MTFC32GAPALBH-AIT ES
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 462 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-AIT ES – IC FLASH 256GBIT MMC 153TFBGA
The MTFC32GAPALBH-AIT ES from Micron Technology Inc. is a 256 Gbit non-volatile NAND flash memory device implemented in an MMC memory interface. It is organized as 32G × 8 and is offered in a 153-TFBGA package (11.5 × 13 mm).
This device is intended for designs that require high-density, non-volatile flash storage with an MMC interface and supports operation across a temperature range of −40 °C to 85 °C.
Key Features
- Memory Type Non-volatile NAND flash memory providing persistent data storage.
- Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 to describe the device memory array layout.
- Interface MMC memory interface for system integration using the MMC protocol.
- Package 153-TFBGA package (11.5 × 13 mm) offering a compact footprint for board-level mounting.
- Operating Temperature Rated for −40 °C to 85 °C (TA), supporting deployment in environments that require this temperature range.
- Manufacturer & Series Supplied by Micron Technology Inc., part of the e•MMC™ series.
Typical Applications
- Embedded storage Use as onboard non-volatile storage where an MMC interface and high capacity are required.
- Firmware and OS storage Storage for firmware, boot images, and operating system components in embedded devices.
- Industrial equipment Suitable for systems that need non-volatile flash operation across the specified −40 °C to 85 °C temperature range.
Unique Advantages
- High density — 256 Gbit: Provides large on-board storage capacity in a single device.
- MMC interface compatibility: Simplifies integration into systems that use the MMC memory interface.
- Compact 153-TFBGA package: Small 11.5 × 13 mm footprint aids space-constrained PCB layouts.
- NAND flash technology: Implements FLASH - NAND for non-volatile data retention.
- Wide operating temperature: Rated from −40 °C to 85 °C for deployment in temperature-sensitive applications.
- Clear memory organization: 32G × 8 organization provides a defined layout for system memory planning.
Why Choose MTFC32GAPALBH-AIT ES?
The MTFC32GAPALBH-AIT ES combines 256 Gbit of NAND flash density with an MMC interface in a compact 153-TFBGA package, offering a straightforward non-volatile storage option for embedded designs. Its specified operating temperature range of −40 °C to 85 °C supports use in environments requiring that thermal range.
As a Micron Technology Inc. e•MMC™ series device, it is suited to designers seeking a high-capacity, board-mounted flash memory component with defined organization and package attributes for integration into embedded systems.
Request a quote or contact sales to inquire about pricing, availability, and to submit a purchase or volume quote request for the MTFC32GAPALBH-AIT ES.
