to 85 °C for deployments in harsher environments.
• Compact FBGA footprint  63-ball FBGA (9.0 × 11.0 mm) minimizes PCB area while providing a surface-mount package suitable for automated assembly.
• ONFI-compliant command set  Standard NAND command compatibility simplifies software integration and migration across densities in the product family.
• Proven endurance and retention  Typical 100,000 program/erase cycles (industrial) and 10-year data retention help lower lifecycle replacement and maintenance costs.

Why Choose JS27HU2G08SDDA-25?

The JS27HU2G08SDDA-25 delivers a practical combination of capacity, endurance, and data integrity for industrial embedded and mass-storage applications. Its SLC NAND architecture, 4-bit ECC support, and compact 63-ball FBGA package make it suitable for designs where long-term reliability and a small PCB footprint are important.

With ONFI-compatible commands, RoHS compliance, and industrial temperature operation, this device is positioned for engineers and integrators building robust, long-lived storage subsystems in industrial or embedded product lines.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the JS27HU2G08SDDA-25. Our team can provide additional technical details and support for integration into your design.