IS45S32400B-6TLA1-TR

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 257 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS45S32400B-6TLA1-TR - 128Mbit Parallel SDRAM

The IS45S32400B-6TLA1-TR is a 128Mbit synchronous DRAM configured as 4M x 32 architecture. Operating at 166MHz clock frequency with 5.4ns access time, this parallel SDRAM delivers reliable volatile memory performance for embedded systems requiring standard-voltage operation across extended temperature ranges from -40°C to 85°C.

Key Features

  • Memory Configuration - 128Mbit capacity organized as 4M x 32, providing flexible data path width for 32-bit processor interfaces and system architectures requiring parallel memory access.
  • Performance Specifications - 166MHz clock frequency with 5.4ns access time delivers responsive memory operations for time-sensitive embedded applications and control systems.
  • Power Requirements - Standard voltage operation from 3V to 3.6V simplifies power supply design and enables compatibility with common 3.3V logic families and microcontroller platforms.
  • Extended Temperature Range - -40°C to 85°C operating temperature supports deployment in industrial environments, automotive systems, and outdoor equipment subject to temperature variation.
  • Package Format - 86-pin TSOP II package (0.400", 10.16mm width) provides industry-standard footprint with through-hole mounting compatibility for established board designs and legacy system upgrades.

Typical Applications

  • Industrial Control Systems - This SDRAM serves as main system memory in programmable logic controllers (PLCs) and industrial PCs where the extended temperature range ensures reliable operation in factory floor environments with variable thermal conditions.
  • Embedded Computing Platforms - The 4M x 32 organization matches 32-bit processor data paths in embedded systems running real-time operating systems, providing sufficient memory for program execution and data buffering in compact form factors.
  • Test and Measurement Equipment - The parallel interface and moderate clock frequency support data acquisition and processing in benchtop instruments where the TSOP II package facilitates through-hole assembly and field serviceability.
  • Legacy System Maintenance - This SDRAM enables replacement and repair of existing designs utilizing parallel memory architecture, maintaining continuity for established product lines requiring memory component sourcing.

Unique Advantages

  • Proven Parallel Interface: Standard SDRAM protocol eliminates the need for specialized controllers, reducing design complexity and enabling integration with widely-available memory interface IP and reference designs.
  • Moderate Density for Embedded Use: 128Mbit capacity provides adequate memory for embedded applications without over-specifying requirements, helping manage component costs in cost-sensitive designs.
  • Industry-Standard Package: TSOP II packaging maintains compatibility with established board layouts and manufacturing processes, enabling drop-in replacement scenarios and minimizing PCB redesign efforts.
  • Extended Temperature Operation: -40°C to 85°C range supports industrial-grade applications without requiring temperature derating or additional thermal management components.
  • 3.3V Operation: Standard voltage compatibility reduces power supply complexity by allowing shared rails with other 3.3V logic and peripheral components.
  • Established Technology: Mature SDRAM technology offers well-understood electrical characteristics and timing parameters, simplifying validation and integration into existing system architectures.

Why Choose IS45S32400B-6TLA1-TR?

The IS45S32400B-6TLA1-TR addresses requirements for parallel SDRAM in embedded and industrial systems where established memory architectures and extended temperature operation are priorities. This component suits designs prioritizing proven technology over higher-density or higher-performance alternatives, particularly in scenarios where legacy compatibility, moderate capacity requirements, and industrial-grade temperature specifications align with system needs.

For applications requiring parallel memory interfaces with 32-bit data paths and industrial temperature tolerance, this SDRAM provides a straightforward integration path with industry-standard packaging and voltage operation.

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Contact our sales team for pricing, availability, and technical support for the IS45S32400B-6TLA1-TR. Our specialists can assist with component selection, integration guidance, and volume requirements for your embedded memory applications.

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