MTFC32GAKAENA-4M IT TR
| Part Description |
IC FLASH 256GBIT MMC 100TBGA |
|---|---|
| Quantity | 1,347 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAENA-4M IT TR – IC FLASH 256GBIT MMC 100TBGA
The MTFC32GAKAENA-4M IT TR is a 256 Gbit non-volatile NAND flash memory device in an e•MMC™ form factor. It implements a 32G × 8 memory organization and uses the MMC interface for embedded storage applications.
With a compact 100‑TBGA (14 × 18) package and an operating temperature range of −40°C to 85°C (TA), this device is aimed at designs that require high-density flash storage in a small package footprint.
Key Features
- Memory Type Non-volatile NAND flash storage suited for persistent data retention.
- Capacity 256 Gbit memory size provides high-density storage in a single device.
- Memory Organization 32G × 8 organization for an 8-bit memory bus configuration.
- Interface MMC memory interface for embedded multimedia card-compatible systems.
- Package 100‑TBGA (14 × 18) supplier device package for compact board-level integration.
- Operating Temperature Rated for −40°C to 85°C (TA) to support a broad range of ambient conditions.
- Series and Manufacturer Part of the e•MMC™ series from Micron Technology Inc., identified as MTFC32GAKAENA-4M IT TR.
Typical Applications
- MMC-based embedded storage Use as onboard flash storage where an MMC interface is required for system-level memory.
- Space-constrained designs Applications that benefit from the 100‑TBGA (14 × 18) package to minimize PCB area.
- Environments with wide temperature requirements Systems that operate within −40°C to 85°C and require reliable data retention.
Unique Advantages
- High-density capacity: 256 Gbit of NAND flash enables substantial storage in a single device.
- Compact package: 100‑TBGA (14 × 18) package simplifies placement in tight board layouts.
- MMC interface compatibility: Direct MMC interface support reduces the need for additional bridging components.
- Wide operating temperature: −40°C to 85°C rating supports applications across a broad ambient range.
- Established manufacturer: Supplied by Micron Technology Inc., aligning the device with a recognized memory supplier.
Why Choose IC FLASH 256GBIT MMC 100TBGA?
The IC FLASH 256GBIT MMC 100TBGA (MTFC32GAKAENA-4M IT TR) offers a combination of high storage density, MMC interface compatibility, and a compact 100‑TBGA package, making it suitable for embedded systems that require significant onboard flash in a small footprint. Its −40°C to 85°C operating range supports deployment in environments with varied temperature requirements.
Designed for engineers and procurement teams seeking a Micron-sourced e•MMC™ NAND solution, this device provides capacity and package options that address space-constrained board designs while maintaining non-volatile storage characteristics.
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