JS27HP8G08SDDA-45M

2K page 4-bit ECC 128 byte spare
Part Description

2K page 4-bit ECC 128 byte spare

Quantity 974 Available (as of June 17, 2026)
Product CategoryFlash Memory
ManufacturerJeju Semiconductor Corporation
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package63-BGA (9.0x11.0mm)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size8 GbitAccess Time45 nsGradeAutomotive
Clock Frequency22.22 MHzVoltage1.8VMemory TypeNon-Volatile
Operating Temperature-40°C - 105°CWrite Cycle Time Word Page300 µsMounting MethodSurface Mount
Memory InterfaceParallelMemory Organizationx8Moisture Sensitivity Level3
RoHS ComplianceCompliantECCNEAR99HTS Code8542.32.00.71

Overview of JS27HP8G08SDDA-45M – 2K page 4-bit ECC 128 byte spare

The JS27HP8G08SDDA-45M is an 8 Gbit SLC NAND flash memory organized as x8 with a 2K page plus 128-byte spare area and 4-bit ECC. It implements a parallel NAND interface with low-voltage 1.8 V supply and is optimized for high-density solid-state mass storage and embedded non-volatile data retention.

Designed for applications that require robust data integrity and compact board footprint, this device combines fast access timing, on-chip ECC support and standard NAND command compatibility to simplify integration into storage, embedded and industrial designs.

Key Features

  • Memory Density & Organization — 8 Gbit capacity in x8 organization, providing high-density storage in a compact footprint.
  • Page & Spare Configuration — 2K byte main page with 128 byte spare area and 4‑bit ECC for enhanced data protection across stored pages.
  • On-Die ECC — 4-bit ECC per 528 bytes (x8) to improve data reliability during read/program cycles.
  • Performance — 45 ns access time and 300 µs typical page program time, enabling efficient read and program operations for mass storage tasks.
  • Interface — Parallel NAND interface, x8 I/O bus width and ONFI 1.0 compliant command set for straightforward system integration.
  • Power — 1.8 V supply (device Vcc range 1.7 V–1.95 V) suitable for low-voltage system designs.
  • Reliability & Endurance — Data retention and endurance figures provided in the datasheet, including program/erase cycle specifications and hardware data protection during power transitions.
  • Package & Mounting — 63-ball FBGA (9.0 × 11.0 mm) surface-mount package for compact board-level integration.
  • Operating Range — Specified operating temperature range from −40 °C to 105 °C.
  • Additional NAND Capabilities — Features such as copy-back program, cache-read buffer, status register and chip-enable don’t-care for simplified controller interaction.

Typical Applications

  • Solid-state mass storage — High-density NAND capacity and ECC support for consumer and industrial storage devices.
  • Embedded storage — Firmware and data storage in embedded systems that require non-volatile memory with on-chip ECC and parallel interface.
  • Data logging and industrial memory — Reliable data retention and wide operating temperature range for long-term storage in industrial applications.
  • Mass-market electronics — Compact FBGA package and low-voltage operation for space-constrained consumer devices that need cost-effective flash storage.

Unique Advantages

  • High-density storage in a compact package: 8 Gbit capacity in a 63-ball FBGA (9.0 × 11.0 mm) reduces board area while delivering substantial non-volatile storage.
  • On-chip ECC for data integrity: 4-bit ECC per 528 bytes (x8) improves read/program robustness without adding external ECC logic.
  • Low-voltage operation: 1.8 V supply reduces power draw and eases integration into modern low-voltage systems.
  • Fast access and program timings: 45 ns access time and 300 µs typical page program time support responsive storage operations.
  • Standard NAND interface: Parallel x8 interface and ONFI command set compatibility simplify controller design and migration across densities.
  • Designed for reliability: Hardware data protection during power transitions and documented endurance/data retention figures provide predictable behavior for long-term deployments.

Why Choose JS27HP8G08SDDA-45M?

The JS27HP8G08SDDA-45M delivers a balanced combination of high storage density, on-die ECC and low-voltage operation in a compact FBGA package. Its parallel NAND interface and ONFI-compatible command set make it straightforward to integrate into systems that require robust, non-volatile mass storage with predictable performance.

This device is well suited to engineers and designers building cost-effective embedded and storage solutions that demand reliable data integrity, efficient board utilization and clear endurance/data-retention characteristics as documented in the product datasheet.

Request a quote or submit an inquiry to receive pricing and availability for JS27HP8G08SDDA-45M today.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2000


    Headquarters: Jeju-si, Jeju-do, Republic of Korea


    Employees: 100+


    Revenue: $100 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up