MTFC32GAPALBH-AAT
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 263 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-AAT – IC FLASH 256GBIT MMC 153TFBGA
The MTFC32GAPALBH-AAT is a non-volatile NAND flash memory device in the e•MMC™ series, providing 256 Gbit of FLASH storage organized as 32G × 8. It implements a memory interface based on MMC and is supplied in a 153‑TFBGA package (11.5 × 13 mm).
This device is intended for designs that require high-density NAND FLASH storage in a compact BGA footprint and a wide operating temperature range of −40°C to 105°C.
Key Features
- Memory Type Non-volatile FLASH memory using NAND technology for persistent data retention.
- Capacity & Organization 256 Gbit total capacity organized as 32G × 8 for byte-oriented access patterns.
- Interface MMC memory interface for integration with MMC-compatible hosts and controllers.
- Package 153‑TFBGA package, dimensions 11.5 × 13 mm, suitable for surface-mount PCB assembly.
- Operating Temperature Specified operating range from −40°C to 105°C (TA) for use in temperature-variable environments.
Typical Applications
- Embedded storage systems Provides non-volatile MMC-format storage capacity in compact system designs.
- Consumer electronics Fits space-constrained devices requiring high-density FLASH in a BGA package.
- Industrial equipment Supports systems operating across a wide temperature range where persistent data storage is required.
Unique Advantages
- High storage density: 256 Gbit capacity delivers substantial FLASH storage within a single device.
- Byte-oriented organization: 32G × 8 organization supports byte-level access patterns for MMC-based designs.
- Compact BGA footprint: 153‑TFBGA (11.5 × 13 mm) package minimizes board area while enabling surface-mount assembly.
- Wide operating range: Rated for −40°C to 105°C (TA), accommodating temperature-variable deployment.
- MMC interface: Standard MMC connectivity simplifies integration with MMC-capable hosts and controllers.
Why Choose IC FLASH 256GBIT MMC 153TFBGA?
The MTFC32GAPALBH-AAT combines high-density NAND FLASH with an MMC interface in a compact 153‑TFBGA package, making it a practical choice for designs that need significant non-volatile storage without a large board footprint. Its 32G × 8 organization and 256 Gbit capacity provide ample storage for data-intensive embedded applications.
With an operating temperature range from −40°C to 105°C, this device is suited for environments with challenging thermal conditions. Choose this component when you require a verified NAND FLASH solution with MMC connectivity and a space-efficient BGA package.
If you would like pricing or availability information, request a quote or submit a request to sales for the MTFC32GAPALBH-AAT.
