JS27HU1G08SCDA-25
| Part Description |
2K page 4-bit ECC 64 byte spare |
|---|---|
| Quantity | 1,574 Available (as of June 17, 2026) |
| Product Category | Flash Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 63-BGA (9.0x11.0mm) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | 25 ns | Grade | Industrial | ||
| Clock Frequency | 40 MHz | Voltage | 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C - 85°C | Write Cycle Time Word Page | 300 µs | Mounting Method | Surface Mount | ||
| Memory Interface | Parallel | Memory Organization | x8 | Moisture Sensitivity Level | 3 | ||
| RoHS Compliance | Compliant | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of JS27HU1G08SCDA-25 – 2K page 4-bit ECC 64 byte spare
The JS27HU1G08SCDA-25 is a 1 Gbit SLC NAND Flash memory organized as x8 with 2K-byte main pages plus 64-byte spare area. It implements 4-bit ECC and a parallel NAND interface, offering a compact, industrial-temperature non-volatile storage option for embedded and mass-storage applications.
Designed for applications that require robust data retention and endurance, this device delivers predictable program/erase timing, a small-footprint 63-ball FBGA package, and operational support across a wide industrial temperature range.
Key Features
- Memory Capacity & Organization — 1 Gbit density, x8 organization with 2K-byte page and 64-byte spare for per-page metadata and ECC.
- 4-bit ECC — On-chip 4-bit ECC support as specified in the series, improving data integrity for NAND storage (4-bit ECC per 528 bytes for x8 organization).
- Performance — Sequential read cycle time as low as 25 ns (3.3V); random page read time up to 25 µs (1 Gbit); typical page program time 300 µs.
- Interface — Parallel NAND interface (x8) with ONFI 1.0 compliant command set for straightforward MCU/SoC integration.
- Endurance & Retention — Typical data retention of 10 years and endurance up to 100,000 program/erase cycles across the industrial temperature range (-40°C to 85°C) as specified for the series.
- Power Supply — 3.3V device support with VCC range 2.7 V to 3.6 V per the device series specification.
- Package & Mounting — 63-ball FBGA (9.0 × 11.0 × 1.0 mm) surface-mount package for compact board integration.
- Reliability & System Features — Fast block erase (typical 3 ms for 1 Gbit), cache read and copy-back program support to improve throughput and reduce external buffering.
Typical Applications
- Embedded Mass Storage — On-board non-volatile storage for firmware, logs, and user data where SLC endurance and 4-bit ECC improve longevity and data integrity.
- Industrial Controllers — Industrial-grade operating range (-40°C to 85°C) and high P/E endurance make this device suitable for factory automation and process control equipment.
- Consumer & Portable Devices — Compact FBGA package and parallel NAND interface provide a cost-effective storage building block for consumer electronics requiring reliable flash storage.
Unique Advantages
- High Endurance for Extended Field Life: Specified for up to 100,000 program/erase cycles at industrial temperatures, supporting long service life in demanding environments.
- Data Integrity with 4-bit ECC: Integrated ECC capability for error correction across each page/spare region, reducing system-level ECC complexity.
- Predictable Performance: Documented read, program and erase timings (25 ns sequential read, 300 µs program, ~3 ms block erase) enable predictable system throughput planning.
- Compact, Industry-Ready Package: 63-ball FBGA (9.0 × 11.0 mm) surface-mount package minimizes PCB area while supporting industrial-temperature operation.
- ONFI-Compatible Command Set: Familiar command set and parallel x8 interface simplify integration with existing NAND controllers and firmware stacks.
Why Choose JS27HU1G08SCDA-25?
This JS27HU1G08SCDA-25 part combines SLC NAND reliability, 4-bit ECC, and industrial temperature capability in a compact FBGA package, making it suitable for embedded designs that demand durable, long-lived non-volatile storage. Its documented timings, ONFI command compatibility, and high endurance make it a straightforward drop-in option for systems where predictable flash behavior and data integrity are priorities.
Engineers and procurement teams targeting robust mass-storage implementations or industrial embedded systems will find this device aligns technical reliability with compact board-level integration and clear performance parameters.
Request a quote or submit an inquiry to obtain pricing, availability, and support for integrating JS27HU1G08SCDA-25 into your designs.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH