MT29F64G08CBAAAWP-Z:A

IC FLASH 64GBIT PAR 48TSOP I
Part Description

IC FLASH 64GBIT PAR 48TSOP I

Quantity 306 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBAAAWP-Z:A – 64Gbit Parallel NAND Flash, 48‑TSOP I

The MT29F64G08CBAAAWP-Z:A is a 64 Gbit non-volatile NAND flash memory device from Micron Technology Inc. Implemented as 8G x 8 FLASH NAND with a parallel memory interface, it provides block storage in a 48‑TSOP I package.

Designed for electronic systems that require parallel NAND flash storage, the device supports operation across a 2.7 V to 3.6 V supply range and a commercial ambient temperature range of 0°C to 70°C.

Key Features

  • Memory Type Non-volatile FLASH NAND memory providing persistent data retention without power.
  • Density & Organization 64 Gbit total capacity organized as 8G × 8 for byte-wide parallel operation.
  • Interface Parallel memory interface suitable for systems designed around parallel FLASH access.
  • Voltage Supply Operates from 2.7 V to 3.6 V, allowing compatibility with common 3.3 V system rails.
  • Package 48‑TSOP I (48‑TFSOP, 0.724" / 18.40 mm width) surface-mount package for compact board-level integration.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA), appropriate for commercial-temperature applications.

Typical Applications

  • Embedded Systems Provides non-volatile bulk storage where parallel NAND flash memory is required for firmware or data.
  • Firmware Storage Suitable for storing firmware images and system code in devices that use parallel flash memory.
  • Data Logging Can be used for persistent log and data storage in electronic products operating within the specified temperature and voltage ranges.
  • Commercial Electronics Fits board-level designs that need a 64 Gbit parallel NAND solution in a 48‑TSOP I footprint.

Unique Advantages

  • High-density non-volatile capacity: 64 Gbit storage enables substantial data or firmware space in a single device.
  • Byte-wide organization: 8G × 8 organization supports parallel, byte-oriented access patterns for system compatibility.
  • Flexible power range: 2.7 V to 3.6 V operation aligns with common 3.3 V system supplies for straightforward integration.
  • Compact TSOP package: 48‑TSOP I package (18.40 mm width) delivers a space-efficient footprint for PCB layouts.
  • Commercial temperature rating: 0°C to 70°C ambient rating matches typical commercial‑grade electronic applications.

Why Choose IC FLASH 64GBIT PAR 48TSOP I?

The MT29F64G08CBAAAWP-Z:A combines Micron's NAND flash technology with a parallel interface and a compact 48‑TSOP I package to deliver 64 Gbit of non-volatile storage suited to commercial electronic designs. Its 8G × 8 memory organization and 2.7 V–3.6 V supply make it a practical choice for systems that require byte-wide parallel access and compatibility with common system voltages.

This device is appropriate for designers seeking a straightforward, high-density parallel NAND solution from an established memory manufacturer for applications operating within a 0°C to 70°C ambient range.

Request a quote or contact sales to discuss availability, pricing, and lead times for the MT29F64G08CBAAAWP-Z:A.

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