MT29F64G08CBAAAWP-Z:A TR

IC FLASH 64GBIT PAR 48TSOP I
Part Description

IC FLASH 64GBIT PAR 48TSOP I

Quantity 1,822 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBAAAWP-Z:A TR – IC FLASH 64GBIT PAR 48TSOP I

The MT29F64G08CBAAAWP-Z:A TR is a non-volatile NAND flash memory device organized as 8G × 8 for a total density of 64 Gbit. It implements a parallel memory interface in a 48-TSOP I package and is designed for applications requiring onboard NAND flash storage.

Key attributes include a 2.7 V–3.6 V supply range and an ambient operating temperature range of 0 °C to 70 °C, making it suitable for standard commercial temperature environments where parallel NAND storage is required.

Key Features

  • Memory Type Non-volatile FLASH (NAND) memory providing persistent data storage without power.
  • Memory Organization and Size Organized as 8G × 8 for a total memory size of 64 Gbit.
  • Interface Parallel memory interface for direct parallel data communication.
  • Package Supplied in a 48-TSOP I package (48-TFSOP, 0.724" / 18.40 mm width) for board-level mounting.
  • Voltage Supply Operates from 2.7 V to 3.6 V, compatible with standard 3.3 V systems.
  • Operating Temperature Rated for ambient operation from 0 °C to 70 °C (TA), suitable for commercial temperature applications.

Typical Applications

  • Embedded Storage Provides non-volatile NAND storage for embedded systems that require parallel flash memory.
  • Consumer Electronics Supports devices that integrate local NAND flash for firmware, data logging, or media storage within commercial temperature limits.
  • Industrial and Instrumentation Suited for instruments and industrial equipment operating in standard commercial temperature ranges needing onboard non-volatile memory.

Unique Advantages

  • High-density capacity: 64 Gbit density enables substantial on-board storage without multiple devices.
  • Parallel interface: Parallel memory interface allows direct bus connection where parallel flash is required.
  • Standard supply voltage: 2.7 V–3.6 V operation aligns with common 3.3 V system rails for straightforward power integration.
  • Compact TSOP footprint: 48-TSOP I package with 18.40 mm width provides a defined form factor for PCB layout and assembly.
  • Commercial temperature rating: 0 °C–70 °C operating range targets typical commercial applications and deployments.

Why Choose IC FLASH 64GBIT PAR 48TSOP I?

The MT29F64G08CBAAAWP-Z:A TR positions itself as a high-density, parallel NAND flash option in a compact 48-TSOP I package for designs that require 64 Gbit of non-volatile storage. Its 8G × 8 organization, 2.7 V–3.6 V supply range, and commercial temperature rating make it suitable for systems that need straightforward integration of parallel NAND memory.

This device is appropriate for engineers and procurement teams specifying on-board NAND flash where package size, voltage compatibility, and memory density are key selection criteria.

If you would like pricing information or to request a quote for MT29F64G08CBAAAWP-Z:A TR, please submit a quote request or contact sales for availability and lead-time details.

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