IS42S32400J-6BL

IC DRAM 128MBIT PAR 90TFBGA
Part Description

IC DRAM 128MBIT PAR 90TFBGA

Quantity 1,369 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization4M x 32
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS42S32400J-6BL – IC DRAM 128MBIT PAR 90TFBGA

The IS42S32400J-6BL is a 128 Mbit synchronous DRAM (SDRAM) device organized as 4M × 32. It implements a standard SDRAM architecture in a compact 90-TFBGA (8×13) package for board-level memory integration.

Designed for systems that require moderate-speed synchronous DRAM, the device provides a 166 MHz clock capability, LVTTL interface signaling, and a 3.0 V to 3.6 V supply window to simplify power design and integration into existing memory subsystems.

Key Features

  • Memory Architecture Organized as 4M × 32 to provide 128 Mbit of SDRAM capacity suitable for 32-bit bus configurations.
  • SDRAM Technology Volatile SDRAM memory format supporting synchronous operation for predictable timing.
  • Performance 166 MHz clock frequency and a specified access time of 5.4 ns for moderate-speed memory access.
  • Interface LVTTL memory interface for logic-level signaling compatibility with common system designs.
  • Power Operates from a 3.0 V to 3.6 V supply range to match common 3 V memory power rails.
  • Package 90-TFBGA (8×13) package case for compact board mounting and high pin density.
  • Operating Temperature Specified for 0°C to 70°C (TA) ambient operating range.

Typical Applications

  • Embedded Systems — Provides on-board SDRAM for processors and controllers that require 128 Mbit of external memory in a compact package.
  • Buffering and Frame Memory — Suited for designs needing a moderate-speed memory buffer using a 32-bit organization and 166 MHz clocking.
  • Consumer Electronics — Integration into compact consumer devices where board area and a 90-TFBGA package are design priorities.

Unique Advantages

  • Compact BGA Footprint: The 90-TFBGA (8×13) package minimizes PCB area while providing high pin count for system integration.
  • 32‑bit Organization: 4M × 32 arrangement simplifies interfacing to 32-bit memory buses without additional address translation.
  • Synchronous Operation: SDRAM architecture with 166 MHz clocking supports deterministic timing for system memory operations.
  • Standard LVTTL Interface: Logic-level signaling eases compatibility with common system I/O standards.
  • Broad 3.0–3.6 V Supply Range: Flexibility to operate across common 3 V memory power rails.
  • Qualified Operating Range: Specified 0°C to 70°C (TA) for typical commercial temperature environments.

Why Choose IS42S32400J-6BL?

The IS42S32400J-6BL delivers a straightforward 128 Mbit SDRAM solution with a 4M × 32 organization, synchronous operation at up to 166 MHz, and LVTTL signaling in a compact 90-TFBGA package. It is positioned for designs that require moderate-speed external memory with predictable timing and a small PCB footprint.

This device is suited to engineers designing embedded systems, buffering/graphics memory, and compact consumer electronics where standard 3.0 V memory operation and a commercial temperature range are acceptable. Its specification-focused design simplifies system-level integration and long-term maintenance by relying on well-defined electrical and timing characteristics.

Request a quote or contact sales to discuss availability, lead times, and to obtain ordering information for the IS42S32400J-6BL.

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