MT29F64G08CBAAAWP:A TR

The MT29F64G08CBAAAWP:A TR is a 64 Gbit non-volatile NAND flash memory organized as 8G × 8 with a parallel memory interface. Packaged in a 48-TSOP I (48-TFSOP, 0.724", 18.40 mm width) footprint, it provides high-density flash storage for designs requiring parallel FLASH memory.

Operating over a 2.7 V to 3.6 V supply range and a 0 °C to 70 °C ambient temperature window, this device is suitable for systems that need high-capacity non-volatile memory in a compact TSOP package.

Key Features

• Memory Type & Technology Non-volatile FLASH memory implemented with NAND technology for persistent data storage.
• Memory Capacity & Organization 64 Gbit total capacity organized as 8G × 8, enabling large storage density in a single device.
• Interface Parallel memory interface for direct parallel access to the FLASH array.
• Supply Voltage Operates from 2.7 V to 3.6 V, supporting common single-supply system designs.
• Package 48-TSOP I (48-TFSOP) package with 0.724" (18.40 mm) width, suitable for compact board-level implementations.
• Temperature Range Specified for 0 °C to 70 °C (TA), appropriate for commercial-temperature applications.

Typical Applications

• Embedded systems — Provides high-capacity non-volatile storage for firmware, application code, or data logs in embedded designs that use parallel FLASH memory.
• Consumer electronics — Suited for devices requiring large flash capacity in a compact TSOP package within a commercial temperature range.
• Storage modules — Can be used as a high-density NAND component in custom storage or memory expansion modules with parallel interfaces.
• Firmware and image storage — Offers a large, byte-organized FLASH array for storing firmware images and other persistent data.

Unique Advantages

• High-density non-volatile storage: 64 Gbit capacity provides significant on-board storage without multiple devices.
• Parallel interface simplicity: Parallel memory interface enables straightforward integration with systems designed for parallel FLASH access.
• Compact TSOP footprint: 48-TSOP I package (0.724", 18.40 mm) balances board space and serviceability for module-level designs.
• Flexible supply range: 2.7 V to 3.6 V operation accommodates common system power rails.
• Commercial temperature compatibility: Rated for 0 °C to 70 °C, matching typical commercial-environment deployments.
• Byte-oriented organization: 8G × 8 organization supports byte-wide data operations where required.

Why Choose MT29F64G08CBAAAWP:A TR?

The MT29F64G08CBAAAWP:A TR is positioned as a high-capacity, parallel-interface NAND FLASH device in a standard 48-TSOP I package, offering a balance of storage density and compact board-level integration. Its voltage and temperature specifications make it suitable for commercial applications that require reliable, persistent memory in a familiar package.

This device is appropriate for designers and purchasers seeking a single-component solution for large non-volatile storage needs, particularly where a parallel FLASH interface and TSOP packaging are preferred for system integration and PCB layout constraints.

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