MT48LC64M4A2BB-6A:G
| Part Description |
IC DRAM 256MBIT PAR 60TFBGA |
|---|---|
| Quantity | 757 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-TFBGA (8x16) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 4 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT48LC64M4A2BB-6A:G – IC DRAM 256MBIT PAR 60TFBGA
The MT48LC64M4A2BB-6A:G is a 256 Mbit synchronous DRAM organized as 64M x 4 with four internal banks and a parallel memory interface. It implements SDR SDRAM architecture with fully synchronous operation and registered signals on the positive edge of the system clock.
Designed for systems requiring board-level parallel SDRAM, this device offers PC100/PC133 timing options, a commercial operating range, and a compact 60-ball TFBGA (8×16) package for space-constrained designs.
Key Features
- Core / Architecture 64M × 4 organization with 4 internal banks for bank interleaving and hidden row access/precharge.
- SDR SDRAM Functionality Fully synchronous operation with all signals registered on the positive clock edge and internal pipelined operation allowing column address changes every clock cycle.
- Performance & Timing -6A speed grade targets 167 MHz clock frequency; typical access time 5.4 ns and CAS latency timing of 3-3-3 (18 ns).
- Burst and Refresh Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh modes and self-refresh options; standard refresh counts per the datasheet.
- Power Single-supply operation at 3.3 V (3.0 V to 3.6 V specified).
- Interface & Timing Details Parallel SDRAM interface with write cycle time (word/page) of 12 ns and LVTTL-compatible inputs/outputs per datasheet specifications.
- Package & Mounting 60-ball TFBGA package (8 mm × 16 mm) for compact, board-level mounting.
- Operating Range Commercial temperature range: 0°C to +70°C (TA).
Typical Applications
- PC and legacy system memory Suitable for designs and upgrades that require PC100/PC133-compatible parallel SDRAM memory modules.
- Consumer electronics Used where moderate-density SDRAM (256 Mbit) and 3.3 V single-supply operation are required for buffering and system memory.
- Embedded systems Compact 60-ball TFBGA packaging makes the device appropriate for space-constrained board-level memory implementations in embedded designs.
Unique Advantages
- 256 Mbit density Provides a mid-range memory capacity in a single x4 SDRAM device for efficient board-level memory partitioning.
- PC100/PC133 timing support Documented timing grades including a -6A grade at 167 MHz enable higher-performance SDRAM operation where required.
- Flexible burst and refresh modes Programmable burst lengths and auto/self-refresh options simplify memory control and support varied access patterns.
- Standard 3.3 V supply Operates from a single 3.0 V–3.6 V supply for straightforward power integration with legacy 3.3 V systems.
- Space-optimizing package 60-ball TFBGA (8×16) package reduces board footprint while supporting reliable BGA mounting.
- Deterministic timing Published access times (5.4 ns) and CAS latency targets support predictable system timing analysis.
Why Choose MT48LC64M4A2BB-6A:G?
The MT48LC64M4A2BB-6A:G is positioned for designers needing a compact, mid-density parallel SDRAM device with documented PC100/PC133 timing grades, programmable burst capabilities, and standard 3.3 V operation. Its 64M × 4 organization and four-bank architecture enable efficient memory banking and predictable timing behavior.
This device is appropriate for commercial-temperature embedded and consumer applications where a compact 60-ball TFBGA package and reliable SDRAM features (auto refresh, programmable bursts, registered synchronous operation) are required for board-level memory integration.
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