MT48LC64M4A2P-7E:G TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 333 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC64M4A2P-7E:G TR – IC DRAM 256MBIT PAR 54TSOP II

The MT48LC64M4A2P-7E:G TR is a 256 Mbit synchronous DRAM (SDRAM) organized as 64M × 4 with a parallel memory interface. It implements a fully synchronous architecture with internal pipelined operation and four internal banks to support high-throughput memory access.

Designed for systems operating from a single 3.3 V ±0.3 V supply (3.0–3.6 V) and a commercial temperature range of 0°C to +70°C, this device targets designs requiring PC100/PC133-compliant SDRAM in a compact 54-pin TSOP II package.

Key Features

  • Memory Architecture  256 Mbit SDRAM organized as 64M × 4 with 4 internal banks for concurrent row access and precharge.
  • Synchronous SDRAM Operation  Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelined operation allowing column address changes every clock cycle.
  • PC100 / PC133 Compliance  Specified as PC100- and PC133-compliant; the -7E speed grade targets 133 MHz operation with 2-2-2 timing (RCD-RP-CL) and an effective CL timing of 15 ns.
  • Programmable Burst and Refresh  Programmable burst lengths (1, 2, 4, 8 or full page) plus auto refresh and self-refresh modes; supports 8192-cycle refresh intervals as defined in the datasheet.
  • Timing and Performance  Clock frequency up to 133 MHz, typical access time 5.4 ns and write cycle time (word/page) of 14 ns for responsive read/write operations.
  • Power Supply  Single 3.3 V ±0.3 V supply (3.0–3.6 V) with LVTTL-compatible inputs and outputs.
  • Package  54-pin TSOP II (0.400", 10.16 mm width) plastic package for compact PCB implementations.
  • Operating Range  Commercial temperature grade: 0°C to +70°C (TA).

Typical Applications

  • PC100/PC133 Memory Subsystems  Use as PC100- or PC133-compliant DRAM for systems requiring synchronous parallel memory at 133 MHz.
  • Compact Board-Level Memory  54-pin TSOP II package supports compact PCB layouts where a 256 Mbit ×4 SDRAM is required.
  • 3.3 V Single-Supply Designs  Intended for systems that operate from a single 3.3 V ±0.3 V supply and need LVTTL-compatible I/O.

Unique Advantages

  • Flexible Burst and Bank Control:  Programmable burst lengths and four internal banks enable efficient, pipelined column access to improve throughput for sequential transfers.
  • PC100/PC133 Compatibility:  Designed to meet PC100 and PC133 timing grades, simplifying integration into systems targeting those clock domains.
  • Low-Latency -7E Speed Grade:  -7E speed grade provides 133 MHz operation with 2-2-2 timing (RCD-RP-CL) and a 15 ns CAS latency for accelerated read performance.
  • Standard 54-TSOP II Package:  A common 54-pin TSOP II footprint allows use in existing PCB designs and module implementations that accept 0.400" width TSOP devices.
  • Single-Supply Operation:  Operates from a single 3.3 V ±0.3 V supply, simplifying power-supply design and board-level integration.

Why Choose MT48LC64M4A2P-7E:G TR?

The MT48LC64M4A2P-7E:G TR delivers a proven SDRAM architecture—64M × 4 organization with four internal banks—combined with PC100/PC133 timing compliance and a -7E speed grade optimized for 133 MHz operation. Its compact 54-pin TSOP II package and single 3.3 V supply requirement make it suitable for designs that need standardized, synchronous parallel memory in a small footprint.

This device is appropriate for engineers specifying commercial-temperature SDRAM with deterministic timing characteristics, programmable burst operation, and standard refresh modes. The straightforward electrical and mechanical specifications support predictable integration into existing board-level memory subsystems.

Request a quote or submit an inquiry for MT48LC64M4A2P-7E:G TR to obtain pricing and availability information.

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