MT29F64G08CBAAAWP-IT:A

IC FLASH 64GBIT PAR 48TSOP I
Part Description

IC FLASH 64GBIT PAR 48TSOP I

Quantity 159 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBAAAWP-IT:A – IC FLASH 64GBIT PAR 48TSOP I

The MT29F64G08CBAAAWP-IT:A is a 64 Gbit non-volatile NAND flash memory device organized as 8G × 8 with a parallel memory interface. It is supplied in a 48-TSOP I (48-TFSOP, 0.724", 18.40 mm width) package and operates from 2.7 V to 3.6 V.

This device provides high-density parallel flash storage with an operating temperature range of -40°C to 85°C, suitable for designs that require robust temperature tolerance and a standard TSOP footprint for board-level integration.

Key Features

  • Memory Type & Organization Non-volatile NAND flash memory organized as 8G × 8 (64 Gbit) for high-density storage.
  • Memory Size 64 Gbit total capacity.
  • Interface Parallel memory interface for direct parallel data access and legacy parallel bus integration.
  • Supply Voltage Operates from 2.7 V to 3.6 V, accommodating common 3.3 V nominal supply rails.
  • Package 48-TSOP I (48-TFSOP) package with a 0.724" (18.40 mm) width for standard TSOP PCB footprints.
  • Operating Temperature Specified for -40°C to 85°C (TA) to address temperature-demanding system requirements.

Unique Advantages

  • High-density storage: 64 Gbit capacity delivers substantial non-volatile storage in a single device.
  • Parallel interface compatibility: Parallel memory interface supports designs using parallel data buses.
  • Flexible supply range: 2.7 V to 3.6 V operation enables use with a range of 3.3 V system rails.
  • Standard TSOP footprint: 48-TSOP I package simplifies PCB layout and mechanical integration.
  • Wide temperature tolerance: -40°C to 85°C rating supports deployment across varied thermal environments.

Why Choose MT29F64G08CBAAAWP-IT:A?

The MT29F64G08CBAAAWP-IT:A combines high-density NAND flash capacity with a parallel interface and a standard 48-TSOP I package to simplify integration into systems that require substantial non-volatile storage. Its 2.7 V to 3.6 V supply range and -40°C to 85°C operating temperature make it appropriate for designs with broad voltage and temperature requirements.

This device is suited to engineering and procurement teams seeking a compact, high-capacity parallel flash memory option that aligns with common board footprints and supply rails, offering predictable integration characteristics based on the provided package, voltage, and temperature specifications.

Request a quote or submit a pricing inquiry for the MT29F64G08CBAAAWP-IT:A to obtain availability and lead-time information.

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