IS43R16160F-6BLI

IC DRAM 256MBIT PAR 60TFBGA
Part Description

IC DRAM 256MBIT PAR 60TFBGA

Quantity 729 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeIndustrial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS43R16160F-6BLI - 256Mbit DDR SDRAM

The IS43R16160F-6BLI is a 256-megabit synchronous dynamic random access memory (SDRAM) chip designed with DDR (Double Data Rate) technology. Organized as 16M x 16, this memory device delivers reliable data storage and fast access times for embedded systems and industrial applications. With a 166MHz clock frequency and extended temperature range, it provides dependable memory performance in demanding environments.

Key Features

  • DDR SDRAM Technology - Double Data Rate architecture transfers data on both rising and falling clock edges, effectively doubling bandwidth compared to single data rate memory while maintaining the same clock frequency.
  • Memory Configuration - 256Mbit capacity organized as 16M x 16 configuration provides flexible memory architecture suitable for various data-width requirements in embedded systems.
  • Performance Specifications - 166MHz clock frequency with 7 nanosecond access time and 15 nanosecond write cycle time ensures responsive memory operations for time-sensitive applications.
  • Power Efficiency - Operates on 2.3V to 2.7V supply voltage, reducing power consumption while maintaining performance.
  • Extended Temperature Range - -40°C to 85°C operating temperature range supports reliable operation in industrial and automotive environments.
  • Compact Package - 60-pin TFBGA (8mm x 13mm) package offers small footprint for space-constrained designs.

Typical Applications

  • Industrial Control Systems - This DDR SDRAM provides the working memory for PLCs, industrial PCs, and automation controllers where the extended temperature tolerance ensures stable operation in factory floor environments with temperature fluctuations.
  • Networking Equipment - The parallel interface and fast access times make this memory suitable for routers, switches, and network appliances that require buffer memory for packet processing and data routing operations.
  • Test and Measurement Instruments - The 256Mbit capacity and reliable performance support data acquisition systems and measurement devices that need temporary storage for captured data before processing or transmission.
  • Medical Devices - Industrial-grade temperature range and stable voltage operation make this memory appropriate for medical equipment that requires dependable data storage during diagnostic and monitoring procedures.
  • Embedded Computing - Serves as system memory in embedded computers, single-board computers, and processor modules where moderate density and parallel interface align with system architecture requirements.

Unique Advantages

  • Wide Temperature Tolerance: The -40°C to 85°C operating range eliminates the need for additional thermal management in many industrial applications, simplifying system design and reducing BOM costs.
  • Proven DDR Technology: Mature DDR SDRAM architecture offers well-understood timing characteristics and broad software support, reducing development time and integration risk.
  • Parallel Interface Compatibility: Direct parallel bus connection simplifies integration with processors and controllers that feature native parallel memory interfaces without requiring protocol conversion.
  • Balanced Performance: 166MHz clock frequency and 7ns access time deliver sufficient bandwidth for control and communication applications without the power overhead of higher-speed alternatives.
  • Space-Efficient Packaging: The 60-TFBGA footprint of 8mm x 13mm provides higher density than DIP or TSOP packages, enabling more compact board layouts.
  • Active Lifecycle Status: Current production availability supports new designs and ensures supply continuity for product lifecycles extending several years.

Why Choose IS43R16160F-6BLI?

The IS43R16160F-6BLI offers a practical balance of capacity, performance, and environmental tolerance for industrial and embedded applications. Its 256Mbit density matches the working memory requirements of many control systems, communication devices, and data acquisition platforms without over-provisioning. The extended temperature rating and stable voltage operation reduce the need for additional protection circuitry, streamlining designs and improving reliability.

For engineers developing industrial equipment, networking products, or embedded systems with parallel memory interfaces, this DDR SDRAM provides proven technology with predictable behavior and active supply availability. The compact TFBGA package supports modern high-density board designs while the mature DDR architecture ensures compatibility with existing development tools and software drivers.

Get Started Today

Contact our sales team to discuss your memory requirements and request a quote for the IS43R16160F-6BLI. Our technical support staff can provide additional specifications, integration guidance, and sample availability to help you evaluate this memory solution for your next design.

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