JS27HP4G08SDDA-45M
| Part Description |
2K page 4-bit ECC 128 byte spare |
|---|---|
| Quantity | 1,485 Available (as of June 17, 2026) |
| Product Category | Flash Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 63-BGA (9.0x11.0mm) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4 Gbit | Access Time | 45 ns | Grade | Automotive | ||
| Clock Frequency | 22.22 MHz | Voltage | 1.8V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C - 105°C | Write Cycle Time Word Page | 300 µs | Mounting Method | Surface Mount | ||
| Memory Interface | Parallel | Memory Organization | x8 | Moisture Sensitivity Level | 3 | ||
| RoHS Compliance | Compliant | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of JS27HP4G08SDDA-45M – 2K page 4-bit ECC 128 byte spare
The JS27HP4G08SDDA-45M is a 4 Gbit SLC NAND flash memory configured with a 2K-byte page and a 128-byte spare area, incorporating 4-bit ECC for enhanced data integrity. It provides a parallel x8 interface and low-voltage operation (1.8 V), delivering a compact, high-density non-volatile storage element for embedded and mass-storage applications.
This device targets designs that require reliable page-based storage with built-in error correction, fast read access, and standard NAND commands for easy integration into solid-state storage and embedded memory systems.
Key Features
- Memory Core 4 Gbit SLC NAND flash organized as x8 I/O with 2K-byte main page size plus 128-byte spare area for metadata and ECC.
- Built-in ECC 4-bit ECC implemented per 528 bytes (x8) to improve raw NAND data integrity and extend usable device endurance.
- Performance Read access time of 45 ns (1.8 V device) and typical page program time of 300 µs, enabling responsive read/write operations for page-oriented workloads.
- Interface Parallel NAND interface (x8) with ONFI 1.0 compliant command set and support for copy-back programming and cache read to streamline data movement.
- Power Low-voltage 1.8 V supply (Vcc = 1.7 V–1.95 V), suitable for designs where reduced power rails are required.
- Reliability & Endurance Typical data retention of 10 years and endurance specified at 100,000 program/erase cycles (-40°C to 85°C) and 60,000 program/erase cycles (-40°C to 105°C) with 4-bit ECC applied.
- Package & Mounting 63-ball FBGA (63-BGA) package, 9.0 × 11.0 mm, surface-mount form factor for space-efficient board designs.
- Operating Range Specified operating temperature range: -40°C to 105°C.
- Compliance RoHS compliant; lead-free and halogen-free FBGA packaging.
Typical Applications
- Mass Storage Solutions Embedded solid-state storage where high-density page-based NAND and on-chip ECC reduce system-level error management.
- Embedded Systems Firmware and file system storage in consumer and industrial devices that benefit from 1.8 V operation and compact BGA mounting.
- Industrial Memory Data logging and industrial controllers requiring wide temperature operation and long data retention.
- Portable Devices Low-voltage handheld or battery-powered equipment that requires non-volatile, high-density storage in a small footprint.
Unique Advantages
- High-density SLC Storage: 4 Gbit capacity in a compact FBGA package provides significant on-board non-volatile storage without large PCB area.
- Integrated 4-bit ECC: On-device 4-bit ECC per 528 bytes improves effective media reliability and simplifies host-side error handling.
- Low-voltage Operation: 1.8 V supply reduces power rail complexity for modern low-voltage designs and helps lower system power consumption.
- Fast Page Access: 45 ns read cycle and 300 µs typical program time provide responsive performance for page-oriented read/write patterns.
- Robust Endurance & Retention: Documented program/erase endurance (up to 100,000 cycles in the -40°C to 85°C range) and 10-year data retention help ensure long-term data reliability.
- Compact Surface-Mount Package: 63-ball FBGA (9.0 × 11.0 mm) enables dense PCB layouts and straightforward surface-mount assembly.
Why Choose JS27HP4G08SDDA-45M?
The JS27HP4G08SDDA-45M combines SLC NAND density with on-chip 4-bit ECC, delivering a balance of capacity, data integrity, and compact packaging for embedded storage designs. Its low-voltage 1.8 V operation, fast page read characteristics, and support for standard NAND commands make it suitable for systems that require efficient, page-oriented non-volatile memory.
This device is well suited for engineers and procurement teams designing mass-storage and embedded memory solutions that demand verifiable endurance, long data retention, and a small board footprint—backed by RoHS-compliant packaging and a defined operating temperature range.
Request a quote or submit an inquiry to our sales team to get pricing, lead times, and availability for JS27HP4G08SDDA-45M.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH