MT48LC4M32B2P-7:G

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 1,565 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.5 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M32B2P-7:G – IC DRAM 128MBIT PAR 86TSOP II

The MT48LC4M32B2P-7:G is a 128 Mbit volatile SDRAM organized as 4M × 32 with a parallel memory interface. It provides defined timing and electrical characteristics for system designers requiring board-level DRAM in an 86-TSOP II package.

Designed for commercial-temperature environments, the device operates from 3.0 V to 3.6 V, supports a 143 MHz clock frequency, and is specified for an operating ambient temperature range of 0°C to 70°C.

Key Features

  • Core / Technology SDRAM volatile memory organized as 4M × 32 for a total memory size of 128 Mbit.
  • Performance / Timing Clock frequency rated at 143 MHz with an access time of 5.5 ns and a write cycle time (word/page) of 14 ns for predictable timing integration.
  • Voltage / Power Supply voltage range from 3.0 V to 3.6 V, compatible with 3.3 V system rails.
  • Interface Parallel memory interface suitable for controllers that require DRAM formatted as 4M × 32.
  • Package 86-TFSOP / 86-TSOP II package (0.400", 10.16 mm width) for board-level mounting and compact footprint.
  • Environmental / Temperature Range Specified operating ambient temperature range: 0°C to 70°C (TA).

Typical Applications

  • Embedded systems Provides 128 Mbit parallel SDRAM for systems that require volatile working memory with defined timing characteristics.
  • Consumer electronics Compact 86-TSOP II packaging and 3.0–3.6 V operation suit board-level memory expansion in space-constrained devices.
  • Networking and communications equipment 143 MHz clock frequency and 5.5 ns access time support designs with specific timing and throughput requirements.

Unique Advantages

  • Defined memory organization: 4M × 32 arrangement yields a clear mapping for system memory planning and controller interfacing.
  • Predictable timing: 5.5 ns access time and 14 ns write cycle time (word/page) help ensure repeatable performance in timing-sensitive designs.
  • Standard voltage range: 3.0–3.6 V supply simplifies integration into 3.3 V power domains.
  • Compact TSOP II package: 86-TSOP II (0.400", 10.16 mm width) enables higher board density and straightforward surface-mount assembly.
  • Commercial temperature rating: 0°C to 70°C operating range aligns with typical commercial applications.

Why Choose IC DRAM 128MBIT PAR 86TSOP II?

IC DRAM 128MBIT PAR 86TSOP II combines a 128 Mbit SDRAM organization with defined timing, a standard parallel interface, and a compact 86-TSOP II package to facilitate straightforward board-level memory integration. Its 3.0–3.6 V supply and 0°C to 70°C operating range make it suitable for commercial designs that require predictable electrical and timing characteristics.

This device is well suited to designers and procurement teams specifying parallel SDRAM with clear performance data and package constraints, enabling consistent implementation across relevant product lines.

Request a quote or submit an inquiry for pricing and availability to receive further commercial and ordering information.

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