MT29F64G08AMCBBH2-12IT:B
| Part Description |
IC FLASH 64GBIT PARALLEL 100TBGA |
|---|---|
| Quantity | 1,627 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08AMCBBH2-12IT:B – IC FLASH 64GBIT PARALLEL 100TBGA
The MT29F64G08AMCBBH2-12IT:B is a 64 Gbit non-volatile FLASH NAND memory device organized as 8G × 8 with a parallel memory interface. It provides board-level, high-density NAND storage in a compact 100-TBGA (12×18) package.
Designed for systems that require parallel FLASH memory with a defined clock and wide operating conditions, the device supports a 2.7 V to 3.6 V supply range and an operating ambient temperature range of −40°C to 85°C.
Key Features
- Memory Type & Organization Non-volatile FLASH - NAND technology organized as 8G × 8 for a total capacity of 64 Gbit.
- Interface & Clock Parallel memory interface with a specified clock frequency of 83 MHz for synchronous system timing.
- Voltage Supply Operates from 2.7 V to 3.6 V, supporting common board-level power rails.
- Package Supplied in a 100-TBGA package (12×18) for compact, high-density board mounting.
- Temperature Range Rated for an ambient operating temperature range of −40°C to 85°C (TA).
- Memory Format & Mounting Provided as FLASH memory in a package intended for surface-mount assembly.
Typical Applications
- Non-volatile storage for embedded systems — Provides 64 Gbit of parallel NAND FLASH for code or data storage in systems that use parallel memory interfaces.
- Board-level high-density memory — Suited for designs that require large NAND capacity in a compact 100-TBGA (12×18) footprint.
- Systems with extended ambient ranges — Usable in environments operating between −40°C and 85°C where wide temperature tolerance is required.
Unique Advantages
- High-density NAND capacity: 64 Gbit organized as 8G × 8 enables substantial on-board FLASH storage in a single device.
- Parallel interface with defined clock: Parallel memory interface and an 83 MHz clock frequency provide predictable timing for system integration.
- Wide supply voltage range: 2.7 V to 3.6 V operation matches common system power rails for flexible deployment.
- Compact 100-TBGA package: 100-TBGA (12×18) packaging supports high-density surface-mount layouts.
- Extended operating temperature: −40°C to 85°C ambient rating supports deployment across a broad range of thermal environments.
Why Choose IC FLASH 64GBIT PARALLEL 100TBGA?
The MT29F64G08AMCBBH2-12IT:B positions itself as a high-density, parallel NAND FLASH option that balances capacity, package density, and environmental range. Its 64 Gbit organization, 100-TBGA footprint, and defined electrical characteristics make it suitable for designs that require compact, board-mounted non-volatile memory with a parallel interface.
This device is appropriate for engineers specifying large-capacity FLASH where a 2.7 V–3.6 V supply, an 83 MHz clock, and operation from −40°C to 85°C are required. It delivers long-term value through its high memory density and compact package for space-constrained board designs.
Request a quote or submit an inquiry to receive pricing and availability for MT29F64G08AMCBBH2-12IT:B and to discuss how this 64 Gbit parallel FLASH device can fit your design requirements.