MTFC32GAMAKAM-WT TR
| Part Description |
IC FLASH 256GBIT MMC 153VFBGA |
|---|---|
| Quantity | 1,174 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MTFC32GAMAKAM-WT TR – IC FLASH 256GBIT MMC 153VFBGA
The MTFC32GAMAKAM-WT TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ family. It provides high-density embedded storage organized as 32G × 8 and uses an MMC memory interface for integration into systems that support e•MMC architecture.
Designed for applications requiring onboard flash storage within an operating temperature range of −25°C to 85°C (TA), this device offers a compact package option as indicated by the 153VFBGA designation in the product name.
Key Features
- Memory Technology FLASH - NAND non-volatile memory for persistent data storage.
- Memory Organization 32G × 8 organization suitable for byte-wide data access and system integration.
- Capacity 256 Gbit memory size for high-density embedded storage requirements.
- Interface MMC memory interface, compatible with e•MMC™ architecture for straightforward system integration.
- Series and Manufacturer Part of the e•MMC™ series by Micron Technology Inc., carrying the MTFC32GAMAKAM-WT TR identifier.
- Operating Temperature Specified operating range of −25°C to 85°C (TA) for use across a range of ambient conditions.
- Package Type 153VFBGA package as reflected in the product name for compact board-level deployment.
Typical Applications
- Embedded Storage — Use as onboard flash memory in systems that implement an MMC/e•MMC interface for program and data storage.
- Firmware and OS Storage — Suitable for storing firmware, operating system images, and large data sets where a 256 Gbit capacity is required.
- Industrial and Commercial Devices — Applicable in devices operating within the specified −25°C to 85°C temperature window where e•MMC storage is needed.
Unique Advantages
- High Capacity in a Compact Form: 256 Gbit density provides substantial storage without increasing board footprint.
- Standard MMC Interface: e•MMC MMC interface simplifies integration into systems designed for MMC-based embedded storage.
- Byte-Accessible Organization: 32G × 8 memory organization supports byte-wide data handling and straightforward memory mapping.
- Wide Operating Temperature Range: Rated for −25°C to 85°C (TA), enabling use across diverse ambient conditions.
- Proven Flash Technology: NAND flash provides persistent, non-volatile storage suitable for firmware and large data sets.
Why Choose IC FLASH 256GBIT MMC 153VFBGA?
The MTFC32GAMAKAM-WT TR combines high-density 256 Gbit NAND flash with e•MMC™ MMC interface compatibility, delivering a compact embedded storage option for systems that require significant onboard memory. Its 32G × 8 organization and specified operating temperature range of −25°C to 85°C make it suitable for a range of designs that use MMC-based storage architectures.
This device is appropriate for engineers and procurement teams specifying high-capacity, non-volatile memory from Micron Technology Inc. where e•MMC form factor and MMC interface support are design requirements.
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