IS43R16160F-5TL

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 680 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS43R16160F-5TL – IC DRAM 256MBIT PAR 66TSOP II

The IS43R16160F-5TL is a 256 Mbit volatile DRAM organized as 16M × 16 and implemented as DDR SDRAM with a parallel memory interface. It delivers system memory in a compact 66‑TSOP II package and operates from a 2.3 V to 2.7 V supply.

This device is suitable for designs that require a parallel DDR memory element with a 200 MHz clock capability, 700 ps access time, and a specified operating temperature range of 0°C to 70°C.

Key Features

  • Memory Architecture  256 Mbit DRAM organized as 16M × 16 with a parallel DDR SDRAM architecture for word-wide data paths.
  • Performance  Supports a clock frequency of 200 MHz with an access time of 700 ps and a write cycle time (word/page) of 15 ns.
  • Power  Operates from a 2.3 V to 2.7 V supply range, providing defined operating voltages for system integration.
  • Package  Supplied in a 66‑TSSOP / 66‑TSOP II package (0.400" / 10.16 mm width) suitable for board-level mounting where a compact surface-mount memory package is required.
  • Environmental / Operating Range  Rated for an ambient operating temperature range of 0°C to 70°C (TA).
  • Memory Interface  Parallel memory interface suitable for systems designed to use parallel DDR SDRAM devices.

Typical Applications

  • System Memory  Acts as volatile parallel DDR SDRAM for designs requiring 256 Mbit of working memory in a compact package.
  • Board-Level Memory Expansion  Used on PCBs to add parallel DRAM capacity where a 66‑TSOP II footprint is preferred.
  • Embedded Systems  Integrates into embedded devices that need a defined operating temperature range (0°C to 70°C) and a 2.3 V–2.7 V supply.

Unique Advantages

  • Compact 66‑TSOP II package: Provides a narrow (10.16 mm) surface-mount footprint for space-constrained board designs.
  • Parallel DDR architecture: 16M × 16 organization and parallel interface support straightforward word-wide memory implementations.
  • Defined performance parameters: 200 MHz clock frequency, 700 ps access time, and 15 ns write cycle time give clear timing characteristics for system design.
  • Low-voltage operation: 2.3 V to 2.7 V supply range enables integration with systems targeting reduced core voltages.
  • Commercial temperature rating: 0°C to 70°C ambient rating aligns with standard commercial applications and system environments.

Why Choose IC DRAM 256MBIT PAR 66TSOP II?

The IS43R16160F-5TL provides a defined, compact DDR SDRAM option for designs that require 256 Mbit of volatile parallel memory with clear electrical and timing specifications. Its 16M × 16 organization, 200 MHz clock capability, and 66‑TSOP II package make it straightforward to integrate into board-level memory implementations.

This device is well suited to engineers and procurement teams specifying parallel DRAM components for commercial-temperature systems that operate within a 2.3 V–2.7 V supply window and require explicit access time and cycle-time characteristics for timing budgets.

Request a quote or submit an inquiry to obtain pricing, availability, and sample information for the IS43R16160F-5TL.

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