IS42S32400J-6TL

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 1,089 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization4M x 32
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS42S32400J-6TL – IC DRAM 128MBIT PAR 86TSOP II

The IS42S32400J-6TL from ISSI is a 128 Mbit volatile SDRAM organized as 4M × 32 with a LVTTL memory interface. It is supplied in an 86-TSOP II (86-TFSOP, 0.400", 10.16 mm width) package and operates from a 3.0 V to 3.6 V supply.

Designed for applications requiring external DRAM, the device offers a 166 MHz clock frequency and a 5.4 ns access time in a compact TSOP II footprint suitable for space-constrained board designs.

Key Features

  • Memory Type Volatile SDRAM (DRAM format) for external system memory.
  • Capacity & Organization 128 Mbit total capacity organized as 4M × 32.
  • Performance 166 MHz clock frequency with a 5.4 ns access time for fast memory accesses.
  • Interface LVTTL memory interface for logic-level connectivity.
  • Power Voltage supply range of 3.0 V to 3.6 V.
  • Package 86-TSOP II / 86-TFSOP (0.400", 10.16 mm width) surface-mount package.
  • Operating Temperature Commercial ambient range 0°C to 70°C (TA).
  • Mounting Type Volatile memory device (DRAM).

Typical Applications

  • External DRAM for digital systems Provides 128 Mbit SDRAM storage using a 4M × 32 organization and LVTTL interface for designs that require external volatile memory.
  • Compact board-level memory TSOP II package (86 pins, 10.16 mm width) suits space-constrained printed circuit board layouts.
  • 3.3 V logic systems Operates from a 3.0 V to 3.6 V supply, compatible with standard 3.3 V system rails.

Unique Advantages

  • High-speed operation: 166 MHz clock frequency and 5.4 ns access time enable faster memory transactions compared with lower-speed DRAM options.
  • Wide data path (×32): 4M × 32 organization provides a 32-bit data interface for efficient bus utilization.
  • LVTTL interface: Simplifies integration with TTL-logic systems and common memory controllers.
  • Compact TSOP II package: 86-TSOP II (0.400", 10.16 mm width) supports dense board layouts while maintaining standard surface-mount assembly.
  • Standard supply range: 3.0 V to 3.6 V operation aligns with common 3.3 V power domains.
  • Commercial temperature range: Rated 0°C to 70°C for typical commercial electronics environments.

Why Choose IC DRAM 128MBIT PAR 86TSOP II?

The IS42S32400J-6TL delivers a straightforward, specification-driven SDRAM solution: 128 Mbit capacity in a 4M × 32 organization, with a 166 MHz clock and 5.4 ns access time in an 86-TSOP II package. These characteristics make it suitable for designs that need compact, board-level volatile memory with LVTTL interfacing and standard 3.3 V power.

Manufactured by ISSI (Integrated Silicon Solution Inc), the device is positioned for engineers and procurement teams seeking a defined-performance SDRAM component for commercial-temperature applications where a 128 Mbit DRAM is required.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the IS42S32400J-6TL.

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