JS27HP4G16SDDA-45

2K page 4-bit ECC 128 byte spare
Part Description

2K page 4-bit ECC 128 byte spare

Quantity 1,503 Available (as of June 17, 2026)
Product CategoryFlash Memory
ManufacturerJeju Semiconductor Corporation
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package63-BGA (9.0x11.0mm)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size4 GbitAccess Time45 nsGradeIndustrial
Clock Frequency22.22 MHzVoltage1.8VMemory TypeNon-Volatile
Operating Temperature-40°C - 85°CWrite Cycle Time Word Page300 µsMounting MethodSurface Mount
Memory InterfaceParallelMemory Organizationx16Moisture Sensitivity Level3
RoHS ComplianceCompliantECCNEAR99HTS Code8542.32.00.71

Overview of JS27HP4G16SDDA-45 – 2K page 4-bit ECC 128 byte spare

The JS27HP4G16SDDA-45 is a 4 Gbit SLC NAND flash memory device in a 63-ball FBGA package, optimized for industrial embedded storage. It provides a parallel x16 interface, 1.8 V supply, and on-device 4-bit ECC support for robust data integrity in industrial environments.

Designed for solid-state mass-storage and embedded applications, this device delivers fast read access and standard NAND features such as copy-back programming and internal cache read to improve throughput and simplify system integration.

Key Features

  • Memory Type & Density 4 Gbit Non-Volatile FLASH NAND (SLC) organized as x16 I/O.
  • Page & Spare (product designation) Product name indicates a 2K page with 128-byte spare area for error management and metadata.
  • On-Die ECC 4-bit ECC capability (series-level: 4-bit ECC per 264 words for x16 organization) to improve data reliability.
  • Performance Read access time of 45 ns and typical page program time of 300 µs (1.8 V operation).
  • Interface & Clock Parallel NAND interface with a listed clock frequency of 22.22 MHz for host timing reference.
  • Supply Voltage Low-voltage 1.8 V device operation (Vcc = 1.7 V ~ 1.95 V as specified in the series datasheet).
  • Package & Mounting 63-ball FBGA, 9.0 × 11.0 mm footprint, surface-mount package suitable for compact board designs.
  • Industrial Grade Temperature Rated for operation from −40 °C to 85 °C.
  • Reliability & Endurance Series-specified endurance of 100,000 program/erase cycles at −40 °C to 85 °C and typical data retention of 10 years.
  • ONFI 1.0 Command Set Series compliance with ONFI 1.0 command set for standardized NAND operation.
  • Additional NAND Features Copy-back program, cache read buffer, chip-enable don't-care support, status register, and hardware program/erase protection during power transitions.
  • Environmental RoHS compliant (lead-free & halogen-free material statement in series datasheet).

Typical Applications

  • Solid-State Mass Storage Use as primary flash memory for industrial storage appliances and embedded storage modules where SLC reliability is required.
  • Industrial Embedded Systems Non-volatile program and data storage in industrial controllers, data loggers, and automation equipment operating across −40 °C to 85 °C.
  • Firmware & Code Storage Reliable code storage and in-field firmware updates leveraging on-die ECC and copy-back programming.
  • High-Reliability Data Logging Retain sensor and system logs with extended data retention and endurance tailored for repeated program/erase cycles.

Unique Advantages

  • Industrial Temperature Rating: Specified −40 °C to 85 °C to meet the thermal requirements of industrial applications.
  • Low-Voltage Operation: 1.8 V supply reduces power envelope for battery-assisted and low-power systems.
  • On-Die 4-bit ECC: Built-in ECC per 264 words (x16) improves data integrity without external error-correction hardware.
  • High Endurance: 100,000 program/erase cycles at industrial temperature extends usable lifetime for frequent-write use cases.
  • Compact FBGA Package: 63-ball FBGA (9.0 × 11.0 mm) supports space-constrained PCB layouts while maintaining a parallel NAND interface.
  • NAND-Optimized Features: Copy-back programming, cache read buffer, and ONFI 1.0 command set facilitate efficient data movement and host integration.

Why Choose JS27HP4G16SDDA-45?

The JS27HP4G16SDDA-45 combines SLC NAND robustness, on-die 4-bit ECC, and industrial temperature rating to deliver a reliable flash memory solution for embedded and mass-storage applications. With a compact 63-FBGA package and low-voltage 1.8 V operation, it fits designs that require endurance, data integrity, and efficient board-level integration.

This device is suitable for engineers and procurement teams specifying flash for industrial controllers, data loggers, firmware storage, and other embedded systems that demand long-term data retention and high program/erase cycle life.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for JS27HP4G16SDDA-45. Our team can provide technical documentation and support for design integration and qualification.

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    Date Founded: 2000


    Headquarters: Jeju-si, Jeju-do, Republic of Korea


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    Revenue: $100 Million


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