MTFC32GAPALGT-S1 AAT

IC FLASH 256GBIT MMC 153WFBGA
Part Description

IC FLASH 256GBIT MMC 153WFBGA

Quantity 533 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization32G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MTFC32GAPALGT-S1 AAT – IC FLASH 256GBIT MMC 153WFBGA

The MTFC32GAPALGT-S1 AAT is a non-volatile flash memory device organized as 32G × 8 (256 Gbit) using FLASH - NAND (SLC) technology. It implements an eMMC_5.1 memory interface and operates over a wide voltage range of 2.7 V to 3.6 V.

Designed for applications requiring automotive-grade storage, the device is AEC-Q100 qualified and rated for operation from -40°C to 105°C, delivering integrated storage in a compact 153-WFBGA (11.5 × 13 mm) package.

Key Features

  • Memory Architecture 256 Gbit capacity organized as 32G × 8 using FLASH - NAND (SLC) technology.
  • Interface eMMC_5.1 memory interface for standard embedded storage integration.
  • Performance 200 MHz clock frequency for the device interface.
  • Power / Voltage Operates from 2.7 V to 3.6 V to support a range of system power rails.
  • Qualification & Reliability AEC-Q100 qualification and automotive grade designation for use in qualifying applications.
  • Package & Thermal 153-WFBGA package (11.5 × 13 mm) and operating temperature range of -40°C to 105°C (TA).

Typical Applications

  • Automotive systems — AEC-Q100 qualification and the specified temperature range make the device suitable for in-vehicle storage applications that require automotive-grade components.
  • Embedded storage for controllers — eMMC_5.1 interface and compact 153-WFBGA package enable integration into embedded control modules and electronic control units.
  • High-temperature environments — Rated operation from -40°C to 105°C supports deployments where elevated ambient temperatures are expected.

Unique Advantages

  • Automotive-qualified design: AEC-Q100 qualification and automotive grade designation support use in automotive applications requiring qualified components.
  • SLC NAND technology: Uses FLASH - NAND (SLC) memory format for the specified 256 Gbit organization (32G × 8).
  • Standard eMMC_5.1 interface: Facilitates integration into systems designed around eMMC storage standards.
  • Wide operating conditions: Supports -40°C to 105°C operation and a 2.7 V–3.6 V supply range for diverse system environments.
  • Compact package: 153-WFBGA (11.5 × 13 mm) package provides a space-efficient footprint for board-level integration.
  • Defined interface timing: 200 MHz clock frequency for the device interface to match system timing requirements.

Why Choose IC FLASH 256GBIT MMC 153WFBGA?

The MTFC32GAPALGT-S1 AAT combines a 256 Gbit SLC NAND architecture with an eMMC_5.1 interface in a compact 153-WFBGA package, delivering a purpose-built solution for systems that need integrated, non-volatile storage. Its AEC-Q100 qualification, wide operating temperature range, and defined voltage and clock specifications position it for designs that require automotive-grade components and predictable integration.

This device is suitable for engineers and procurement teams specifying embedded storage for automotive and other temperature-challenged environments where an eMMC_5.1 interface, SLC technology, and AEC-Q100 qualification are required for long-term system robustness and compatibility.

Request a quote or submit a pricing inquiry to check availability and get lead-time information for MTFC32GAPALGT-S1 AAT.

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