MT48LC64M4A2BB-6A:G

IC DRAM 256MBIT PAR 60TFBGA
Part Description

IC DRAM 256MBIT PAR 60TFBGA

Quantity 757 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x16)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC64M4A2BB-6A:G – IC DRAM 256MBIT PAR 60TFBGA

The MT48LC64M4A2BB-6A:G is a 256 Mbit synchronous DRAM organized as 64M x 4 with four internal banks and a parallel memory interface. It implements SDR SDRAM architecture with fully synchronous operation and registered signals on the positive edge of the system clock.

Designed for systems requiring board-level parallel SDRAM, this device offers PC100/PC133 timing options, a commercial operating range, and a compact 60-ball TFBGA (8×16) package for space-constrained designs.

Key Features

  • Core / Architecture 64M × 4 organization with 4 internal banks for bank interleaving and hidden row access/precharge.
  • SDR SDRAM Functionality Fully synchronous operation with all signals registered on the positive clock edge and internal pipelined operation allowing column address changes every clock cycle.
  • Performance & Timing -6A speed grade targets 167 MHz clock frequency; typical access time 5.4 ns and CAS latency timing of 3-3-3 (18 ns).
  • Burst and Refresh Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh modes and self-refresh options; standard refresh counts per the datasheet.
  • Power Single-supply operation at 3.3 V (3.0 V to 3.6 V specified).
  • Interface & Timing Details Parallel SDRAM interface with write cycle time (word/page) of 12 ns and LVTTL-compatible inputs/outputs per datasheet specifications.
  • Package & Mounting 60-ball TFBGA package (8 mm × 16 mm) for compact, board-level mounting.
  • Operating Range Commercial temperature range: 0°C to +70°C (TA).

Typical Applications

  • PC and legacy system memory Suitable for designs and upgrades that require PC100/PC133-compatible parallel SDRAM memory modules.
  • Consumer electronics Used where moderate-density SDRAM (256 Mbit) and 3.3 V single-supply operation are required for buffering and system memory.
  • Embedded systems Compact 60-ball TFBGA packaging makes the device appropriate for space-constrained board-level memory implementations in embedded designs.

Unique Advantages

  • 256 Mbit density Provides a mid-range memory capacity in a single x4 SDRAM device for efficient board-level memory partitioning.
  • PC100/PC133 timing support Documented timing grades including a -6A grade at 167 MHz enable higher-performance SDRAM operation where required.
  • Flexible burst and refresh modes Programmable burst lengths and auto/self-refresh options simplify memory control and support varied access patterns.
  • Standard 3.3 V supply Operates from a single 3.0 V–3.6 V supply for straightforward power integration with legacy 3.3 V systems.
  • Space-optimizing package 60-ball TFBGA (8×16) package reduces board footprint while supporting reliable BGA mounting.
  • Deterministic timing Published access times (5.4 ns) and CAS latency targets support predictable system timing analysis.

Why Choose MT48LC64M4A2BB-6A:G?

The MT48LC64M4A2BB-6A:G is positioned for designers needing a compact, mid-density parallel SDRAM device with documented PC100/PC133 timing grades, programmable burst capabilities, and standard 3.3 V operation. Its 64M × 4 organization and four-bank architecture enable efficient memory banking and predictable timing behavior.

This device is appropriate for commercial-temperature embedded and consumer applications where a compact 60-ball TFBGA package and reliable SDRAM features (auto refresh, programmable bursts, registered synchronous operation) are required for board-level memory integration.

Request a quote or submit an inquiry to receive pricing and availability information for the MT48LC64M4A2BB-6A:G.

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