MT48LC4M32B2TG-7 IT:G TR

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 1,671 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page14 nsPackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC4M32B2TG-7 IT:G TR – IC DRAM 128MBIT PAR 86TSOP II

The MT48LC4M32B2TG-7 IT:G TR is a 128 Mbit synchronous DRAM (SDRAM) organized as 4M × 32 with a parallel memory interface. It provides a clock frequency rating of 143 MHz and is designed for applications that require volatile SDRAM memory in a compact 86-TSOP II package.

Key value propositions include a parallel 32-bit data organization for system memory expansion, defined timing characteristics including 5.5 ns access time and 14 ns write cycle time (word/page), and an extended operating temperature range of -40°C to 85°C for use in temperature-sensitive designs.

Key Features

  • Memory Architecture  4M × 32 organization delivering 128 Mbit of volatile SDRAM memory for parallel bus systems.
  • SDRAM Technology  Synchronous DRAM core providing standard SDRAM operation and timing behavior suitable for parallel memory subsystems.
  • Performance  Rated clock frequency of 143 MHz with an access time of 5.5 ns, supporting responsive read/write operations.
  • Timing  Write cycle time (word/page) specified at 14 ns to define system memory timing and throughput.
  • Power  Operates from a supply range of 3.0 V to 3.6 V, enabling use with nominal 3 V power rails.
  • Package & Mounting  Supplied in an 86-TSOP II (86-TFSOP, 0.400", 10.16 mm width) package suitable for surface-mount PCB assembly.
  • Operating Temperature  Specified for ambient temperatures from -40°C to 85°C (TA), supporting a wide temperature envelope for system deployment.

Typical Applications

  • Parallel memory subsystems  Provides 128 Mbit SDRAM in a 4M × 32 organization for systems that require parallel bus memory expansion and defined SDRAM timing.
  • Embedded controllers and modules  Use in embedded designs that need volatile SDRAM storage with a compact 86-TSOP II package footprint.
  • Industrial equipment  Suitable for equipment operating across an extended ambient range (-40°C to 85°C) where SDRAM is required for temporary data storage.
  • Networking and communications  Can serve as parallel SDRAM memory for networking or communications modules that match the specified clock and timing requirements.

Unique Advantages

  • Parallel 4M × 32 organization:  Delivers a 32-bit parallel data interface and 128 Mbit capacity for straightforward system memory integration.
  • Defined performance parameters:  143 MHz clock rating, 5.5 ns access time, and 14 ns write cycle time provide clear design targets for timing and throughput budgeting.
  • Wide operating temperature range:  -40°C to 85°C rating supports deployment in temperature-challenging environments.
  • Compact TSOP II package:  86-TSOP II footprint (10.16 mm width) enables surface-mount integration where board space and standard package handling are required.
  • Standard 3 V supply range:  Operates from 3.0 V to 3.6 V, aligning with common 3 V system power domains.

Why Choose IC DRAM 128MBIT PAR 86TSOP II?

The MT48LC4M32B2TG-7 IT:G TR positions itself as a specification-driven SDRAM option for designs that require a 128 Mbit parallel memory device with clear timing and performance parameters. Its 4M × 32 organization, 143 MHz clock rating, and defined access/write timing simplify integration into systems that depend on predictable SDRAM behavior.

This device is appropriate for engineers and procurement teams specifying parallel SDRAM in compact surface-mount packages and for applications that require operation across -40°C to 85°C. The combination of package, electrical, and timing specifications delivers a straightforward memory solution for a range of embedded, industrial, and communications designs.

Request a quote or contact sales to obtain pricing, lead time, and availability for the MT48LC4M32B2TG-7 IT:G TR.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up