MT29F64G08AKCBBH2-12:B TR

IC FLASH 64GBIT PARALLEL 100TBGA
Part Description

IC FLASH 64GBIT PARALLEL 100TBGA

Quantity 162 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-TBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08AKCBBH2-12:B TR – IC FLASH 64GBIT PARALLEL 100TBGA

The MT29F64G08AKCBBH2-12:B TR is a 64 Gbit non-volatile NAND flash memory device provided in a 100‑TBGA package. It uses FLASH – NAND technology with an 8G × 8 memory organization and a parallel memory interface.

With a 2.7 V to 3.6 V supply range, 83 MHz clock frequency, and an operating ambient temperature range of 0°C to 70°C, this device is intended for compact board-level applications that require parallel NAND flash storage in a 100‑TBGA (12×18) footprint.

Key Features

  • Memory Type & Capacity Non-volatile FLASH – NAND memory with a capacity of 64 Gbit organized as 8G × 8.
  • Memory Interface Parallel interface for direct bus integration with compatible host controllers.
  • Clock Frequency Supports operation with an 83 MHz clock frequency.
  • Voltage Supply Operates from 2.7 V to 3.6 V, enabling compatibility with standard 3 V systems.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).
  • Package Supplied in a compact 100‑TBGA package, specified as 12×18 mm footprint.

Typical Applications

  • Embedded Storage — Provides non-volatile NAND flash capacity for board-level embedded storage where a parallel interface and compact TBGA package are required.
  • Consumer Devices — Suited to consumer electronics designs that operate within a 0°C to 70°C ambient range and use a 3 V supply rail.
  • System Memory Expansion — Can serve as parallel NAND memory for systems needing 64 Gbit density in a 100‑TBGA package footprint.

Unique Advantages

  • High-density storage: 64 Gbit capacity in an 8G × 8 organization enables substantial non-volatile storage in a single device.
  • Parallel interface compatibility: The parallel memory interface allows integration with legacy or parallel-host architectures.
  • Compact TBGA package: 100‑TBGA (12×18) packaging provides a small board footprint for space-constrained designs.
  • Broad supply range: 2.7 V to 3.6 V operation supports typical 3 V system power rails.
  • Defined operating window: Specified 0°C to 70°C ambient rating clarifies environmental limits for design planning.

Why Choose MT29F64G08AKCBBH2-12:B TR?

The MT29F64G08AKCBBH2-12:B TR combines 64 Gbit NAND flash capacity with a parallel interface and compact 100‑TBGA packaging to address board-level designs that require dense non-volatile memory in a small footprint. Its supply voltage range and defined operating temperature make it straightforward to integrate into systems using standard 3 V rails and room-temperature environments.

This device is suited for designers and procurement teams seeking a verified NAND flash component with clear electrical and mechanical specifications for applications requiring parallel memory connectivity and high-density storage, offering predictable integration into existing board layouts.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability information for the MT29F64G08AKCBBH2-12:B TR.

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