MT29F64G08CBAABWP-12Z:A

IC FLASH 64GBIT PAR 48TSOP I
Part Description

IC FLASH 64GBIT PAR 48TSOP I

Quantity 670 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBAABWP-12Z:A – IC FLASH 64GBIT PAR 48TSOP I

The MT29F64G08CBAABWP-12Z:A is a 64 Gbit non-volatile NAND flash memory device organized as 8G × 8. It provides parallel flash memory storage with a specified clock frequency of 83 MHz and operates from a 2.7 V to 3.6 V supply.

This device is suited to applications that require parallel NAND flash storage in a compact 48-TSOP I package and is specified for an ambient operating temperature range of 0°C to 70°C.

Key Features

  • Memory Type Non-volatile NAND flash technology with a total capacity of 64 Gbit (8G × 8) for persistent data storage.
  • Interface Parallel memory interface for direct parallel access to the flash array.
  • Performance Specified clock frequency of 83 MHz to coordinate parallel memory transactions.
  • Power Operates from a 2.7 V to 3.6 V supply range.
  • Package 48-TSOP I package (0.724", 18.40 mm width) providing a compact form factor for board-level integration.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).

Typical Applications

  • Embedded Storage: Use where 64 Gbit parallel NAND flash is required for persistent program or data storage.
  • Consumer Devices: Integration in devices that operate within a 0°C to 70°C ambient temperature range and require parallel flash memory.
  • Data Logging and Backup: Systems needing non-volatile memory retention with a standard supply voltage range of 2.7 V to 3.6 V.

Unique Advantages

  • High-density NAND storage: 64 Gbit capacity supports large data or code storage in a single device.
  • Parallel interface: Enables direct parallel access to the memory array for designs that use parallel flash architectures.
  • Standard clocking: 83 MHz clock frequency specification for predictable timing in system designs.
  • Flexible supply voltage: 2.7 V to 3.6 V range allows use with common 3 V system rails.
  • Compact TSOP package: 48-TSOP I (18.40 mm width) helps maintain a small PCB footprint.

Why Choose MT29F64G08CBAABWP-12Z:A?

The MT29F64G08CBAABWP-12Z:A combines 64 Gbit of NAND flash density with a parallel interface and a defined 83 MHz clocking specification, making it a straightforward choice for designs that require on-board parallel flash memory. Its 48-TSOP I package and 2.7 V to 3.6 V operating range support compact integration on standard 3 V systems.

This device is appropriate for customers seeking a verifiable, specification-driven NAND flash component for applications operating within a 0°C to 70°C ambient range. Its form factor and electrical specifications provide predictable integration for system-level planning and BOM definition.

Request a quote or contact sales to discuss availability, pricing, and lead time for the MT29F64G08CBAABWP-12Z:A.

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