MT29F64G08AKCCBH2-10Z:C

IC FLASH 64GBIT PARALLEL 100TBGA
Part Description

IC FLASH 64GBIT PARALLEL 100TBGA

Quantity 706 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-TBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08AKCCBH2-10Z:C – IC FLASH 64GBIT PARALLEL 100TBGA

The MT29F64G08AKCCBH2-10Z:C is a 64 Gbit non-volatile NAND flash memory device provided by Micron Technology Inc. It implements FLASH - NAND memory organized as 8G × 8 and presents a parallel memory interface.

Designed for systems that require parallel NAND flash storage, the device combines a 64 Gbit capacity with a 100 MHz clock interface, a 100-TBGA (12×18) package footprint, and a 2.7 V–3.6 V supply voltage range to support compact board-level integration within ambient operating conditions of 0°C–70°C.

Key Features

  • Memory Type Non-volatile FLASH - NAND memory with a storage capacity of 64 Gbit, organized as 8G × 8.
  • Interface & Performance Parallel memory interface with a clock frequency rating of 100 MHz for system integration that uses parallel NAND connectivity.
  • Voltage Supply Operates from a 2.7 V to 3.6 V supply range, enabling compatibility with common 3 V system domains.
  • Package 100-TBGA package (12×18 mm) providing a compact BGA form factor for high-density board designs.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA), suitable for standard commercial temperature environments.

Typical Applications

  • Embedded storage modules Provides parallel NAND flash capacity for embedded systems requiring up to 64 Gbit of non-volatile storage.
  • Firmware and code storage Used where parallel FLASH memory is required to store firmware, boot code, or system images.
  • Data logging and buffering Suitable for applications that need reliable non-volatile buffering or local data retention in a compact package.

Unique Advantages

  • High-density storage: 64 Gbit capacity in a single device reduces board-level component count for large local storage needs.
  • Compact BGA footprint: 100-TBGA (12×18) package enables integration into space-constrained designs while supporting high pin density.
  • Standard supply voltage: 2.7 V–3.6 V operation aligns with common 3 V system rails for straightforward power domain integration.
  • Parallel interface with 100 MHz clock: Parallel connectivity and specified 100 MHz clock frequency simplify interfacing in parallel-NAND architectures.
  • Commercial temperature rating: 0°C–70°C operating range for deployments in standard commercial environments.

Why Choose MT29F64G08AKCCBH2-10Z:C?

The MT29F64G08AKCCBH2-10Z:C positions itself as a straightforward, high-density parallel NAND flash option for designs that require 64 Gbit of non-volatile storage in a compact BGA package. Its 100 MHz clock rating, 2.7 V–3.6 V supply range, and 100-TBGA (12×18) footprint make it suitable for embedded systems, firmware storage, and data buffering applications within the specified 0°C–70°C operating range.

Manufactured by Micron Technology Inc., the device is intended for customers seeking a verified parallel FLASH - NAND memory component that matches standard commercial operating conditions and board-level form-factor constraints.

Request a quote or contact sales to discuss pricing, availability, and delivery for the MT29F64G08AKCCBH2-10Z:C.

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