MT48LC64M4A2P-6A:G TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 267 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 4 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT48LC64M4A2P-6A:G TR – IC DRAM 256MBIT PAR 54TSOP II
The MT48LC64M4A2P-6A:G TR is a 256 Mbit synchronous DRAM organized as 64M × 4 with four internal banks and a parallel memory interface. It is a fully synchronous SDRAM device designed for systems requiring PC100/PC133-compliant SDRAM behavior and standard 54-pin TSOP II packaging.
This device targets designs that need a 256 Mbit parallel DRAM solution with high-speed operation (up to 167 MHz for the -6A speed grade), programmable burst lengths, and standard refresh and power characteristics suitable for commercial temperature ranges.
Key Features
- Memory Architecture 256 Mbit SDRAM organized as 64M × 4 with four internal banks for parallelized row/column access.
- Synchronous SDRAM Core Fully synchronous operation with all signals registered on the positive edge of the system clock; internal pipelined operation allows column address changes every clock cycle.
- Performance -6A speed grade supports a 167 MHz clock frequency; target timing for -6A is RCD–RP–CL = 3–3–3. Access time listed at 5.4 ns.
- Burst and Command Flexibility Programmable burst lengths of 1, 2, 4, 8, or full page; supports auto precharge, concurrent auto precharge and auto refresh modes.
- Refresh and Self-Refresh Auto refresh and self-refresh support (note: self refresh not available on AT devices); 8K refresh cycles per refresh period as specified.
- Interface and I/O LVTTL-compatible inputs and outputs with a parallel memory interface and standard SDRAM control signals.
- Power Single-supply operation around 3.3 V (specified 3.0 V to 3.6 V; datasheet notes single 3.3 V ±0.3 V supply).
- Package and Temperature 54-pin TSOP II (0.400", 10.16 mm width) plastic package; commercial operating temperature range 0°C to +70°C.
Typical Applications
- Legacy and embedded memory subsystems Use as a parallel SDRAM memory component where 256 Mbit density and TSOP II packaging fit board-level designs.
- Systems requiring PC100/PC133-compliant SDRAM Suitable for designs that reference PC100/PC133 SDRAM timing and signaling profiles.
- Board-level buffering and working memory Employed where programmable burst lengths and internal bank architecture benefit bursty data transfers and buffering tasks.
Unique Advantages
- High-speed -6A timing: 167 MHz clock support with 3-3-3 RCD–RP–CL target timing for responsive read/write cycles.
- Flexible burst control: Programmable burst lengths including full-page options for tuning throughput to system requirements.
- Standard 3.3 V supply: Operates from a 3.0 V–3.6 V range (3.3 V ±0.3 V), matching common legacy SDRAM power rails.
- Standard TSOP II package: 54-pin TSOP II (0.400") package simplifies replacement and board-level integration in established form factors.
- Built-in refresh management: Auto refresh and self-refresh capabilities reduce external refresh handling and simplify memory controller requirements.
- Commercial temperature rating: Rated for 0°C to +70°C operation for designs targeting commercial environments.
Why Choose MT48LC64M4A2P-6A:G TR?
The MT48LC64M4A2P-6A:G TR provides a straightforward, standards-oriented 256 Mbit SDRAM option in a 54-pin TSOP II package. Its synchronous, pipelined architecture with four internal banks and programmable burst lengths supports designs that need predictable timing, flexible burst behavior, and compatibility with PC100/PC133 SDRAM timing profiles.
This device is suited to engineers and procurement teams looking for a commercial-temperature, 3.3 V parallel SDRAM solution with defined speed grades and established package options, delivering clear integration points for board-level memory subsystems.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MT48LC64M4A2P-6A:G TR.