IS42S16320F-7TL

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 783 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320F-7TL - 512Mbit Synchronous DRAM

The IS42S16320F-7TL is a 512Mbit synchronous dynamic random access memory organized as 32M x 16 in a 54-pin TSOP II package. Built on proven SDRAM technology, this high-density parallel memory device operates at clock frequencies up to 143MHz with a 5.4ns access time, making it ideal for embedded systems, consumer electronics, and industrial applications requiring substantial data buffering and processing capabilities. Its 3.0V to 3.6V operating voltage range provides compatibility with a wide variety of system designs.

Key Features

  • High-Density Memory Organization - 512Mbit capacity organized as 32M x 16 provides ample storage for data-intensive applications while maintaining a straightforward parallel interface for reliable system integration.
  • Performance Specifications - 143MHz clock frequency with 5.4ns access time delivers responsive memory operations for real-time processing and buffering tasks in embedded systems.
  • Power Supply Range - 3.0V to 3.6V supply voltage enables seamless integration with standard 3.3V logic families and reduces design complexity in mixed-voltage systems.
  • Standard Operating Temperature - 0°C to 70°C (TA) temperature range suits commercial and consumer applications in controlled environments.
  • Compact Package - 54-pin TSOP II package with 10.16mm width offers space-efficient PCB layout options while maintaining standard through-hole or surface mount compatibility.
  • Parallel Interface - Direct memory access through parallel interface simplifies controller design and reduces software overhead compared to serial memory alternatives.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main memory or frame buffer storage in embedded processors and microcontrollers, where the 512Mbit capacity supports operating systems, application code, and data caching in single-board computers and IoT gateways.
  • Consumer Electronics - The device functions as display buffer memory in set-top boxes, digital televisions, and multimedia players where the parallel interface enables rapid data transfer for smooth video rendering and user interface responsiveness.
  • Networking Equipment - In routers, switches, and network processors, this memory provides packet buffering and routing table storage where the 143MHz operation keeps pace with data throughput requirements in enterprise network infrastructure.
  • Industrial Control Systems - The SDRAM supports data acquisition and processing in measurement instruments and control units operating within the 0°C to 70°C range, providing reliable temporary storage for sensor data and control algorithms.
  • Printer and Imaging Devices - This memory enables raster image processing and print spooling in laser printers and multifunction devices where high-density storage accommodates complex page layouts and graphics rendering.

Unique Advantages

  • Proven SDRAM Architecture: Synchronous operation eliminates timing uncertainties inherent in asynchronous designs, simplifying controller logic and improving system reliability.
  • Single-Voltage Operation: Unified 3.0V to 3.6V supply reduces power rail requirements and simplifies board design compared to dual-supply memory solutions.
  • Industry-Standard Pinout: TSOP II package follows established footprint conventions, enabling drop-in replacement scenarios and second-source options during production.
  • Cost-Effective Density: 512Mbit capacity in a single package reduces component count and board space requirements compared to multiple lower-density chips.
  • Parallel Interface Efficiency: Direct memory access eliminates protocol overhead and reduces CPU intervention compared to serial memory technologies, freeing processor resources for application tasks.
  • Active Lifecycle Status: Current production availability ensures long-term supply continuity for new designs and ongoing manufacturing programs.

Why Choose IS42S16320F-7TL?

The IS42S16320F-7TL represents a practical choice for designs requiring substantial volatile memory in a cost-effective package. Its combination of 512Mbit capacity, standard SDRAM interface, and commercial temperature range makes it particularly suitable for consumer electronics, embedded systems, and industrial equipment where proven technology and reliable supply matter more than cutting-edge specifications. The device's active lifecycle status and industry-standard packaging reduce supply chain risk and facilitate second-sourcing strategies.

For engineering teams balancing performance requirements with budget constraints, this SDRAM offers a straightforward path to adequate memory capacity without the complexity of newer memory technologies. The parallel interface simplifies both hardware design and firmware development, while the 54-pin TSOP II package provides flexible mounting options for various board layouts.

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Contact our sales team to request pricing and availability for the IS42S16320F-7TL. We can provide technical support for integration, volume pricing options, and delivery schedules tailored to your production timeline.

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