MT29F64G08AMCBBH2-12IT:B

IC FLASH 64GBIT PARALLEL 100TBGA
Part Description

IC FLASH 64GBIT PARALLEL 100TBGA

Quantity 1,627 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-TBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08AMCBBH2-12IT:B – IC FLASH 64GBIT PARALLEL 100TBGA

The MT29F64G08AMCBBH2-12IT:B is a 64 Gbit non-volatile FLASH NAND memory device organized as 8G × 8 with a parallel memory interface. It provides board-level, high-density NAND storage in a compact 100-TBGA (12×18) package.

Designed for systems that require parallel FLASH memory with a defined clock and wide operating conditions, the device supports a 2.7 V to 3.6 V supply range and an operating ambient temperature range of −40°C to 85°C.

Key Features

  • Memory Type & Organization  Non-volatile FLASH - NAND technology organized as 8G × 8 for a total capacity of 64 Gbit.
  • Interface & Clock  Parallel memory interface with a specified clock frequency of 83 MHz for synchronous system timing.
  • Voltage Supply  Operates from 2.7 V to 3.6 V, supporting common board-level power rails.
  • Package  Supplied in a 100-TBGA package (12×18) for compact, high-density board mounting.
  • Temperature Range  Rated for an ambient operating temperature range of −40°C to 85°C (TA).
  • Memory Format & Mounting  Provided as FLASH memory in a package intended for surface-mount assembly.

Typical Applications

  • Non-volatile storage for embedded systems — Provides 64 Gbit of parallel NAND FLASH for code or data storage in systems that use parallel memory interfaces.
  • Board-level high-density memory — Suited for designs that require large NAND capacity in a compact 100-TBGA (12×18) footprint.
  • Systems with extended ambient ranges — Usable in environments operating between −40°C and 85°C where wide temperature tolerance is required.

Unique Advantages

  • High-density NAND capacity: 64 Gbit organized as 8G × 8 enables substantial on-board FLASH storage in a single device.
  • Parallel interface with defined clock: Parallel memory interface and an 83 MHz clock frequency provide predictable timing for system integration.
  • Wide supply voltage range: 2.7 V to 3.6 V operation matches common system power rails for flexible deployment.
  • Compact 100-TBGA package: 100-TBGA (12×18) packaging supports high-density surface-mount layouts.
  • Extended operating temperature: −40°C to 85°C ambient rating supports deployment across a broad range of thermal environments.

Why Choose IC FLASH 64GBIT PARALLEL 100TBGA?

The MT29F64G08AMCBBH2-12IT:B positions itself as a high-density, parallel NAND FLASH option that balances capacity, package density, and environmental range. Its 64 Gbit organization, 100-TBGA footprint, and defined electrical characteristics make it suitable for designs that require compact, board-mounted non-volatile memory with a parallel interface.

This device is appropriate for engineers specifying large-capacity FLASH where a 2.7 V–3.6 V supply, an 83 MHz clock, and operation from −40°C to 85°C are required. It delivers long-term value through its high memory density and compact package for space-constrained board designs.

Request a quote or submit an inquiry to receive pricing and availability for MT29F64G08AMCBBH2-12IT:B and to discuss how this 64 Gbit parallel FLASH device can fit your design requirements.

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