MT48LC4M32B2TG-6:G TR
| Part Description |
IC DRAM 128MBIT PAR 86TSOP II |
|---|---|
| Quantity | 534 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.5 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M32B2TG-6:G TR – IC DRAM 128MBIT PAR 86TSOP II
The MT48LC4M32B2TG-6:G TR is a 128 Mbit volatile SDRAM organized as 4M × 32 with a parallel memory interface. It is provided in an 86-TSOP II (86-TFSOP, 0.400", 10.16 mm width) package and is supplied by Micron Technology Inc.
Designed for board-level SDRAM implementations where a parallel DRAM interface and moderate clock rates are required, the device operates from a 3.0 V to 3.6 V supply and supports a clock frequency of 167 MHz with an access time of 5.5 ns.
Key Features
- Core / Technology SDRAM volatile memory implemented in SDRAM technology for standard DRAM operation.
- Memory Capacity & Organization 128 Mbit capacity organized as 4M × 32, providing parallel 32-bit data width.
- Performance Supports a clock frequency of 167 MHz, an access time of 5.5 ns and a write cycle time (word page) of 12 ns.
- Power Operates from a 3.0 V to 3.6 V supply voltage range.
- Package & Mounting Available in an 86-TSOP II / 86-TFSOP package (0.400" / 10.16 mm width) suitable for board-level mounting.
- Temperature Range Specified for operation from 0°C to 70°C (TA).
- Memory Interface & Format Parallel DRAM interface and standard DRAM memory format.
- Manufacturer Supplied by Micron Technology Inc.
Typical Applications
- Parallel memory subsystems Use where a parallel 32-bit SDRAM interface is required for board-level memory.
- Embedded system memory Provides DLL-free SDRAM capacity in designs that accept a 3.0 V–3.6 V supply and 86-TSOP II package footprints.
- Legacy SDRAM designs Drop-in memory option for systems designed around standard SDRAM timing (5.5 ns access, 12 ns word page write cycle).
Unique Advantages
- Clear capacity and organization: 128 Mbit arranged as 4M × 32 delivers a defined 32-bit parallel data path for predictable bus integration.
- Specified timing performance: 167 MHz clock rate with 5.5 ns access time and 12 ns write cycle time supports deterministic timing budgets.
- Wide supply compatibility: 3.0 V to 3.6 V supply range accommodates common 3 V system rails.
- Industry-standard package: 86-TSOP II / 86-TFSOP package (0.400", 10.16 mm width) simplifies PCB footprint planning for board-level designs.
- Defined operating temperature: 0°C to 70°C rating supports typical commercial temperature deployments.
Why Choose IC DRAM 128MBIT PAR 86TSOP II?
This Micron-supplied 128 Mbit SDRAM combines a 4M × 32 organization, parallel interface, and defined timing parameters to fit designs that require a straightforward DRAM memory module in an 86-TSOP II package. Its supply voltage range and commercial temperature rating make it suitable for mainstream board-level memory implementations.
The device is appropriate for engineers specifying deterministic SDRAM timing and a 32-bit parallel data path, offering clear electrical and mechanical characteristics for integration and procurement.
Request a quote or submit an RFQ to receive pricing and availability information for the MT48LC4M32B2TG-6:G TR.
