MT48LC64M4A2P-7E:G TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 333 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 4 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT48LC64M4A2P-7E:G TR – IC DRAM 256MBIT PAR 54TSOP II
The MT48LC64M4A2P-7E:G TR is a 256 Mbit synchronous DRAM (SDRAM) organized as 64M × 4 with a parallel memory interface. It implements a fully synchronous architecture with internal pipelined operation and four internal banks to support high-throughput memory access.
Designed for systems operating from a single 3.3 V ±0.3 V supply (3.0–3.6 V) and a commercial temperature range of 0°C to +70°C, this device targets designs requiring PC100/PC133-compliant SDRAM in a compact 54-pin TSOP II package.
Key Features
- Memory Architecture 256 Mbit SDRAM organized as 64M × 4 with 4 internal banks for concurrent row access and precharge.
- Synchronous SDRAM Operation Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelined operation allowing column address changes every clock cycle.
- PC100 / PC133 Compliance Specified as PC100- and PC133-compliant; the -7E speed grade targets 133 MHz operation with 2-2-2 timing (RCD-RP-CL) and an effective CL timing of 15 ns.
- Programmable Burst and Refresh Programmable burst lengths (1, 2, 4, 8 or full page) plus auto refresh and self-refresh modes; supports 8192-cycle refresh intervals as defined in the datasheet.
- Timing and Performance Clock frequency up to 133 MHz, typical access time 5.4 ns and write cycle time (word/page) of 14 ns for responsive read/write operations.
- Power Supply Single 3.3 V ±0.3 V supply (3.0–3.6 V) with LVTTL-compatible inputs and outputs.
- Package 54-pin TSOP II (0.400", 10.16 mm width) plastic package for compact PCB implementations.
- Operating Range Commercial temperature grade: 0°C to +70°C (TA).
Typical Applications
- PC100/PC133 Memory Subsystems Use as PC100- or PC133-compliant DRAM for systems requiring synchronous parallel memory at 133 MHz.
- Compact Board-Level Memory 54-pin TSOP II package supports compact PCB layouts where a 256 Mbit ×4 SDRAM is required.
- 3.3 V Single-Supply Designs Intended for systems that operate from a single 3.3 V ±0.3 V supply and need LVTTL-compatible I/O.
Unique Advantages
- Flexible Burst and Bank Control: Programmable burst lengths and four internal banks enable efficient, pipelined column access to improve throughput for sequential transfers.
- PC100/PC133 Compatibility: Designed to meet PC100 and PC133 timing grades, simplifying integration into systems targeting those clock domains.
- Low-Latency -7E Speed Grade: -7E speed grade provides 133 MHz operation with 2-2-2 timing (RCD-RP-CL) and a 15 ns CAS latency for accelerated read performance.
- Standard 54-TSOP II Package: A common 54-pin TSOP II footprint allows use in existing PCB designs and module implementations that accept 0.400" width TSOP devices.
- Single-Supply Operation: Operates from a single 3.3 V ±0.3 V supply, simplifying power-supply design and board-level integration.
Why Choose MT48LC64M4A2P-7E:G TR?
The MT48LC64M4A2P-7E:G TR delivers a proven SDRAM architecture—64M × 4 organization with four internal banks—combined with PC100/PC133 timing compliance and a -7E speed grade optimized for 133 MHz operation. Its compact 54-pin TSOP II package and single 3.3 V supply requirement make it suitable for designs that need standardized, synchronous parallel memory in a small footprint.
This device is appropriate for engineers specifying commercial-temperature SDRAM with deterministic timing characteristics, programmable burst operation, and standard refresh modes. The straightforward electrical and mechanical specifications support predictable integration into existing board-level memory subsystems.
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