MTFC32GAPALBH-AIT ES TR
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 705 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-AIT ES TR – 256 Gbit e•MMC NAND Flash, 153‑TFBGA
The MTFC32GAPALBH-AIT ES TR is a 256 Gbit non-volatile memory device implemented in NAND flash technology and presented in Micron's e•MMC™ series. It provides a 32G × 8 memory organization with an MMC memory interface for integration into systems that require onboard flash storage.
The device is supplied in a 153‑TFBGA package (11.5 × 13 mm) and is specified for operation across a −40°C to 85°C ambient temperature range, enabling deployment in systems that require that thermal range.
Key Features
- Memory Technology Non‑volatile FLASH implemented using NAND technology to provide persistent storage.
- Memory Capacity & Organization 256 Gbit total capacity arranged as 32G × 8 to support large onboard storage requirements within an MMC form factor.
- Memory Interface MMC interface (e•MMC series) for host connectivity and integration into MMC‑based system architectures.
- Package 153‑TFBGA package with dimensions 11.5 × 13 mm, suitable for BGA assembly processes.
- Operating Temperature Range Specified for −40°C to 85°C (TA), accommodating applications that require wide ambient temperature operation.
Typical Applications
- Embedded Storage Onboard non‑volatile storage for systems that use an MMC interface and require high capacity flash memory.
- Firmware and System Boot Storage of firmware, system images, or boot code where NAND flash persistence and MMC connectivity are required.
- Temperature‑Varied Environments Systems operating across −40°C to 85°C that need a flash memory solution rated for that ambient range.
Unique Advantages
- High Capacity Onboard Flash: 256 Gbit memory size supports large data storage and image retention within a single e•MMC device.
- MMC Interface Compatibility: e•MMC interface simplifies integration into MMC‑based host designs without inventing custom storage interfaces.
- Compact BGA Package: 153‑TFBGA (11.5 × 13 mm) offers a standardized footprint for surface‑mount installation and dense system layouts.
- NAND Flash Persistence: FLASH‑NAND technology provides non‑volatile data retention for firmware and data storage needs.
- Wide Operating Temperature: Rated −40°C to 85°C to accommodate applications with broad ambient temperature requirements.
- Part of Micron e•MMC™ Series: Identified as a member of Micron Technology Inc.'s e•MMC family to aid consistent selection for MMC‑based designs.
Why Choose IC FLASH 256GBIT MMC 153TFBGA?
The MTFC32GAPALBH-AIT ES TR positions itself as a high‑capacity, MMC‑interface NAND flash device suitable for systems that require significant onboard non‑volatile storage within a compact BGA footprint. Its 256 Gbit capacity, 32G × 8 organization, and e•MMC interface make it a straightforward choice for designers targeting MMC‑based storage implementations.
With a 153‑TFBGA package and an operating range of −40°C to 85°C, this product addresses designs that need a standardized package and capability across a wide ambient temperature span while remaining within Micron Technology Inc.'s e•MMC series offering.
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