IS42S16160B-7BL

IC DRAM 256MBIT PAR 54LFBGA
Part Description

IC DRAM 256MBIT PAR 54LFBGA

Quantity 1,332 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-LFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-LFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160B-7BL – IC DRAM 256MBIT PAR 54LFBGA

The IS42S16160B-7BL is a 256 Mbit synchronous DRAM (SDRAM) organized as 16M × 16 with a parallel LVTTL interface. It uses a pipelined, fully synchronous architecture with internal bank interleaving to support high-speed data transfers and efficient random-access burst operation.

Designed for systems that require a 256 Mbit SDRAM device in a compact 54-ball LFBGA package, the device supports a 143 MHz clock speed (–7 speed grade), a 5.4 ns access time (CAS = 3), 3.0–3.6 V supply range, and operation from 0 °C to 70 °C.

Key Features

  • Memory Type & Organization — 256 Mbit DRAM organized as 16M × 16 bits (quad-bank configuration) for parallel data paths and efficient memory mapping.
  • Synchronous Operation — Fully synchronous design with all signals referenced to the rising edge of CLK for predictable timing and pipeline transfers.
  • Clock & Timing — –7 speed grade supports 143 MHz clock frequency; CAS latency programmable to 2 or 3 clocks with a 5.4 ns access time at CAS = 3.
  • Burst Control & Addressing — Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (Sequential/Interleave). Random column address capability every clock cycle.
  • Bank Architecture & Refresh — Internal bank structure to hide row access/precharge times; supports Auto Refresh, Self Refresh, and 8K refresh cycles every 64 ms.
  • Interface & Voltage — LVTTL-compatible interface with a parallel memory interface; recommended supply range 3.0 V to 3.6 V (VDD/VDDQ at 3.3 V per device family specification).
  • Package & Temperature — 54-ball LFBGA (8 × 13) package in a compact footprint; specified operating temperature range 0 °C to 70 °C.

Typical Applications

  • Embedded system memory expansion — Provides 256 Mbit of synchronous DRAM capacity for systems requiring parallel memory with predictable timing and burst access.
  • High-speed buffering — Suited for designs needing rapid burst read/write buffering with programmable burst lengths and low access latency.
  • Memory subsystems in compact designs — The 54-ball LFBGA package makes the device appropriate where board space is constrained and dense memory is required.

Unique Advantages

  • Deterministic synchronous timing: Fully synchronous operation with CLK-referenced signals simplifies timing analysis and system integration.
  • Flexible performance tuning: Programmable CAS latency and burst length allow designers to match memory timing to system requirements.
  • Efficient random-access bursts: Internal bank interleaving and per-clock random column addressing support sustained high-throughput burst operations.
  • Robust refresh and power modes: Auto Refresh and Self Refresh modes with standard 8K/64 ms refresh cycles provide reliable data retention management.
  • Compact, production-ready package: 54-LFBGA (8×13) package offers a small footprint for space-limited board designs while delivering 256 Mbit density.

Why Choose IS42S16160B-7BL?

The IS42S16160B-7BL combines a synchronous, pipelined SDRAM architecture with programmable timing and burst control to deliver predictable high-speed memory behavior for designs that need 256 Mbit of parallel DRAM. Its quad-bank organization, support for Auto/Self Refresh, and LVTTL interface make it suitable for systems where controlled latency and burst throughput matter.

This device is appropriate for engineers specifying commercial-temperature SDRAM in a compact 54-ball LFBGA package and a 3.0–3.6 V supply domain. Its configurable timing and burst options help align memory performance with a range of embedded and high-throughput buffering applications.

Request a quote or contact our sales team to discuss availability, lead times, and pricing for IS42S16160B-7BL.

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