IS43R16160F-5TLI
| Part Description |
IC DRAM 256MBIT PAR 66TSOP II |
|---|---|
| Quantity | 318 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS43R16160F-5TLI - 256Mbit DDR SDRAM
The IS43R16160F-5TLI is a high-performance 256Mbit DDR SDRAM from ISSI, Integrated Silicon Solution Inc. Organized as 16M x 16, this volatile memory delivers reliable data storage for embedded systems and computing applications. With a 200MHz clock frequency and 7ns access time, it provides the speed and responsiveness required for real-time data processing. Offered in a compact 66-TSOP II package, this memory solution balances performance with board-level efficiency.
Key Features
- High-Density Memory Architecture - 256Mbit capacity organized as 16M x 16 provides substantial data storage while maintaining a manageable memory footprint for space-constrained designs.
- DDR SDRAM Technology - Double Data Rate architecture transfers data on both rising and falling clock edges, effectively doubling throughput compared to single data rate memory.
- 200MHz Clock Operation - Operating frequency of 200MHz with 7ns access time ensures rapid data retrieval for time-sensitive applications.
- Parallel Memory Interface - Direct parallel connection simplifies integration with processors and controllers that support standard SDRAM protocols.
- Industrial Temperature Range - Qualified for -40°C to 85°C operation, making it suitable for demanding environmental conditions beyond consumer-grade applications.
- Compact 66-TSOP II Package - 0.400" (10.16mm) width package provides high pin count in a space-efficient form factor for dense PCB layouts.
- Low Voltage Operation - 2.3V to 2.7V supply voltage reduces power consumption and thermal output in battery-powered or thermally-sensitive designs.
Typical Applications
- Industrial Control Systems - This DDR SDRAM serves as main memory in PLCs, motion controllers, and HMI terminals where the extended temperature range ensures reliable operation in factory floor environments and the parallel interface simplifies integration with industrial processors.
- Embedded Computing Platforms - Provides system memory for single-board computers and embedded modules where the 256Mbit capacity supports moderate operating system and application requirements while the compact package conserves board space.
- Communications Equipment - Functions as buffer memory in routers, switches, and network appliances where the 200MHz operation supports packet processing throughput and the industrial temperature rating accommodates equipment closet installations.
- Test and Measurement Instruments - Offers data storage for oscilloscopes, spectrum analyzers, and data acquisition systems where fast access times enable high-speed sampling and the wide temperature range supports field deployment.
- Medical Devices - Serves as working memory in diagnostic equipment and patient monitoring systems where reliable operation across temperature variations supports diverse installation environments from hospitals to mobile medical units.
Unique Advantages
- Proven DDR Technology: Standard DDR SDRAM architecture ensures broad compatibility with existing controller designs and reduces development risk compared to proprietary memory interfaces.
- Extended Temperature Qualification: -40°C to 85°C operation eliminates the need for active cooling in many industrial applications, reducing system complexity and maintenance requirements.
- Optimized Memory Density: 256Mbit capacity provides sufficient memory for mid-range embedded applications without the cost premium of higher-density parts, helping control BOM costs.
- Space-Efficient Packaging: 66-TSOP II form factor delivers a practical balance between pin count and board footprint, enabling compact designs without resorting to more expensive fine-pitch packages.
- Low Voltage Design: 2.3V to 2.7V operation reduces power consumption compared to older memory technologies, extending battery life in portable applications and lowering thermal management requirements.
- Fast Data Access: 7ns access time with 200MHz operation supports responsive system performance for applications requiring quick data retrieval and minimal latency.
Why Choose IS43R16160F-5TLI?
The IS43R16160F-5TLI addresses the memory requirements of industrial and embedded systems that demand reliability across challenging operating conditions. Its industrial temperature rating and standard DDR interface make it a practical choice for designers developing equipment that must function in uncontrolled environments while maintaining compatibility with conventional memory controllers. The 256Mbit density hits a sweet spot for applications that need more than basic memory capacity but don't require the expense of high-density parts.
For design teams prioritizing long-term availability and predictable performance, this ISSI memory component delivers tested DDR SDRAM technology in a package configuration that balances density, thermal characteristics, and board space efficiency. Whether integrating into new designs or supporting existing platforms, the IS43R16160F-5TLI provides a reliable memory foundation for industrial computing applications.
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