MT29F64G08AKCBBH2-12:B TR
| Part Description |
IC FLASH 64GBIT PARALLEL 100TBGA |
|---|---|
| Quantity | 162 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08AKCBBH2-12:B TR – IC FLASH 64GBIT PARALLEL 100TBGA
The MT29F64G08AKCBBH2-12:B TR is a 64 Gbit non-volatile NAND flash memory device provided in a 100‑TBGA package. It uses FLASH – NAND technology with an 8G × 8 memory organization and a parallel memory interface.
With a 2.7 V to 3.6 V supply range, 83 MHz clock frequency, and an operating ambient temperature range of 0°C to 70°C, this device is intended for compact board-level applications that require parallel NAND flash storage in a 100‑TBGA (12×18) footprint.
Key Features
- Memory Type & Capacity Non-volatile FLASH – NAND memory with a capacity of 64 Gbit organized as 8G × 8.
- Memory Interface Parallel interface for direct bus integration with compatible host controllers.
- Clock Frequency Supports operation with an 83 MHz clock frequency.
- Voltage Supply Operates from 2.7 V to 3.6 V, enabling compatibility with standard 3 V systems.
- Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).
- Package Supplied in a compact 100‑TBGA package, specified as 12×18 mm footprint.
Typical Applications
- Embedded Storage — Provides non-volatile NAND flash capacity for board-level embedded storage where a parallel interface and compact TBGA package are required.
- Consumer Devices — Suited to consumer electronics designs that operate within a 0°C to 70°C ambient range and use a 3 V supply rail.
- System Memory Expansion — Can serve as parallel NAND memory for systems needing 64 Gbit density in a 100‑TBGA package footprint.
Unique Advantages
- High-density storage: 64 Gbit capacity in an 8G × 8 organization enables substantial non-volatile storage in a single device.
- Parallel interface compatibility: The parallel memory interface allows integration with legacy or parallel-host architectures.
- Compact TBGA package: 100‑TBGA (12×18) packaging provides a small board footprint for space-constrained designs.
- Broad supply range: 2.7 V to 3.6 V operation supports typical 3 V system power rails.
- Defined operating window: Specified 0°C to 70°C ambient rating clarifies environmental limits for design planning.
Why Choose MT29F64G08AKCBBH2-12:B TR?
The MT29F64G08AKCBBH2-12:B TR combines 64 Gbit NAND flash capacity with a parallel interface and compact 100‑TBGA packaging to address board-level designs that require dense non-volatile memory in a small footprint. Its supply voltage range and defined operating temperature make it straightforward to integrate into systems using standard 3 V rails and room-temperature environments.
This device is suited for designers and procurement teams seeking a verified NAND flash component with clear electrical and mechanical specifications for applications requiring parallel memory connectivity and high-density storage, offering predictable integration into existing board layouts.
Request a quote or submit an inquiry to obtain pricing, lead-time, and availability information for the MT29F64G08AKCBBH2-12:B TR.