IS43R16160F-5TL
| Part Description |
IC DRAM 256MBIT PAR 66TSOP II |
|---|---|
| Quantity | 680 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS43R16160F-5TL – IC DRAM 256MBIT PAR 66TSOP II
The IS43R16160F-5TL is a 256 Mbit volatile DRAM organized as 16M × 16 and implemented as DDR SDRAM with a parallel memory interface. It delivers system memory in a compact 66‑TSOP II package and operates from a 2.3 V to 2.7 V supply.
This device is suitable for designs that require a parallel DDR memory element with a 200 MHz clock capability, 700 ps access time, and a specified operating temperature range of 0°C to 70°C.
Key Features
- Memory Architecture 256 Mbit DRAM organized as 16M × 16 with a parallel DDR SDRAM architecture for word-wide data paths.
- Performance Supports a clock frequency of 200 MHz with an access time of 700 ps and a write cycle time (word/page) of 15 ns.
- Power Operates from a 2.3 V to 2.7 V supply range, providing defined operating voltages for system integration.
- Package Supplied in a 66‑TSSOP / 66‑TSOP II package (0.400" / 10.16 mm width) suitable for board-level mounting where a compact surface-mount memory package is required.
- Environmental / Operating Range Rated for an ambient operating temperature range of 0°C to 70°C (TA).
- Memory Interface Parallel memory interface suitable for systems designed to use parallel DDR SDRAM devices.
Typical Applications
- System Memory Acts as volatile parallel DDR SDRAM for designs requiring 256 Mbit of working memory in a compact package.
- Board-Level Memory Expansion Used on PCBs to add parallel DRAM capacity where a 66‑TSOP II footprint is preferred.
- Embedded Systems Integrates into embedded devices that need a defined operating temperature range (0°C to 70°C) and a 2.3 V–2.7 V supply.
Unique Advantages
- Compact 66‑TSOP II package: Provides a narrow (10.16 mm) surface-mount footprint for space-constrained board designs.
- Parallel DDR architecture: 16M × 16 organization and parallel interface support straightforward word-wide memory implementations.
- Defined performance parameters: 200 MHz clock frequency, 700 ps access time, and 15 ns write cycle time give clear timing characteristics for system design.
- Low-voltage operation: 2.3 V to 2.7 V supply range enables integration with systems targeting reduced core voltages.
- Commercial temperature rating: 0°C to 70°C ambient rating aligns with standard commercial applications and system environments.
Why Choose IC DRAM 256MBIT PAR 66TSOP II?
The IS43R16160F-5TL provides a defined, compact DDR SDRAM option for designs that require 256 Mbit of volatile parallel memory with clear electrical and timing specifications. Its 16M × 16 organization, 200 MHz clock capability, and 66‑TSOP II package make it straightforward to integrate into board-level memory implementations.
This device is well suited to engineers and procurement teams specifying parallel DRAM components for commercial-temperature systems that operate within a 2.3 V–2.7 V supply window and require explicit access time and cycle-time characteristics for timing budgets.
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