MT48LC64M4A2P-6A:G TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 267 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC64M4A2P-6A:G TR – IC DRAM 256MBIT PAR 54TSOP II

The MT48LC64M4A2P-6A:G TR is a 256 Mbit synchronous DRAM organized as 64M × 4 with four internal banks and a parallel memory interface. It is a fully synchronous SDRAM device designed for systems requiring PC100/PC133-compliant SDRAM behavior and standard 54-pin TSOP II packaging.

This device targets designs that need a 256 Mbit parallel DRAM solution with high-speed operation (up to 167 MHz for the -6A speed grade), programmable burst lengths, and standard refresh and power characteristics suitable for commercial temperature ranges.

Key Features

  • Memory Architecture 256 Mbit SDRAM organized as 64M × 4 with four internal banks for parallelized row/column access.
  • Synchronous SDRAM Core Fully synchronous operation with all signals registered on the positive edge of the system clock; internal pipelined operation allows column address changes every clock cycle.
  • Performance -6A speed grade supports a 167 MHz clock frequency; target timing for -6A is RCD–RP–CL = 3–3–3. Access time listed at 5.4 ns.
  • Burst and Command Flexibility Programmable burst lengths of 1, 2, 4, 8, or full page; supports auto precharge, concurrent auto precharge and auto refresh modes.
  • Refresh and Self-Refresh Auto refresh and self-refresh support (note: self refresh not available on AT devices); 8K refresh cycles per refresh period as specified.
  • Interface and I/O LVTTL-compatible inputs and outputs with a parallel memory interface and standard SDRAM control signals.
  • Power Single-supply operation around 3.3 V (specified 3.0 V to 3.6 V; datasheet notes single 3.3 V ±0.3 V supply).
  • Package and Temperature 54-pin TSOP II (0.400", 10.16 mm width) plastic package; commercial operating temperature range 0°C to +70°C.

Typical Applications

  • Legacy and embedded memory subsystems Use as a parallel SDRAM memory component where 256 Mbit density and TSOP II packaging fit board-level designs.
  • Systems requiring PC100/PC133-compliant SDRAM Suitable for designs that reference PC100/PC133 SDRAM timing and signaling profiles.
  • Board-level buffering and working memory Employed where programmable burst lengths and internal bank architecture benefit bursty data transfers and buffering tasks.

Unique Advantages

  • High-speed -6A timing: 167 MHz clock support with 3-3-3 RCD–RP–CL target timing for responsive read/write cycles.
  • Flexible burst control: Programmable burst lengths including full-page options for tuning throughput to system requirements.
  • Standard 3.3 V supply: Operates from a 3.0 V–3.6 V range (3.3 V ±0.3 V), matching common legacy SDRAM power rails.
  • Standard TSOP II package: 54-pin TSOP II (0.400") package simplifies replacement and board-level integration in established form factors.
  • Built-in refresh management: Auto refresh and self-refresh capabilities reduce external refresh handling and simplify memory controller requirements.
  • Commercial temperature rating: Rated for 0°C to +70°C operation for designs targeting commercial environments.

Why Choose MT48LC64M4A2P-6A:G TR?

The MT48LC64M4A2P-6A:G TR provides a straightforward, standards-oriented 256 Mbit SDRAM option in a 54-pin TSOP II package. Its synchronous, pipelined architecture with four internal banks and programmable burst lengths supports designs that need predictable timing, flexible burst behavior, and compatibility with PC100/PC133 SDRAM timing profiles.

This device is suited to engineers and procurement teams looking for a commercial-temperature, 3.3 V parallel SDRAM solution with defined speed grades and established package options, delivering clear integration points for board-level memory subsystems.

Request a quote or contact sales to discuss availability, lead times, and pricing for the MT48LC64M4A2P-6A:G TR.

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