MTFC32GAPALBH-IT
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 367 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-IT – IC FLASH 256GBIT MMC 153TFBGA
The MTFC32GAPALBH-IT is a 256 Gbit non-volatile NAND flash memory device in the e•MMC™ family, delivered in a 153‑TFBGA package. It provides MMC interface connectivity and a 32G × 8 memory organization for high-density embedded flash storage.
This device is specified for operation from -40°C to 85°C and supports a 2.7 V to 3.6 V supply range, making it suitable for designs that require compact, high-capacity MMC flash memory in a standardized package.
Key Features
- Memory Type & Technology Non-volatile FLASH memory based on NAND technology for persistent data storage.
- Capacity & Organization 256 Gbit total capacity with a 32G × 8 memory organization to deliver dense on-board storage.
- Interface MMC memory interface for embedded storage applications that use the MMC protocol.
- Voltage Supply Operates from 2.7 V to 3.6 V, supporting standard MMC power rails.
- Package 153‑TFBGA package (11.5 × 13 mm) for space-efficient, board-mounted integration.
- Operating Temperature Industrial temperature range of -40°C to 85°C to support a wide range of operating environments.
Typical Applications
- Embedded Storage Use where MMC interface flash memory and 256 Gbit capacity are required for on-board data retention.
- Compact Board Designs The 153‑TFBGA (11.5 × 13 mm) package enables high-density storage in space-constrained layouts.
- Temperature-Sensitive Systems Suitable for systems that require operation across -40°C to 85°C using a 2.7 V to 3.6 V supply.
Unique Advantages
- High-density storage: 256 Gbit capacity provides substantial non-volatile memory in a single device.
- MMC interface compatibility: Standard MMC interface simplifies integration into MMC-based designs.
- Industrial temperature support: Rated for -40°C to 85°C to address a broad range of operating conditions.
- Compact package footprint: 153‑TFBGA (11.5 × 13 mm) reduces board area while retaining high capacity.
- Flexible power range: 2.7 V to 3.6 V operation aligns with common system power rails.
Why Choose IC FLASH 256GBIT MMC 153TFBGA?
The MTFC32GAPALBH-IT combines a large 256 Gbit NAND flash array with the e•MMC™ MMC interface and an industry-temperature rating, providing a straightforward solution for embedded designs that need high-capacity, board-mounted non-volatile storage. Its 153‑TFBGA package and standard voltage window support compact assemblies and common power architectures.
This device is appropriate for projects seeking a balance of storage density, package efficiency, and environmental range, enabling scalable integration of MMC flash memory into system designs.
Request a quote or submit a quotation inquiry for MTFC32GAPALBH-IT to receive pricing and availability information for your design and procurement needs.
